Tungsten [W] as principal constituent

Industry

CPC
H01L2224/29384

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29384Tungsten [W] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Member connection method and adhesive tape
- Patent number 11,342,303
- Issue date May 24, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Tetsuyuki Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering pastes with high metal loading for semiconductor die atta...
- Patent number 10,727,193
- Issue date Jul 28, 2020
- Ormet Circuits, Inc.
- Catherine Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit component and method of making the same
- Patent number 9,019,714
- Issue date Apr 28, 2015
- Hitachi Chemical Company, Ltd.
- Kazuya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive bonding material, method of bonding with th...
- Patent number 8,840,811
- Issue date Sep 23, 2014
- Hitachi Chemical Company, Ltd.
- Yuusuke Yasuda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,614,517
- Issue date Dec 24, 2013
- Sony Corporation
- Hirohisa Yasukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device having metal comprising self-healing die...
- Patent number 8,378,506
- Issue date Feb 19, 2013
- Texas Instruments Incorporated
- James C Wainerdi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit connection structure, method for producing the same and sem...
- Patent number 8,148,204
- Issue date Apr 3, 2012
- Hitachi Chemical DuPont Microsystems, Ltd.
- Yuichi Kaneya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged electronic device having metal comprising self-healing die...
- Patent number 7,972,905
- Issue date Jul 5, 2011
- Texas Instruments Incorporated
- James C. Wainerdi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive adhesive agent with ultrafine particles
- Patent number 7,262,511
- Issue date Aug 28, 2007
- Harima Chemicals, Inc.
- Katsuhisa Osako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of production of semiconductor device
- Patent number 6,223,429
- Issue date May 1, 2001
- Hitachi Chemical Company, Ltd.
- Aizou Kaneda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
- Publication number 20220246510
- Publication date Aug 4, 2022
- HYPERTAC S.P.A.
- Alessandro Bosca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER CONNECTION METHOD AND ADHESIVE TAPE
- Publication number 20210074674
- Publication date Mar 11, 2021
- Hitachi Chemical Company, Ltd.
- Tetsuyuki SHIRAKAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MAGNETIC CONTACTS FOR ELECTRONICS APPLICATIONS
- Publication number 20140205851
- Publication date Jul 24, 2014
- Ravindranath V. MAHAJAN
- B32 - LAYERED PRODUCTS
Information Patent Application
CIRCUIT COMPONENT AND METHOD OF MAKING THE SAME
- Publication number 20130120948
- Publication date May 16, 2013
- HITACHI CHEMICAL CO., Ltd.
- Kazuya Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120119372
- Publication date May 17, 2012
- SONY CORPORATION
- Hirohisa Yasukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING MATERIAL, SINTERED BOND AND METHOD FOR PRODUCING A SINTER...
- Publication number 20120003465
- Publication date Jan 5, 2012
- Martin Rittner
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Packaged Electronic Device Having Metal Comprising Self-Healing Die...
- Publication number 20110227233
- Publication date Sep 22, 2011
- TEXAS INSTRUMENTS INCORPORATED
- JAMES C. WAINERDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE BONDING MATERIAL, METHOD OF BONDING WITH TH...
- Publication number 20100270515
- Publication date Oct 28, 2010
- Yuusuke YASUDA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PACKAGED ELECTRONIC DEVICE HAVING METAL COMPRISING SELF-HEALING...
- Publication number 20100264553
- Publication date Oct 21, 2010
- TEXAS INSTRUMENTS INCORPORATED
- JAMES C. WAINERDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT CONNECTION STRUCTURE, METHOD FOR PRODUCING THE SAME AND SEM...
- Publication number 20090189254
- Publication date Jul 30, 2009
- Hitachi Chemical DuPont MicroSystems, Ltd.
- Yuichi Kaneya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive adhesive agent and process for manufacturing article usi...
- Publication number 20060038304
- Publication date Feb 23, 2006
- HARIMA CHEMICALS, INC.
- Katsuhisa Osako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder composition for high temperature semiconductor device
- Publication number 20020012609
- Publication date Jan 31, 2002
- International Rectifier Corporation
- Peter R. Ewer
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Tungsten [W] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Alternative compositions for high temperature soldering applications

Sintering materials and attachment methods using same

Member connection method and adhesive tape

Sintering pastes with high metal loading for semiconductor die atta...

Circuit component and method of making the same

Electrically conductive bonding material, method of bonding with th...

Semiconductor device and method of manufacturing the same

Packaged electronic device having metal comprising self-healing die...

Circuit connection structure, method for producing the same and sem...

Packaged electronic device having metal comprising self-healing die...

Conductive adhesive agent with ultrafine particles

Method of production of semiconductor device

Patents Applicationslast 30 patents

OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE

MEMBER CONNECTION METHOD AND ADHESIVE TAPE

MAGNETIC CONTACTS FOR ELECTRONICS APPLICATIONS

CIRCUIT COMPONENT AND METHOD OF MAKING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SINTERING MATERIAL, SINTERED BOND AND METHOD FOR PRODUCING A SINTER...

Packaged Electronic Device Having Metal Comprising Self-Healing Die...

ELECTRICALLY CONDUCTIVE BONDING MATERIAL, METHOD OF BONDING WITH TH...

PACKAGED ELECTRONIC DEVICE HAVING METAL COMPRISING SELF-HEALING...

CIRCUIT CONNECTION STRUCTURE, METHOD FOR PRODUCING THE SAME AND SEM...

Conductive adhesive agent and process for manufacturing article usi...

Solder composition for high temperature semiconductor device