Membership
Tour
Register
Log in
Tungsten [W] as principal constituent
Follow
Industry
CPC
H01L2224/05384
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/05384
Tungsten [W] as principal constituent
Industries
Overview
Organizations
People
Information
Impact
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20230091325
Publication date
Mar 23, 2023
Kabushiki Kaisha Toshiba
Emiko INOUE
H01 - BASIC ELECTRIC ELEMENTS