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Two-layer stack coating
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CPC
H01L2224/37572
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/37572
Two-layer stack coating
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last 30 patents
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Patent Grant
Connection member with bulk body and electrically and thermally con...
Patent number
10,366,946
Issue date
Jul 30, 2019
Infineon Technologies AG
Wu Hu Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of double patterning lithography process using plurality of...
Patent number
10,170,306
Issue date
Jan 1, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Ju Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device using diffusion soldering
Patent number
8,975,117
Issue date
Mar 10, 2015
Infineon Technologies AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Connection member with bulk body and electrically and thermally con...
Publication number
20190131218
Publication date
May 2, 2019
INFINEON TECHNOLOGIES AG
Wu Hu LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Double Patterning Lithography Process Using Plurality of...
Publication number
20170221702
Publication date
Aug 3, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Ju Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device Using Diffusion Soldering
Publication number
20130200532
Publication date
Aug 8, 2013
INFINEON TECHNOLOGIES AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS