Types of components

Industry

CPC
H05K2201/10007

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10007Types of components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electrode structure
- Patent number 12,014,868
- Issue date Jun 18, 2024
- Cyntec Co., Ltd.
- Yi-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded substrate, metal circuit board, and circuit board
- Patent number 11,497,125
- Issue date Nov 8, 2022
- DENKA COMPANY LIMITED
- Yuta Tsugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component
- Patent number 11,357,110
- Issue date Jun 7, 2022
- TDK Corporation
- Takeshi Oohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with antenna
- Patent number 11,264,700
- Issue date Mar 1, 2022
- Samsung Electronics Co., Ltd.
- Seunggil Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat transfer in the printed circuit board of an SMPS by an integra...
- Patent number 11,224,117
- Issue date Jan 11, 2022
- Flex Ltd.
- Magnus Karlsson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure including circuit body and conductive body
- Patent number 11,166,382
- Issue date Nov 2, 2021
- Yazaki Corporation
- Yoshiaki Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,999,937
- Issue date May 4, 2021
- Omron Corporation
- Satoru Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and power module
- Patent number 10,985,719
- Issue date Apr 20, 2021
- Mitsubishi Electric Corporation
- Jun Tomisawa
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Printed wiring board
- Patent number 10,973,130
- Issue date Apr 6, 2021
- FANUC CORPORATION
- Shinichirou Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rotary electric machine
- Patent number 10,862,375
- Issue date Dec 8, 2020
- SPAL Automotive S.R.L.
- Pietro De Filippis
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electrical contact terminal
- Patent number 10,439,306
- Issue date Oct 8, 2019
- Molex, LLC
- Jang Bum Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part embedded substrate and method of producing an elect...
- Patent number 10,134,680
- Issue date Nov 20, 2018
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing portable data carriers
- Patent number 10,015,886
- Issue date Jul 3, 2018
- GIESECKE+DEVRIENT MOBILE SECURITY GMBH
- Thomas Tarantino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board with embedded electronic component and manufa...
- Patent number 9,999,131
- Issue date Jun 12, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kyung-Hwan Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 9,972,599
- Issue date May 15, 2018
- Phoenix Pioneer Technology Co., Ltd.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and method for supplying reinforcing resin material
- Patent number 9,955,604
- Issue date Apr 24, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Seiji Tokii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part embedded substrate and method of producing an elect...
- Patent number 9,768,122
- Issue date Sep 19, 2017
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency component and high-frequency module including the same
- Patent number 9,743,519
- Issue date Aug 22, 2017
- Murata Manufacturing Co., Ltd.
- Kiyofumi Takai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Drive unit
- Patent number 9,723,755
- Issue date Aug 1, 2017
- Kone Corporation
- Pasi Raassina
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Graphene mounted on aerogel
- Patent number 9,721,726
- Issue date Aug 1, 2017
- Elwha LLC
- Jeffrey A. Bowers
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Integrated circuit and method that utilize a shape memory material
- Patent number 9,635,764
- Issue date Apr 25, 2017
- Intel Corporation
- Shipeng Qiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component-embedded module and communication terminal device
- Patent number 9,596,764
- Issue date Mar 14, 2017
- Murata Manufacturing Co., Ltd.
- Naoki Gouchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 9,451,702
- Issue date Sep 20, 2016
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device comprising a substrate board equipped with a loca...
- Patent number 9,420,685
- Issue date Aug 16, 2016
- STMicroelectronics (Grenoble 2) SAS
- Jean-Michel Riviere
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antenna array feeding structure having circuit boards connected by...
- Patent number 9,408,306
- Issue date Aug 2, 2016
- Honeywell International Inc.
- Nan Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tear-proof circuit
- Patent number 9,226,393
- Issue date Dec 29, 2015
- STMicroelectronics (Rousset) SAS
- Francis Steffen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 8,793,868
- Issue date Aug 5, 2014
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Graphene mounted on aerogel
- Patent number 8,593,783
- Issue date Nov 26, 2013
- Elwha LLC
- Jeffrey A. Bowers
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 7,989,707
- Issue date Aug 2, 2011
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
POWER DEVICE EMBEDDED PRINTED CIRCUIT BOARD ASSEMBLIES WITH THIN FI...
- Publication number 20240290687
- Publication date Aug 29, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE, METHOD FOR PRODUCING A CARRIER STRUCTURE AND DEV...
- Publication number 20240244760
- Publication date Jul 18, 2024
- ams-OSRAM International GmbH
- Thomas Schwarz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20240098912
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Jinhwan JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VGA MONITOR EMULATING PRINTED CIRCUIT BOARD
- Publication number 20240064903
- Publication date Feb 22, 2024
- Alcon Inc.
- Horst Keiler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MALEIMIDE RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED BOARD,...
- Publication number 20240032209
- Publication date Jan 25, 2024
- Chihiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE, CHIP, CIRCUIT PACKAGE AND FABRICATION PROCESS
- Publication number 20230262906
- Publication date Aug 17, 2023
- Alibaba (China) Co., Ltd.
- Hui LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...
- Publication number 20230217599
- Publication date Jul 6, 2023
- Murata Manufacturing Co., Ltd.
- Toru Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STEPPED PACKAGE AND RECESSED CIRCUIT BOARD
- Publication number 20220110214
- Publication date Apr 7, 2022
- Intel Corporation
- Martin M. Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRODE STRUCTURE
- Publication number 20220052424
- Publication date Feb 17, 2022
- CYNTEC CO., LTD.
- YI-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SUBSTRATE, METAL CIRCUIT BOARD, AND CIRCUIT BOARD
- Publication number 20220039264
- Publication date Feb 3, 2022
- DENKA COMPANY LIMITED
- Yuta TSUGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20210204406
- Publication date Jul 1, 2021
- TDK Corporation
- Takeshi OOHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE INCLUDING CIRCUIT BODY AND CONDUCTIVE BODY
- Publication number 20210136925
- Publication date May 6, 2021
- YAZAKI CORPORATION
- Yoshiaki Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE AND POWER MODULE
- Publication number 20200274505
- Publication date Aug 27, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Jun TOMISAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE WITH ANTENNA
- Publication number 20200203802
- Publication date Jun 25, 2020
- Samsung Electronics Co., Ltd.
- Seunggil JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE COMPONENT
- Publication number 20190363031
- Publication date Nov 28, 2019
- Murata Manufacturing Co., Ltd.
- Koji KAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20190364673
- Publication date Nov 28, 2019
- FANUC CORPORATION
- Shinichirou Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20190343007
- Publication date Nov 7, 2019
- Omron Corporation
- Satoru Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROTARY ELECTRIC MACHINE
- Publication number 20190207486
- Publication date Jul 4, 2019
- SPAL AUTOMOTIVE S.r.l.
- Pietro De Filippis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONTACT TERMINAL
- Publication number 20190020129
- Publication date Jan 17, 2019
- Molex, LLC
- Jang Bum Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180261578
- Publication date Sep 13, 2018
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...
- Publication number 20170365559
- Publication date Dec 21, 2017
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRED CIRCUIT BOARD
- Publication number 20170229635
- Publication date Aug 10, 2017
- Nitto Denko Corporation
- Takahiro TAKANO
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUIT AND METHOD THAT UTILIZE A SHAPE MEMORY MATERIAL
- Publication number 20170094799
- Publication date Mar 30, 2017
- Shipeng Qiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GRAPHENE MOUNTED ON AEROGEL
- Publication number 20160203910
- Publication date Jul 14, 2016
- Elwha LLC
- Jeffrey A. Bowers
- B32 - LAYERED PRODUCTS
Information Patent Application
CIRCUIT BOARD ASSEMBLY WITH HIGH AND LOW FREQUENCY SUBSTRATES
- Publication number 20160197400
- Publication date Jul 7, 2016
- Delphi Technologies, Inc.
- DAVID W. ZIMMERMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Portable Data Carriers
- Publication number 20160120036
- Publication date Apr 28, 2016
- Giesecke & Devrient GmbH
- Thomas TARANTINO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DRIVE UNIT
- Publication number 20160120069
- Publication date Apr 28, 2016
- KONE Corporation
- Pasi RAASSINA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSCEIVER MODULE AND COMMUNICATION APPARATUS INCLUDING THE SAME
- Publication number 20160094258
- Publication date Mar 31, 2016
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Hyun-cheol BAE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HIGH-FREQUENCY COMPONENT AND HIGH-FREQUENCY MODULE INCLUDING THE SAME
- Publication number 20160037640
- Publication date Feb 4, 2016
- Murata Manufacturing Co., Ltd.
- Kiyofumi TAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER WIRING BOARD
- Publication number 20160037630
- Publication date Feb 4, 2016
- FUJIKURA LTD.
- Masahiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Types of components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrode structure

Bonded substrate, metal circuit board, and circuit board

Electronic component

Electronic device with antenna

Heat transfer in the printed circuit board of an SMPS by an integra...

Connection structure including circuit body and conductive body

Electronic device

Electronic module and power module

Printed wiring board

Rotary electric machine

Electrical contact terminal

Electronic part embedded substrate and method of producing an elect...

Method for producing portable data carriers

Printed circuit board with embedded electronic component and manufa...

Package structure and method of manufacturing the same

Mounting structure and method for supplying reinforcing resin material

Electronic part embedded substrate and method of producing an elect...

High-frequency component and high-frequency module including the same

Drive unit

Graphene mounted on aerogel

Integrated circuit and method that utilize a shape memory material

Electronic component-embedded module and communication terminal device

Chip embedded substrate and method of producing the same

Electronic device comprising a substrate board equipped with a loca...

Antenna array feeding structure having circuit boards connected by...

Tear-proof circuit

Chip embedded substrate and method of producing the same

Graphene mounted on aerogel

Chip embedded substrate and method of producing the same

Patents Applicationslast 30 patents

POWER DEVICE EMBEDDED PRINTED CIRCUIT BOARD ASSEMBLIES WITH THIN FI...

CARRIER STRUCTURE, METHOD FOR PRODUCING A CARRIER STRUCTURE AND DEV...

CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME

VGA MONITOR EMULATING PRINTED CIRCUIT BOARD

MALEIMIDE RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED BOARD,...

SUBSTRATE, CHIP, CIRCUIT PACKAGE AND FABRICATION PROCESS

ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...

STEPPED PACKAGE AND RECESSED CIRCUIT BOARD

ELECTRODE STRUCTURE

BONDED SUBSTRATE, METAL CIRCUIT BOARD, AND CIRCUIT BOARD

ELECTRONIC COMPONENT

CONNECTION STRUCTURE INCLUDING CIRCUIT BODY AND CONDUCTIVE BODY

ELECTRONIC MODULE AND POWER MODULE

ELECTRONIC DEVICE WITH ANTENNA

MODULE COMPONENT

PRINTED WIRING BOARD

ELECTRONIC DEVICE

ROTARY ELECTRIC MACHINE

ELECTRICAL CONTACT TERMINAL

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...

WIRED CIRCUIT BOARD

INTEGRATED CIRCUIT AND METHOD THAT UTILIZE A SHAPE MEMORY MATERIAL

GRAPHENE MOUNTED ON AEROGEL

CIRCUIT BOARD ASSEMBLY WITH HIGH AND LOW FREQUENCY SUBSTRATES

Method for Producing Portable Data Carriers

DRIVE UNIT

TRANSCEIVER MODULE AND COMMUNICATION APPARATUS INCLUDING THE SAME

HIGH-FREQUENCY COMPONENT AND HIGH-FREQUENCY MODULE INCLUDING THE SAME

MULTI-LAYER WIRING BOARD