Ultrasonic bonding

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H01L2224/83205

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83205Ultrasonic bonding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display device including connection pad part and electronic compone...
- Patent number 12,057,430
- Issue date Aug 6, 2024
- Samsung Display Co., Ltd.
- Jungyun Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and manufacturing method for same
- Patent number 11,776,943
- Issue date Oct 3, 2023
- Samsung Display Co., Ltd.
- Hyun A Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,134,572
- Issue date Sep 28, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an integral join and automatic placement machine
- Patent number 11,081,464
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Nicolas Heuck
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bond pad reliability of semiconductor devices
- Patent number 10,892,239
- Issue date Jan 12, 2021
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ramasamy Chockalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
- Patent number 10,763,192
- Issue date Sep 1, 2020
- STMicroelectronics S.r.l.
- Dario Vitello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter-connection of a lead frame with a passive component intermedi...
- Patent number 10,727,168
- Issue date Jul 28, 2020
- NXP B.V.
- Bodin Kasemset
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor component and a semiconduc...
- Patent number 10,658,187
- Issue date May 19, 2020
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,636,762
- Issue date Apr 28, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takatoshi Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer printing using ultrasound
- Patent number 10,249,520
- Issue date Apr 2, 2019
- INNOVASONIC, Inc.
- Boris Kobrin
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Electronic device and method for producing an electronic device
- Patent number 10,147,696
- Issue date Dec 4, 2018
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for power semiconductor device, and power semi...
- Patent number 10,096,570
- Issue date Oct 9, 2018
- Mitsubishi Electric Corporation
- Yutaka Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic particle paste, cured product using same, and semiconducto...
- Patent number 10,086,478
- Issue date Oct 2, 2018
- Kabushiki Kaisha Toshiba
- Daisuke Hiratsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Jointed body, method for manufacturing same and jointed member
- Patent number 9,821,406
- Issue date Nov 21, 2017
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Tadashi Oshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor manufacturing method and associated semiconductor man...
- Patent number 9,704,820
- Issue date Jul 11, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed circuit boards
- Patent number 9,648,720
- Issue date May 9, 2017
- Semblant Global Limited
- Frank Ferdinandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing a semiconductor d...
- Patent number 9,613,930
- Issue date Apr 4, 2017
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded processed semiconductor structures and carriers
- Patent number 9,553,014
- Issue date Jan 24, 2017
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,484,294
- Issue date Nov 1, 2016
- Mitsubishi Electric Corporation
- Yutaka Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and configuration for manufacturing flip chip contact (FCC)...
- Patent number 9,337,132
- Issue date May 10, 2016
- Alpha and Omega Semiconductor Incorporated
- Ming Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-formed via array for integrated circuit package
- Patent number 9,064,718
- Issue date Jun 23, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Kesvakumar V. C. Muniandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 9,018,664
- Issue date Apr 28, 2015
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding of chips on wafers
- Patent number 8,927,335
- Issue date Jan 6, 2015
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for bonding electrical devices using an electrica...
- Patent number 8,833,418
- Issue date Sep 16, 2014
- The Hong Kong Polytechnic University
- Derek Siu Wing Or
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding method and metal bonded structure
- Patent number 8,814,029
- Issue date Aug 26, 2014
- Sanyo Electric Co., LTD
- Yasuyuki Yanase
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 8,642,392
- Issue date Feb 4, 2014
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 8,603,864
- Issue date Dec 10, 2013
- Infineon Technologies AG
- Edmund Riedl
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Power semiconductor arrangement and method for producing a power se...
- Patent number 8,586,420
- Issue date Nov 19, 2013
- Infineon Technologies AG
- Thilo Stolze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for attaching a metal surface to a carrier, a method for att...
- Patent number 8,569,109
- Issue date Oct 29, 2013
- Infineon Technologies AG
- Manfred Mengel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD
- Publication number 20240234366
- Publication date Jul 11, 2024
- NHK Spring Co., Ltd.
- Ryo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD
- Publication number 20240136325
- Publication date Apr 25, 2024
- NHK Spring Co., Ltd.
- Ryo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAG...
- Publication number 20230326948
- Publication date Oct 12, 2023
- Samsung Electronics Co., Ltd.
- Wenjun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20220216177
- Publication date Jul 7, 2022
- JUNGYUN JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD FOR SAME
- Publication number 20220013517
- Publication date Jan 13, 2022
- SAMSUNG DISPLAY CO., LTD.
- HYUN A LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD RELIABILITY OF SEMICONDUCTOR DEVICES
- Publication number 20210013166
- Publication date Jan 14, 2021
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- RAMASAMY CHOCKALINGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190035762
- Publication date Jan 31, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- Takatoshi ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER PRINTING USING ULTRASOUND
- Publication number 20180358246
- Publication date Dec 13, 2018
- Innovasonic, Inc.
- Boris Kobrin
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
Circuit board structure and method for manufacturing a circuit boar...
- Publication number 20170071061
- Publication date Mar 9, 2017
- GE EMBEDDED ELECTRONICS OY
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing the Same
- Publication number 20160133712
- Publication date May 12, 2016
- Mitsubishi Electric Corporation
- Yutaka YONEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CONNECTING CONNECTION ELEMENTS TO THE SUBS...
- Publication number 20150306701
- Publication date Oct 29, 2015
- SEMIKRON Elektronik GmbH & Co. KG
- Björn TAUSCHER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR DEVICE FABRICATION METHOD, POWER SEMICONDUCTOR...
- Publication number 20140284797
- Publication date Sep 25, 2014
- Kabushiki Kaisha Toshiba
- Yuuji HISAZATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT BONDING METHOD
- Publication number 20140263581
- Publication date Sep 18, 2014
- ALPHA DESIGN CO., LTD.
- Toshiyuki SHIRATORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20140110740
- Publication date Apr 24, 2014
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE, BONDING DEVICE FOR ELEC...
- Publication number 20140111919
- Publication date Apr 24, 2014
- SEIKO EPSON CORPORATION
- Hideo Miyasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Boards
- Publication number 20130334292
- Publication date Dec 19, 2013
- Frank Ferdinandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL FOR SEMICONDUCTOR CHIP AND METHOD FOR FO...
- Publication number 20130256868
- Publication date Oct 3, 2013
- SEOUL SEMICONDUCTOR CO., LTD.
- Yevgeni ALIYEV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED PROCESSED SEMICONDUCTOR STRUCTURES AND CARRIERS
- Publication number 20130256907
- Publication date Oct 3, 2013
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING METHOD AND METAL BONDED STRUCTURE
- Publication number 20130216302
- Publication date Aug 22, 2013
- Sanyo Electric Co., Ltd.
- Yasuyuki YANASE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINTERABLE BONDING MATERIAL USING COPPER NANOPARTICLES, PROCESS FOR...
- Publication number 20130105980
- Publication date May 2, 2013
- Hitachi, Ltd
- Yusuke Yasuda
- B82 - NANO-TECHNOLOGY
Information Patent Application
POWER SEMICONDUCTOR ARRANGEMENT AND METHOD FOR PRODUCING A POWER SE...
- Publication number 20130082387
- Publication date Apr 4, 2013
- INFINEON TECHNOLOGIES AG
- Thilo Stolze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATT...
- Publication number 20130001803
- Publication date Jan 3, 2013
- INFINEON TECHNOLOGIES AG
- Manfred Mengel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTING METHOD
- Publication number 20120329182
- Publication date Dec 27, 2012
- Teppei Kojio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METH...
- Publication number 20120319268
- Publication date Dec 20, 2012
- Tomohiro Kagimoto
- B32 - LAYERED PRODUCTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20120305945
- Publication date Dec 6, 2012
- Hosei Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING EXCESS SOLDER
- Publication number 20120306087
- Publication date Dec 6, 2012
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTING MATERIAL, METHOD FOR PRODUCING ELECTRONIC COM...
- Publication number 20120261174
- Publication date Oct 18, 2012
- Toshiaki Chuma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CONDUCTIVE CONNECTING MATERIAL AND METHOD FOR CONNECTING TERMINALS...
- Publication number 20120214010
- Publication date Aug 23, 2012
- Tomohiro Kagimoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR BONDING OF CHIPS ON WAFERS
- Publication number 20120184069
- Publication date Jul 19, 2012
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND E...
- Publication number 20120118480
- Publication date May 17, 2012
- Kyung-Wook PAIK
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Ultrasonic bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device including connection pad part and electronic compone...

Circuit board structure and method for manufacturing a circuit boar...

Display panel and manufacturing method for same

Circuit board structure and method for manufacturing a circuit boar...

Method for producing an integral join and automatic placement machine

Bond pad reliability of semiconductor devices

Method of manufacturing semiconductor devices and corresponding sem...

Inter-connection of a lead frame with a passive component intermedi...

Method for manufacturing a semiconductor component and a semiconduc...

Method of manufacturing semiconductor device

Transfer printing using ultrasound

Electronic device and method for producing an electronic device

Manufacturing method for power semiconductor device, and power semi...

Metallic particle paste, cured product using same, and semiconducto...

Jointed body, method for manufacturing same and jointed member

Semiconductor manufacturing method and associated semiconductor man...

Method for manufacturing printed circuit boards

Semiconductor device and method for manufacturing a semiconductor d...

Bonded processed semiconductor structures and carriers

Semiconductor device and method of manufacturing the same

Methods and configuration for manufacturing flip chip contact (FCC)...

Pre-formed via array for integrated circuit package

Semiconductor device and production method therefor

Method for bonding of chips on wafers

Method and system for bonding electrical devices using an electrica...

Metal bonding method and metal bonded structure

Semiconductor device and production method therefor

Method of fabricating a semiconductor device

Power semiconductor arrangement and method for producing a power se...

Method for attaching a metal surface to a carrier, a method for att...

Patents Applicationslast 30 patents

CIRCUIT BOARD AND MANUFACTURING METHOD

CIRCUIT BOARD AND MANUFACTURING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAG...

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF

DISPLAY PANEL AND MANUFACTURING METHOD FOR SAME

BOND PAD RELIABILITY OF SEMICONDUCTOR DEVICES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

TRANSFER PRINTING USING ULTRASOUND

Circuit board structure and method for manufacturing a circuit boar...

Semiconductor Device and Method of Manufacturing the Same

METHOD AND APPARATUS FOR CONNECTING CONNECTION ELEMENTS TO THE SUBS...

POWER SEMICONDUCTOR DEVICE FABRICATION METHOD, POWER SEMICONDUCTOR...

ELECTRONIC COMPONENT BONDING METHOD

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

METHOD FOR MANUFACTURING ELECTRONIC DEVICE, BONDING DEVICE FOR ELEC...

Printed Circuit Boards

THERMAL INTERFACE MATERIAL FOR SEMICONDUCTOR CHIP AND METHOD FOR FO...

BONDED PROCESSED SEMICONDUCTOR STRUCTURES AND CARRIERS

METAL BONDING METHOD AND METAL BONDED STRUCTURE

SINTERABLE BONDING MATERIAL USING COPPER NANOPARTICLES, PROCESS FOR...

POWER SEMICONDUCTOR ARRANGEMENT AND METHOD FOR PRODUCING A POWER SE...

METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATT...

SEMICONDUCTOR DEVICE MOUNTING METHOD

CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METH...

POWER SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING EXCESS SOLDER

CONDUCTIVE CONNECTING MATERIAL, METHOD FOR PRODUCING ELECTRONIC COM...

CONDUCTIVE CONNECTING MATERIAL AND METHOD FOR CONNECTING TERMINALS...

METHOD FOR BONDING OF CHIPS ON WAFERS

ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND E...