Ultrasonic bonding

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CPC
H01L2224/86205

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/86205Ultrasonic bonding

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Patents Grantslast 30 patents

Information Patent Grant
Method for connecting a die assembly to a substrate in an integrate...
- Patent number 8,263,438
- Issue date Sep 11, 2012
- Infineon Technologies AG
- Alvin Seah
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for connecting a die assembly to a substrate in an integrate...
- Patent number 7,880,277
- Issue date Feb 1, 2011
- Infineon Technologies AG
- Alvin Seah
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device with micro connecting elements and method for...
- Patent number 7,468,560
- Issue date Dec 23, 2008
- Infineon Technologies AG
- Volker Guengerich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method for Connecting a Die Assembly to a Substrate in an Integrate...
- Publication number 20110097848
- Publication date Apr 28, 2011
- Alvin Seah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for connecting a die assembly to a substrate in an integrate...
- Publication number 20070040251
- Publication date Feb 22, 2007
- Alvin Seah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with micro connecting elements and method for...
- Publication number 20060185892
- Publication date Aug 24, 2006
- Volker Guengerich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR