Ultrasonic frequency [f] 125 Khz=<f< 150 KHz

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CPC
H01L2924/20306

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/20306Ultrasonic frequency [f] 125 Khz=<f< 150 KHz

Industries

Patents Grantslast 30 patents

Information Patent Grant
Connecting device and circuit chip connecting method using connecti...
- Patent number 10,756,045
- Issue date Aug 25, 2020
- Samsung Display Co., Ltd.
- Seung Hwa Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,312,216
- Issue date Jun 4, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,297,568
- Issue date May 21, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,905,530
- Issue date Feb 27, 2018
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,633,981
- Issue date Apr 25, 2017
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,207,612
- Issue date Jun 26, 2012
- Sanken Electric Co., Ltd.
- Katsuyuki Torii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 7,015,127
- Issue date Mar 21, 2006
- Renesas Technology Corp.
- Yasuyuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding method apparatus
- Patent number 6,902,101
- Issue date Jun 7, 2005
- Matsushita Electric Industrial Co., Ltd.
- Satoshi Horie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature gold wire bonding
- Patent number 6,698,646
- Issue date Mar 2, 2004
- Agilent Technologies, Inc.
- Kim H Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnections to copper IC's
- Patent number 6,620,720
- Issue date Sep 16, 2003
- Agere Systems Inc.
- Ralph Salvatore Moyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to improve the reliability of thermosonic gold to aluminum w...
- Patent number 6,593,222
- Issue date Jul 15, 2003
- Lattice Corporation
- Richard C. Smoak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room temperature gold wire wedge bonding process
- Patent number 6,135,341
- Issue date Oct 24, 2000
- Texas Instruments Incorporated
- Robert J. Falcone
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency, low temperature thermosonic ribbon bonding process...
- Patent number 5,894,983
- Issue date Apr 20, 1999
- Harris Corporation
- Donald J. Beck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic bonding method and ultrasonic bonding apparatus
- Patent number 5,884,835
- Issue date Mar 23, 1999
- Hitachi, Ltd.
- Ryoichi Kajiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic bonding process beyond 125 kHz
- Patent number 5,244,140
- Issue date Sep 14, 1993
- Texas Instruments Incorporated
- Thomas H. Ramsey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONNECTING DEVICE AND CIRCUIT CHIP CONNECTING METHOD USING CONNECTI...
- Publication number 20180211933
- Publication date Jul 26, 2018
- SAMSUNG DISPLAY CO., LTD.
- Seung Hwa HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180182733
- Publication date Jun 28, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180026006
- Publication date Jan 25, 2018
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20170179072
- Publication date Jun 22, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20160254252
- Publication date Sep 1, 2016
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100264546
- Publication date Oct 21, 2010
- Sanken Electric Co., Ltd
- Katsuyuki Torii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20040142551
- Publication date Jul 22, 2004
- Hitachi, Ltd.
- Yasuyuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20030168740
- Publication date Sep 11, 2003
- Yasuyuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump bonding method and apparatue
- Publication number 20030094481
- Publication date May 22, 2003
- Matsushita Electric Industrial Co., Ltd.
- Satoshi Horie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method to improve the reliability of thermosonic gold to aluminum w...
- Publication number 20030049923
- Publication date Mar 13, 2003
- Richard C. Smoak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Room temperature gold wire bonding
- Publication number 20030006271
- Publication date Jan 9, 2003
- Kim H. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Room temperature gold wire bonding
- Publication number 20030006267
- Publication date Jan 9, 2003
- Kim H. Chen
- H01 - BASIC ELECTRIC ELEMENTS

Ultrasonic frequency [f] 125 Khz=<f< 150 KHz

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connecting device and circuit chip connecting method using connecti...

Systems and methods for bonding semiconductor elements

Systems and methods for bonding semiconductor elements

Systems and methods for bonding semiconductor elements

Systems and methods for bonding semiconductor elements

Semiconductor device and manufacturing method thereof

Semiconductor device and a method of manufacturing the same

Bump bonding method apparatus

Room temperature gold wire bonding

Interconnections to copper IC&#x00027;s

Method to improve the reliability of thermosonic gold to aluminum w...

Room temperature gold wire wedge bonding process

High frequency, low temperature thermosonic ribbon bonding process...

Ultrasonic bonding method and ultrasonic bonding apparatus

Ultrasonic bonding process beyond 125 kHz

Patents Applicationslast 30 patents

CONNECTING DEVICE AND CIRCUIT CHIP CONNECTING METHOD USING CONNECTI...

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Bump bonding method and apparatue

Method to improve the reliability of thermosonic gold to aluminum w...

Room temperature gold wire bonding

Room temperature gold wire bonding

Interconnections to copper IC's