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Ultrasonic frequency [f] 150 Khz=<f< 175 KHz
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CPC
H01L2924/20307
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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H01L2924/20307
Ultrasonic frequency [f] 150 Khz=<f< 175 KHz
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Patents Grants
last 30 patents
Information
Patent Grant
Connecting device and circuit chip connecting method using connecti...
Patent number
10,756,045
Issue date
Aug 25, 2020
Samsung Display Co., Ltd.
Seung Hwa Ha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for bonding semiconductor elements
Patent number
10,312,216
Issue date
Jun 4, 2019
Kulicke and Soffa Industries, Inc.
Robert N. Chylak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for bonding semiconductor elements
Patent number
10,297,568
Issue date
May 21, 2019
Kulicke and Soffa Industries, Inc.
Robert N. Chylak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for bonding semiconductor elements
Patent number
9,905,530
Issue date
Feb 27, 2018
Kulicke and Soffa Industries, Inc.
Robert N. Chylak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for bonding semiconductor elements
Patent number
9,633,981
Issue date
Apr 25, 2017
Kulicke and Soffa Industries, Inc.
Robert N. Chylak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
8,207,612
Issue date
Jun 26, 2012
Sanken Electric Co., Ltd.
Katsuyuki Torii
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and a method of manufacturing the same
Patent number
7,015,127
Issue date
Mar 21, 2006
Renesas Technology Corp.
Yasuyuki Nakajima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bump bonding method apparatus
Patent number
6,902,101
Issue date
Jun 7, 2005
Matsushita Electric Industrial Co., Ltd.
Satoshi Horie
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Interconnections to copper IC's
Patent number
6,620,720
Issue date
Sep 16, 2003
Agere Systems Inc.
Ralph Salvatore Moyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Room temperature gold wire wedge bonding process
Patent number
6,135,341
Issue date
Oct 24, 2000
Texas Instruments Incorporated
Robert J. Falcone
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Ultrasonic bonding method and ultrasonic bonding apparatus
Patent number
5,884,835
Issue date
Mar 23, 1999
Hitachi, Ltd.
Ryoichi Kajiwara
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Ultrasonic bonding process
Patent number
5,660,319
Issue date
Aug 26, 1997
Texas Instruments Incorporated
Robert J. Falcone
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Ultrasonic bonding process beyond 125 kHz
Patent number
5,244,140
Issue date
Sep 14, 1993
Texas Instruments Incorporated
Thomas H. Ramsey
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
CONNECTING DEVICE AND CIRCUIT CHIP CONNECTING METHOD USING CONNECTI...
Publication number
20180211933
Publication date
Jul 26, 2018
SAMSUNG DISPLAY CO., LTD.
Seung Hwa HA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
Publication number
20180182733
Publication date
Jun 28, 2018
KULICKE AND SOFFA INDUSTRIES, INC.
Robert N. Chylak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
Publication number
20180026006
Publication date
Jan 25, 2018
Kulicke and Soffa Industries, Inc.
Robert N. Chylak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
Publication number
20170179072
Publication date
Jun 22, 2017
KULICKE AND SOFFA INDUSTRIES, INC.
Robert N. Chylak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
Publication number
20160254252
Publication date
Sep 1, 2016
KULICKE AND SOFFA INDUSTRIES, INC.
Robert N. Chylak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20100264546
Publication date
Oct 21, 2010
Sanken Electric Co., Ltd
Katsuyuki Torii
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and a method of manufacturing the same
Publication number
20040142551
Publication date
Jul 22, 2004
Hitachi, Ltd.
Yasuyuki Nakajima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and a method of manufacturing the same
Publication number
20030168740
Publication date
Sep 11, 2003
Yasuyuki Nakajima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bump bonding method and apparatue
Publication number
20030094481
Publication date
May 22, 2003
Matsushita Electric Industrial Co., Ltd.
Satoshi Horie
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR