Ultrasonic frequency [f] 175 Khz=<f< 200 KHz

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H01L2924/20308

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/20308Ultrasonic frequency [f] 175 Khz=<f< 200 KHz

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Connecting device and circuit chip connecting method using connecti...
- Patent number 10,756,045
- Issue date Aug 25, 2020
- Samsung Display Co., Ltd.
- Seung Hwa Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,207,612
- Issue date Jun 26, 2012
- Sanken Electric Co., Ltd.
- Katsuyuki Torii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 7,015,127
- Issue date Mar 21, 2006
- Renesas Technology Corp.
- Yasuyuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding method apparatus
- Patent number 6,902,101
- Issue date Jun 7, 2005
- Matsushita Electric Industrial Co., Ltd.
- Satoshi Horie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnections to copper IC's
- Patent number 6,620,720
- Issue date Sep 16, 2003
- Agere Systems Inc.
- Ralph Salvatore Moyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room temperature gold wire wedge bonding process
- Patent number 6,135,341
- Issue date Oct 24, 2000
- Texas Instruments Incorporated
- Robert J. Falcone
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic bonding method and ultrasonic bonding apparatus
- Patent number 5,884,835
- Issue date Mar 23, 1999
- Hitachi, Ltd.
- Ryoichi Kajiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic bonding process beyond 125 kHz
- Patent number 5,244,140
- Issue date Sep 14, 1993
- Texas Instruments Incorporated
- Thomas H. Ramsey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONNECTING DEVICE AND CIRCUIT CHIP CONNECTING METHOD USING CONNECTI...
- Publication number 20180211933
- Publication date Jul 26, 2018
- SAMSUNG DISPLAY CO., LTD.
- Seung Hwa HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100264546
- Publication date Oct 21, 2010
- Sanken Electric Co., Ltd
- Katsuyuki Torii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20040142551
- Publication date Jul 22, 2004
- Hitachi, Ltd.
- Yasuyuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20030168740
- Publication date Sep 11, 2003
- Yasuyuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump bonding method and apparatue
- Publication number 20030094481
- Publication date May 22, 2003
- Matsushita Electric Industrial Co., Ltd.
- Satoshi Horie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Ultrasonic frequency [f] 175 Khz=<f< 200 KHz

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connecting device and circuit chip connecting method using connecti...

Semiconductor device and manufacturing method thereof

Semiconductor device and a method of manufacturing the same

Bump bonding method apparatus

Interconnections to copper IC&#x00027;s

Room temperature gold wire wedge bonding process

Ultrasonic bonding method and ultrasonic bonding apparatus

Ultrasonic bonding process beyond 125 kHz

Patents Applicationslast 30 patents

CONNECTING DEVICE AND CIRCUIT CHIP CONNECTING METHOD USING CONNECTI...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Bump bonding method and apparatue

Interconnections to copper IC's