Ultrasonic frequency [f] 25 Khz=<f< 50 KHz

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H01L2924/20302

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/20302Ultrasonic frequency [f] 25 Khz=<f< 50 KHz

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Connecting device and circuit chip connecting method using connecti...
- Patent number 10,756,045
- Issue date Aug 25, 2020
- Samsung Display Co., Ltd.
- Seung Hwa Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,312,216
- Issue date Jun 4, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,297,568
- Issue date May 21, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,905,530
- Issue date Feb 27, 2018
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,633,981
- Issue date Apr 25, 2017
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
OLED device in contact with a conductor
- Patent number 9,362,525
- Issue date Jun 7, 2016
- Koninklijke Philips Electronics N.V.
- Jeroen Henri Antoine Maria Van Buul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacting a device with a conductor
- Patent number 8,679,867
- Issue date Mar 25, 2014
- Koninklijke Philips N.V.
- Jeroen Henri Antoine Maria Van Buul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnections to copper IC's
- Patent number 6,620,720
- Issue date Sep 16, 2003
- Agere Systems Inc.
- Ralph Salvatore Moyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and testing apparatus of a bonded portion
- Patent number 5,323,952
- Issue date Jun 28, 1994
- Hitachi, Ltd.
- Mituo Kato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method and bonding apparatus
- Patent number 5,002,217
- Issue date Mar 26, 1991
- Hitachi, Ltd.
- Mitsukiyo Tani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONNECTING DEVICE AND CIRCUIT CHIP CONNECTING METHOD USING CONNECTI...
- Publication number 20180211933
- Publication date Jul 26, 2018
- SAMSUNG DISPLAY CO., LTD.
- Seung Hwa HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180182733
- Publication date Jun 28, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180026006
- Publication date Jan 25, 2018
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20170179072
- Publication date Jun 22, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20160254252
- Publication date Sep 1, 2016
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OLED DEVICE IN CONTACT WITH A CONDUCTOR
- Publication number 20140167023
- Publication date Jun 19, 2014
- Koninklijke Philips N.V.
- JEROEN HENRI ANTOINE MARIA VAN BUUL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACTING A DEVICE WITH A CONDUCTOR
- Publication number 20110156091
- Publication date Jun 30, 2011
- Koninklijke Philips Electronics N.V.
- Jeroem Henri Antoine Maria Van Buul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WIRE BONDING
- Publication number 20080191367
- Publication date Aug 14, 2008
- STATS ChipPAC, Ltd.
- Taehun Kim
- H01 - BASIC ELECTRIC ELEMENTS

Ultrasonic frequency [f] 25 Khz=<f< 50 KHz

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connecting device and circuit chip connecting method using connecti...

Systems and methods for bonding semiconductor elements

Systems and methods for bonding semiconductor elements

Systems and methods for bonding semiconductor elements

Systems and methods for bonding semiconductor elements

OLED device in contact with a conductor

Contacting a device with a conductor

Interconnections to copper IC&#x00027;s

Bonding apparatus and testing apparatus of a bonded portion

Bonding method and bonding apparatus

Patents Applicationslast 30 patents

CONNECTING DEVICE AND CIRCUIT CHIP CONNECTING METHOD USING CONNECTI...

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

OLED DEVICE IN CONTACT WITH A CONDUCTOR

CONTACTING A DEVICE WITH A CONDUCTOR

SEMICONDUCTOR PACKAGE WIRE BONDING

Interconnections to copper IC's