Ultrasonic frequency ranges

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H01L2924/203

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/203Ultrasonic frequency ranges

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods for attachment and devices produced using the methods
- Patent number 11,699,632
- Issue date Jul 11, 2023
- Alpha Assembly Solutions Inc.
- Monnir Boureghda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for attachment and devices produced using the methods
- Patent number 10,905,041
- Issue date Jan 26, 2021
- Alpha Assembly Solutions Inc.
- Monnir Boureghda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting device and circuit chip connecting method using connecti...
- Patent number 10,756,045
- Issue date Aug 25, 2020
- Samsung Display Co., Ltd.
- Seung Hwa Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,312,216
- Issue date Jun 4, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,297,568
- Issue date May 21, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silver paste composition and semiconductor device using same
- Patent number 10,201,879
- Issue date Feb 12, 2019
- Hitachi Chemical Company, Ltd.
- Dai Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method using bonding material
- Patent number 10,090,275
- Issue date Oct 2, 2018
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material and bonding method using the same
- Patent number 10,008,471
- Issue date Jun 26, 2018
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum coated copper bond wire and method of making the same
- Patent number 9,966,355
- Issue date May 8, 2018
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,905,530
- Issue date Feb 27, 2018
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,633,981
- Issue date Apr 25, 2017
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding material and bonding body, and bonding method
- Patent number 9,486,879
- Issue date Nov 8, 2016
- Dowa Electronics Materials Co., Ltd.
- Satoru Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module
- Patent number 9,439,332
- Issue date Sep 6, 2016
- Hitachi Automotive Systems, Ltd.
- Eiichi Ide
- B60 - VEHICLES IN GENERAL
Information Patent Grant
OLED device in contact with a conductor
- Patent number 9,362,525
- Issue date Jun 7, 2016
- Koninklijke Philips Electronics N.V.
- Jeroen Henri Antoine Maria Van Buul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum coated copper ribbon
- Patent number 9,214,444
- Issue date Dec 15, 2015
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Copper conductor film and manufacturing method thereof, conductive...
- Patent number 8,801,971
- Issue date Aug 12, 2014
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Packaged semiconductor chips
- Patent number 8,704,347
- Issue date Apr 22, 2014
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon bonding in an electronic package
- Patent number 8,685,789
- Issue date Apr 1, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon bonding in an electronic package
- Patent number 8,685,791
- Issue date Apr 1, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacting a device with a conductor
- Patent number 8,679,867
- Issue date Mar 25, 2014
- Koninklijke Philips N.V.
- Jeroen Henri Antoine Maria Van Buul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and method for operating a power semicon...
- Patent number 8,593,817
- Issue date Nov 26, 2013
- Infineon Technologies AG
- Reinhold Bayerer
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Methods of attaching a die to a substrate
- Patent number 8,555,491
- Issue date Oct 15, 2013
- Alpha Metals, Inc.
- Monnir Boureghda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method using multi-step adhesive curing for sealed se...
- Patent number 8,513,060
- Issue date Aug 20, 2013
- Renesas Electronics Corporation
- Hiroaki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic transducers for wire bonding and methods of forming wire...
- Patent number 8,365,977
- Issue date Feb 5, 2013
- Kulicke and Soffa Industries, Inc.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nanoscale metal paste for interconnect and method of use
- Patent number 8,257,795
- Issue date Sep 4, 2012
- Virginia Tech Intellectual Properties, Inc.
- Guo-Quan Lu
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Ultrasonic transducers for wire bonding and methods of forming wire...
- Patent number 8,251,275
- Issue date Aug 28, 2012
- Kulicke and Soffa Industries, Inc.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,207,612
- Issue date Jun 26, 2012
- Sanken Electric Co., Ltd.
- Katsuyuki Torii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with sealing device for sealing to a sub...
- Patent number 8,053,884
- Issue date Nov 8, 2011
- Semikron Elektronik GmbH & Co. KG
- Christian Kroneder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for controlling the generation of ultrasonic wire...
- Patent number 8,020,746
- Issue date Sep 20, 2011
- Technische Universitaet Berlin
- Ute Geissler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connect and capacitor substrates in a multilayered substrate struct...
- Patent number 8,003,973
- Issue date Aug 23, 2011
- Metamems Corp.
- Thaddeus John Gabara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS
- Publication number 20210289680
- Publication date Sep 16, 2021
- Alpha Assembly Solutions Inc.
- Monnir Boureghda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING DEVICE AND CIRCUIT CHIP CONNECTING METHOD USING CONNECTI...
- Publication number 20180211933
- Publication date Jul 26, 2018
- SAMSUNG DISPLAY CO., LTD.
- Seung Hwa HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180182733
- Publication date Jun 28, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180026006
- Publication date Jan 25, 2018
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20170179072
- Publication date Jun 22, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20160254252
- Publication date Sep 1, 2016
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING THREE-DIMENSIONAL INTEGRATED CIRCUIT COMPRI...
- Publication number 20150348893
- Publication date Dec 3, 2015
- NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- CHIH WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module
- Publication number 20140168901
- Publication date Jun 19, 2014
- Hitachi Automotive Systems, Ltd.
- Eiichi Ide
- B60 - VEHICLES IN GENERAL
Information Patent Application
OLED DEVICE IN CONTACT WITH A CONDUCTOR
- Publication number 20140167023
- Publication date Jun 19, 2014
- Koninklijke Philips N.V.
- JEROEN HENRI ANTOINE MARIA VAN BUUL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Moisture-tight semiconductor module and method for producing a mois...
- Publication number 20140151868
- Publication date Jun 5, 2014
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS
- Publication number 20140153203
- Publication date Jun 5, 2014
- ALPHA METALS, INC.
- Monnir Boureghda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20140147695
- Publication date May 29, 2014
- DOWA METALTECH CO., LTD.
- Naoya Sunachi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MOUNTED STRUCTURE
- Publication number 20140048942
- Publication date Feb 20, 2014
- Taichi Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEALED SEMICONDUCTOR DEVICE HAVING ADHESIVE PATCH WITH INWARDLY SLO...
- Publication number 20130328218
- Publication date Dec 12, 2013
- RENESAS ELECTRONICS CORPORATION
- Hiroaki NARITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MATERIAL AND BONDING BODY, AND BONDING METHOD
- Publication number 20130323529
- Publication date Dec 5, 2013
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru Kurita
- B32 - LAYERED PRODUCTS
Information Patent Application
Bonding Material for Semiconductor Devices
- Publication number 20130134591
- Publication date May 30, 2013
- Yoshitsugu Sakamoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
RIBBON BONDING IN AN ELECTRONIC PACKAGE
- Publication number 20130134577
- Publication date May 30, 2013
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD USING MULTI-STEP ADHESIVE CURING FOR SEALED S...
- Publication number 20130040426
- Publication date Feb 14, 2013
- RENESAS ELECTRONICS CORPORATION
- HIROAKI NARITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING THE SAME
- Publication number 20120298009
- Publication date Nov 29, 2012
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRASONIC TRANSDUCERS FOR WIRE BONDING AND METHODS OF FORMING WIRE...
- Publication number 20120286023
- Publication date Nov 15, 2012
- KULICKE AND SOFFA INDUSTRIES, INC.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRASONIC TRANSDUCERS FOR WIRE BONDING AND METHODS OF FORMING WIRE...
- Publication number 20120125977
- Publication date May 24, 2012
- KULICKE AND SOFFA INDUSTRIES, INC.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CONDUCTOR FILM AND MANUFACTURING METHOD THEREOF, CONDUCTIVE...
- Publication number 20120125659
- Publication date May 24, 2012
- Hideo Nakako
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BONDING MATERIAL USING METAL NANOPARTICLES AND BONDING METHOD
- Publication number 20120103515
- Publication date May 3, 2012
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTACTING A DEVICE WITH A CONDUCTOR
- Publication number 20110156091
- Publication date Jun 30, 2011
- Koninklijke Philips Electronics N.V.
- Jeroem Henri Antoine Maria Van Buul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module and Method for Operating a Power Semicon...
- Publication number 20110075451
- Publication date Mar 31, 2011
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR CHIPS
- Publication number 20110012259
- Publication date Jan 20, 2011
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECT AND CAPACITOR SUBSTRATES IN A MULTILAYERED SUBSTRATE STRUCT...
- Publication number 20110006394
- Publication date Jan 13, 2011
- METAMES Corp.
- Thaddeus Gabara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pressure-Sensitive Adhesive Tape
- Publication number 20100323191
- Publication date Dec 23, 2010
- Nitto Denko Corporation
- Yuki Sugo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100264546
- Publication date Oct 21, 2010
- Sanken Electric Co., Ltd
- Katsuyuki Torii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIBBON BONDING IN AN ELECTRONIC PACKAGE
- Publication number 20100214754
- Publication date Aug 26, 2010
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS

Ultrasonic frequency ranges

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for attachment and devices produced using the methods

Methods for attachment and devices produced using the methods

Connecting device and circuit chip connecting method using connecti...

Systems and methods for bonding semiconductor elements

Systems and methods for bonding semiconductor elements

Silver paste composition and semiconductor device using same

Bonding method using bonding material

Bonding material and bonding method using the same

Aluminum coated copper bond wire and method of making the same

Systems and methods for bonding semiconductor elements

Systems and methods for bonding semiconductor elements

Bonding material and bonding body, and bonding method

Power module

OLED device in contact with a conductor

Aluminum coated copper ribbon

Copper conductor film and manufacturing method thereof, conductive...

Packaged semiconductor chips

Ribbon bonding in an electronic package

Ribbon bonding in an electronic package

Contacting a device with a conductor

Power semiconductor module and method for operating a power semicon...

Methods of attaching a die to a substrate

Manufacturing method using multi-step adhesive curing for sealed se...

Ultrasonic transducers for wire bonding and methods of forming wire...

Nanoscale metal paste for interconnect and method of use

Ultrasonic transducers for wire bonding and methods of forming wire...

Semiconductor device and manufacturing method thereof

Power semiconductor module with sealing device for sealing to a sub...

Method and device for controlling the generation of ultrasonic wire...

Connect and capacitor substrates in a multilayered substrate struct...

Patents Applicationslast 30 patents

METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS

CONNECTING DEVICE AND CIRCUIT CHIP CONNECTING METHOD USING CONNECTI...

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

METHOD OF MANUFACTURING THREE-DIMENSIONAL INTEGRATED CIRCUIT COMPRI...

Power Module

OLED DEVICE IN CONTACT WITH A CONDUCTOR

Moisture-tight semiconductor module and method for producing a mois...

METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS

ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME

MOUNTED STRUCTURE

SEALED SEMICONDUCTOR DEVICE HAVING ADHESIVE PATCH WITH INWARDLY SLO...

BONDING MATERIAL AND BONDING BODY, AND BONDING METHOD

Bonding Material for Semiconductor Devices

RIBBON BONDING IN AN ELECTRONIC PACKAGE

MANUFACTURING METHOD USING MULTI-STEP ADHESIVE CURING FOR SEALED S...

BONDING MATERIAL AND BONDING METHOD USING THE SAME

ULTRASONIC TRANSDUCERS FOR WIRE BONDING AND METHODS OF FORMING WIRE...

ULTRASONIC TRANSDUCERS FOR WIRE BONDING AND METHODS OF FORMING WIRE...

COPPER CONDUCTOR FILM AND MANUFACTURING METHOD THEREOF, CONDUCTIVE...

BONDING MATERIAL USING METAL NANOPARTICLES AND BONDING METHOD

CONTACTING A DEVICE WITH A CONDUCTOR

Power Semiconductor Module and Method for Operating a Power Semicon...

PACKAGED SEMICONDUCTOR CHIPS

CONNECT AND CAPACITOR SUBSTRATES IN A MULTILAYERED SUBSTRATE STRUCT...

Pressure-Sensitive Adhesive Tape

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

RIBBON BONDING IN AN ELECTRONIC PACKAGE