Ultraviolet radiation

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CPC
H01L2924/2021

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/2021Ultraviolet radiation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device by backgrinding semic...
- Patent number 11,482,441
- Issue date Oct 25, 2022
- Mitsui Chemicals Tohcello, Inc.
- Hiroyoshi Kurihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively cross-linked thermal interface materials
- Patent number 10,903,188
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implementing reworkable strain relief packaging structure for elect...
- Patent number 10,834,811
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively cross-linked thermal interface materials
- Patent number 10,381,324
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implementing reworkable strain relief packaging structure for elect...
- Patent number 10,111,322
- Issue date Oct 23, 2018
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selectively cross-linked thermal interface materials
- Patent number 10,050,010
- Issue date Aug 14, 2018
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film including oblique region having lower c...
- Patent number 9,997,486
- Issue date Jun 12, 2018
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device, and electronic device...
- Patent number 9,911,642
- Issue date Mar 6, 2018
- Fujitsu Limited
- Taiji Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE
- Publication number 20240021563
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Seokhyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVELY CROSS-LINKED THERMAL INTERFACE MATERIALS
- Publication number 20190326253
- Publication date Oct 24, 2019
- International Business Machines Corporation
- ERIC J. CAMPBELL
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190088528
- Publication date Mar 21, 2019
- MITSUI CHEMICALS TOHCELLO, INC.
- Hiroyoshi KURIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVELY CROSS-LINKED THERMAL INTERFACE MATERIALS
- Publication number 20180277510
- Publication date Sep 27, 2018
- International Business Machines Corporation
- ERIC J. CAMPBELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLEMENTING REWORKABLE STRAIN RELIEF PACKAGING STRUCTURE FOR ELECT...
- Publication number 20180228022
- Publication date Aug 9, 2018
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLEMENTING REWORKABLE STRAIN RELIEF PACKAGING STRUCTURE FOR ELECT...
- Publication number 20180168030
- Publication date Jun 14, 2018
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME
- Publication number 20170077056
- Publication date Mar 16, 2017
- DEXERIALS CORPORATION
- Reiji TSUKAO
- B32 - LAYERED PRODUCTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME
- Publication number 20170077055
- Publication date Mar 16, 2017
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...
- Publication number 20140342504
- Publication date Nov 20, 2014
- FUJITSU LIMITED
- Taiji SAKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...
- Publication number 20130187293
- Publication date Jul 25, 2013
- Fujitsu Limited
- Taiji SAKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Ultraviolet radiation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing semiconductor device by backgrinding semic...

Selectively cross-linked thermal interface materials

Implementing reworkable strain relief packaging structure for elect...

Selectively cross-linked thermal interface materials

Implementing reworkable strain relief packaging structure for elect...

Selectively cross-linked thermal interface materials

Anisotropic conductive film including oblique region having lower c...

Method of manufacturing an electronic device, and electronic device...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE

SELECTIVELY CROSS-LINKED THERMAL INTERFACE MATERIALS

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SELECTIVELY CROSS-LINKED THERMAL INTERFACE MATERIALS

IMPLEMENTING REWORKABLE STRAIN RELIEF PACKAGING STRUCTURE FOR ELECT...

IMPLEMENTING REWORKABLE STRAIN RELIEF PACKAGING STRUCTURE FOR ELECT...

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME

ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...

ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...