Ultraviolet [UV] curing

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H01L2224/81874

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81874Ultraviolet [UV] curing

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating an electronic device comprising forming an i...
- Patent number 11,244,910
- Issue date Feb 8, 2022
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating an electronic device and a stacked electroni...
- Patent number 10,672,721
- Issue date Jun 2, 2020
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded miniaturized semiconductor module
- Patent number 10,373,902
- Issue date Aug 6, 2019
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electronic device and a stacked electroni...
- Patent number 10,177,098
- Issue date Jan 8, 2019
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 9,865,463
- Issue date Jan 9, 2018
- SII Semiconductor Corporation
- Hitomi Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronic device including a protective wafer bonded to a...
- Patent number 9,773,740
- Issue date Sep 26, 2017
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive adhesive, and circuit board and electronic component mod...
- Patent number 8,940,198
- Issue date Jan 27, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing circuit module
- Patent number 5,829,125
- Issue date Nov 3, 1998
- Taiyo Yuden Co., Ltd.
- Masayuki Fujimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A STACKED ELECTRONI...
- Publication number 20190103368
- Publication date Apr 4, 2019
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE
- Publication number 20180108606
- Publication date Apr 19, 2018
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A STACKED ELECTRONI...
- Publication number 20160148879
- Publication date May 26, 2016
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE ADHESIVE, AND CIRCUIT BOARD AND ELECTRONIC COMPONENT MOD...
- Publication number 20120073869
- Publication date Mar 29, 2012
- PANASONIC CORPORATION
- Arata KISHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Ultraviolet [UV] curing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for fabricating an electronic device comprising forming an i...

Engineered polymer-based electronic materials

Method for fabricating an electronic device and a stacked electroni...

Fully molded miniaturized semiconductor module

Method for fabricating an electronic device and a stacked electroni...

Method of manufacturing a semiconductor device

Stacked electronic device including a protective wafer bonded to a...

Conductive adhesive, and circuit board and electronic component mod...

Method of manufacturing circuit module

Patents Applicationslast 30 patents

METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A STACKED ELECTRONI...

FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE

METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A STACKED ELECTRONI...

CONDUCTIVE ADHESIVE, AND CIRCUIT BOARD AND ELECTRONIC COMPONENT MOD...