Ultraviolet [UV] curing

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H01L2224/83874

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83874Ultraviolet [UV] curing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device and method of transferring electronic element usi...
- Patent number 12,009,339
- Issue date Jun 11, 2024
- Seoul National University R&DB Foundation
- Yongtaek Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad for semiconductor device
- Patent number 11,901,320
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of transferring electronic element usi...
- Patent number 11,848,303
- Issue date Dec 19, 2023
- Seoul National University R&DB Foundation
- Yongtaek Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure
- Patent number 11,735,556
- Issue date Aug 22, 2023
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for releasing ultra-small or ultra-thin discrete components...
- Patent number 11,728,201
- Issue date Aug 15, 2023
- Kulicke and Soffa Industries, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,694,990
- Issue date Jul 4, 2023
- Samsung Display Co., Ltd.
- Chan-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip mounting tape and method of manufacturing semico...
- Patent number 11,688,716
- Issue date Jun 27, 2023
- Samsung Electronics Co., Ltd.
- Soo Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 11,658,154
- Issue date May 23, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 11,648,750
- Issue date May 16, 2023
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Sawing underfill in packaging processes
- Patent number 11,637,086
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sawing underfill in packaging processes
- Patent number 11,631,654
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding tools for bonding machines, bonding machines for bonding se...
- Patent number 11,608,453
- Issue date Mar 21, 2023
- Kulicke and Soffa Industries, Inc.
- Urban Ernst
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Contact pad for semiconductor device
- Patent number 11,527,502
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite semiconductor component having projecting elements projec...
- Patent number 11,527,521
- Issue date Dec 13, 2022
- OSRAM OLED GmbH
- Lutz Hoeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,410,967
- Issue date Aug 9, 2022
- Samsung Display Co., Ltd.
- Chan-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding method and bonding device
- Patent number 11,239,198
- Issue date Feb 1, 2022
- BOE Technology Group Co., Ltd.
- Lili Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Receiver optical module and process of assembling the same
- Patent number 11,152,342
- Issue date Oct 19, 2021
- Sumitomo Electric Device Innovations, Inc.
- Kyohei Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure
- Patent number 11,133,279
- Issue date Sep 28, 2021
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment method, method for connecting electronic component, metho...
- Patent number 11,049,842
- Issue date Jun 29, 2021
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor packages
- Patent number 11,031,347
- Issue date Jun 8, 2021
- Samsung Electronics Co., Ltd.
- Young-lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly process for circuit carrier and circuit carrier
- Patent number 10,991,632
- Issue date Apr 27, 2021
- A.B. MIKROELEKTRONIK GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG
- Andreas Karch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-forming film, semiconductor device and manufacturing method th...
- Patent number 10,943,879
- Issue date Mar 9, 2021
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Setting up ultra-small or ultra-thin discrete components for easy a...
- Patent number 10,937,680
- Issue date Mar 2, 2021
- Uniqarta, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad for semiconductor device
- Patent number 10,930,605
- Issue date Feb 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively cross-linked thermal interface materials
- Patent number 10,903,188
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sawing underfill in packaging processes
- Patent number 10,840,215
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,804,218
- Issue date Oct 13, 2020
- Samsung Electronics Co., Ltd.
- Young-Lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure
- Patent number 10,804,235
- Issue date Oct 13, 2020
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package with integrated interconnect structure and meth...
- Patent number 10,804,115
- Issue date Oct 13, 2020
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, METHOD FOR PRODUCING FILM-LI...
- Publication number 20240395759
- Publication date Nov 28, 2024
- Resonac Corporation
- Hiroyuki ISHIGE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240371817
- Publication date Nov 7, 2024
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE
- Publication number 20240304639
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVI...
- Publication number 20240186279
- Publication date Jun 6, 2024
- Intel Corporation
- Minglu LIU
- B32 - LAYERED PRODUCTS
Information Patent Application
DOCUMENT STRUCTURE FORMATION
- Publication number 20240105669
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE
- Publication number 20240038795
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Sang-Uk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELEC...
- Publication number 20230420404
- Publication date Dec 28, 2023
- Sony Semiconductor Solutions Corporation
- Yuji HARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...
- Publication number 20230377936
- Publication date Nov 23, 2023
- Kulicke and Soffa Industries, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230299247
- Publication date Sep 21, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dong Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20230191747
- Publication date Jun 22, 2023
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230154906
- Publication date May 18, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dong Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSPARENT DISPLAY PANEL, METHOD FOR MANUFACTURING THE SAME, AND T...
- Publication number 20230037241
- Publication date Feb 2, 2023
- Kateeva Display Technology (Shaoxing) Limited
- Erdong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP MOUNTING DEVICE, AND IC CHIP MOUNTING METHOD
- Publication number 20230019546
- Publication date Jan 19, 2023
- SATO HOLDINGS KABUSHIKI KAISHA
- Yoshimitsu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD
- Publication number 20230011327
- Publication date Jan 12, 2023
- SATO HOLDINGS KABUSHIKI KAISHA
- Yoshimitsu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND METHOD OF MANUFACTURING SAME
- Publication number 20220367770
- Publication date Nov 17, 2022
- HON HAI PRECISION INDUSTRY CO., LTD.
- YI-HSIANG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuits Including Micropatterns and Using Partial Curing to Adhere...
- Publication number 20220352108
- Publication date Nov 3, 2022
- 3M Innovative Properties Company
- Teresa M. Goeddel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INHIBITING VISCOUS MATERIAL SPREAD
- Publication number 20220344297
- Publication date Oct 27, 2022
- INPHI CORPORATION
- Choong Kooi CHEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220328451
- Publication date Oct 13, 2022
- SAMSUNG DISPLAY CO., LTD.
- Chan-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING DIE ATTACH FILM AND METHOD OF PRODUCING THE SAME, AND SEMICO...
- Publication number 20220310547
- Publication date Sep 29, 2022
- FURUKAWA ELECTRIC CO., LTD.
- Minoru MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...
- Publication number 20220271004
- Publication date Aug 25, 2022
- Seoul National University R&DB Foundation
- Yongtaek HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METH...
- Publication number 20220149031
- Publication date May 12, 2022
- Showa Denko Materials Co., Ltd.
- Tatsuya YAHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED DISPLAY AND MANUFACTURING METHOD THEREFOR
- Publication number 20220085265
- Publication date Mar 17, 2022
- Samsung Electronics Co., Ltd.
- Byunghoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING ELECTRICAL INTERCONNECTIONS USING CAPILLARY MICROFLUIDICS
- Publication number 20220078918
- Publication date Mar 10, 2022
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...
- Publication number 20220059496
- Publication date Feb 24, 2022
- Seoul National University R&DB Foundation
- Yongtaek HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE
- Publication number 20210398931
- Publication date Dec 23, 2021
- MIKUNI ELECTRON CORPORATION
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210384156
- Publication date Dec 9, 2021
- JOO-NYUNG JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP MOUNTING TAPE AND METHOD OF MANUFACTURING SEMICO...
- Publication number 20210358882
- Publication date Nov 18, 2021
- Samsung Electronics Co., Ltd.
- Soo Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Pad for Semiconductor Device
- Publication number 20210175191
- Publication date Jun 10, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sawing Underfill in Packaging Processes
- Publication number 20210125964
- Publication date Apr 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sawing Underfill in Packaging Processes
- Publication number 20210057383
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS

Ultraviolet [UV] curing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device and method of transferring electronic element usi...

Contact pad for semiconductor device

Electronic device and method of transferring electronic element usi...

Connection structure

Methods for releasing ultra-small or ultra-thin discrete components...

Display device and method of manufacturing the same

Semiconductor chip mounting tape and method of manufacturing semico...

Memory devices with controllers under memory packages and associate...

Adhesive bonding composition and method of use

Sawing underfill in packaging processes

Sawing underfill in packaging processes

Bonding tools for bonding machines, bonding machines for bonding se...

Contact pad for semiconductor device

Composite semiconductor component having projecting elements projec...

Multi-die package with bridge layer

Display device and method of manufacturing the same

Chip bonding method and bonding device

Receiver optical module and process of assembling the same

Connection structure

Alignment method, method for connecting electronic component, metho...

Semiconductor packages

Assembly process for circuit carrier and circuit carrier

Bump-forming film, semiconductor device and manufacturing method th...

Setting up ultra-small or ultra-thin discrete components for easy a...

Contact pad for semiconductor device

Selectively cross-linked thermal interface materials

Sawing underfill in packaging processes

Semiconductor package

Connection structure

Electronics package with integrated interconnect structure and meth...

Patents Applicationslast 30 patents

FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, METHOD FOR PRODUCING FILM-LI...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

OPTICAL SENSOR PACKAGE

IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVI...

DOCUMENT STRUCTURE FORMATION

SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE

IMAGING ELEMENT PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELEC...

Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

TRANSPARENT DISPLAY PANEL, METHOD FOR MANUFACTURING THE SAME, AND T...

IC CHIP MOUNTING DEVICE, AND IC CHIP MOUNTING METHOD

IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD

DISPLAY PANEL AND METHOD OF MANUFACTURING SAME

Circuits Including Micropatterns and Using Partial Curing to Adhere...

SEMICONDUCTOR PACKAGE INHIBITING VISCOUS MATERIAL SPREAD

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

DICING DIE ATTACH FILM AND METHOD OF PRODUCING THE SAME, AND SEMICO...

ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...

SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METH...

MICRO LED DISPLAY AND MANUFACTURING METHOD THEREFOR

FORMING ELECTRICAL INTERCONNECTIONS USING CAPILLARY MICROFLUIDICS

ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USI...

CONNECTION STRUCTURE

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR CHIP MOUNTING TAPE AND METHOD OF MANUFACTURING SEMICO...

Contact Pad for Semiconductor Device

Sawing Underfill in Packaging Processes

Sawing Underfill in Packaging Processes