Ultraviolet [UV] curing

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H01L2224/82874

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/82874Ultraviolet [UV] curing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for assembling electric components on a flexib...
- Patent number 9,338,894
- Issue date May 10, 2016
- Nederlandse Organisatie voor Toegepast-Natuurwetenschappelijk Onderzoek TNO
- Jeroen Van Den Brand
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package including wire bond and electrically con...
- Patent number 8,907,482
- Issue date Dec 9, 2014
- Honeywell International Inc.
- David Scheid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing 3D circuits from bare die or packaged IC c...
- Patent number 8,790,742
- Issue date Jul 29, 2014
- nScrypt, Inc.
- Kenneth H. Church
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing 3D circuits from bare die or packaged IC c...
- Patent number 7,972,650
- Issue date Jul 5, 2011
- nScrypt, Inc.
- Kenneth H. Church
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and Associated Methods
- Publication number 20140345924
- Publication date Nov 27, 2014
- Nokia Corporation
- Mark Lee ALLEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE INCLUDING WIRE BOND AND ELECTRICALLY CON...
- Publication number 20140124962
- Publication date May 8, 2014
- Honeywell International Inc.
- David Scheid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ASSEMBLING ELECTRIC COMPONENTS ON A FLEXIB...
- Publication number 20140069697
- Publication date Mar 13, 2014
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETEN
- Jeroen Van Den Brand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING 3D CIRCUITS FROM BARE DIE OR PACKAGED IC C...
- Publication number 20110237002
- Publication date Sep 29, 2011
- nScrypt, Inc.
- KENNETH H. CHURCH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR