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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80091
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Patents Grants
last 30 patents
Information
Patent Grant
Device and method for joining substrates
Patent number
12,087,726
Issue date
Sep 10, 2024
EV Group E. Thallner GmbH
Jürgen Burggraf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate bonding apparatus and method of manufacturing semiconduct...
Patent number
11,990,444
Issue date
May 21, 2024
Samsung Electronics Co., Ltd.
Taeyeong Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Front-to-back bonding with through-substrate via (TSV)
Patent number
11,791,241
Issue date
Oct 17, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating semiconductor device with re-fill layer
Patent number
11,646,292
Issue date
May 9, 2023
NANYA TECHNOLOGY CORPORATION
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,581,257
Issue date
Feb 14, 2023
Samsung Electronics Co., Ltd.
Hyuek Jae Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
Patent number
11,569,123
Issue date
Jan 31, 2023
Sony Corporation
Yoshihisa Kagawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
Patent number
10,985,102
Issue date
Apr 20, 2021
Sony Corporation
Yoshihisa Kagawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Front-to-back bonding with through-substrate via (TSV)
Patent number
10,847,443
Issue date
Nov 24, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
Patent number
10,431,621
Issue date
Oct 1, 2019
Sony Corporation
Yoshihisa Kagawa
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
Patent number
10,038,024
Issue date
Jul 31, 2018
Sony Corporation
Yoshihisa Kagawa
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Mechanisms for forming three-dimensional integrated circuit (3DIC)...
Patent number
9,929,050
Issue date
Mar 27, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
Patent number
9,911,778
Issue date
Mar 6, 2018
Sony Corporation
Yoshihisa Kagawa
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Front-to-back bonding with through-substrate via (TSV)
Patent number
9,831,156
Issue date
Nov 28, 2017
Taiwan Semiconductor Manufacturing Co., Ltd
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
Patent number
9,443,802
Issue date
Sep 13, 2016
Sony Corporation
Yoshihisa Kagawa
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Front-to-back bonding with through-substrate via (TSV)
Patent number
9,299,640
Issue date
Mar 29, 2016
Taiwan Semiconductor Manufacturing Co., Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
Patent number
9,111,763
Issue date
Aug 18, 2015
Sony Corporation
Yoshihisa Kagawa
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
Patent number
8,896,125
Issue date
Nov 25, 2014
Sony Corporation
Yoshihisa Kagawa
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
Publication number
20240266317
Publication date
Aug 8, 2024
Samsung Electronics Co., Ltd.
Taeyeong Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE AND METHOD FOR JOINING SUBSTRATES
Publication number
20240047414
Publication date
Feb 8, 2024
EV GROUP E. THALLNER GMBH
Jürgen Burggraf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW TEMPERATURE DIRECT BONDING
Publication number
20230361074
Publication date
Nov 9, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH RE-FILL LAYER
Publication number
20230110531
Publication date
Apr 13, 2023
NANYA TECHNOLOGY CORPORATION
Shing-Yih SHIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
Publication number
20210057373
Publication date
Feb 25, 2021
SAMSUNG ELECTRONICS CO,. LTD.
TAEYEONG KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FRONT-TO-BACK BONDING WITH THROUGH-SUBSTRATE VIA (TSV)
Publication number
20210043547
Publication date
Feb 11, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Jing-Cheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...
Publication number
20180277585
Publication date
Sep 27, 2018
SONY CORPORATION
Yoshihisa Kagawa
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
FRONT-TO-BACK BONDING WITH THROUGH-SUBSTRATE VIA (TSV)
Publication number
20180145011
Publication date
May 24, 2018
Taiwan Semiconductor Manufacturing Co., Ltd.
Jing-Cheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20150130085
Publication date
May 14, 2015
Mitsubishi Electric Corporation
Yasunari HINO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...
Publication number
20140362267
Publication date
Dec 11, 2014
Yoshihisa Kagawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...
Publication number
20130009321
Publication date
Jan 10, 2013
SONY CORPORATION
Yoshihisa Kagawa
H01 - BASIC ELECTRIC ELEMENTS