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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81091Under pressure

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,476,229
- Issue date Oct 18, 2022
- Kioxia Corporation
- Chikara Miyazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing joined structure
- Patent number 11,446,752
- Issue date Sep 20, 2022
- KOKI COMPANY LIMITED
- Satoshi Ootani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding with pre-deoxide process and apparatus for performing the same
- Patent number 11,342,302
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package
- Patent number 9,853,010
- Issue date Dec 26, 2017
- ELECTGRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with flip chip structure and fabrication metho...
- Patent number 9,673,163
- Issue date Jun 6, 2017
- Rohm Co., Ltd.
- Takukazu Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material and method for manufacturing semiconductor devic...
- Patent number 9,437,462
- Issue date Sep 6, 2016
- Dexerials Corporation
- Taichi Koyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 9,129,840
- Issue date Sep 8, 2015
- Fuji Electric Co., Ltd.
- Norihiro Nashida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing electronic component, and electronic compo...
- Patent number 8,531,028
- Issue date Sep 10, 2013
- Sumitomo Bakelite Co., Ltd.
- Kenzou Maejima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Connection components with rows of lead bond sections
- Patent number 5,959,354
- Issue date Sep 28, 1999
- Tessera, Inc.
- John W. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic element bonding with deformation of leads in rows
- Patent number 5,830,782
- Issue date Nov 3, 1998
- Tessera, Inc.
- John W. Smith
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGING STRUCTURE AND METHOD FOR PREPARING THE SAME, AND MET...
- Publication number 20230197666
- Publication date Jun 22, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEMS FOR BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES...
- Publication number 20230133526
- Publication date May 4, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Assembly Packaging Method, Semiconductor Assembly and...
- Publication number 20220216176
- Publication date Jul 7, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20200294960
- Publication date Sep 17, 2020
- Toshiba Memory Corporation
- Chikara MIYAZAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding with Pre-Deoxide Process and Apparatus for Performing the Same
- Publication number 20190326251
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20170141071
- Publication date May 18, 2017
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reflow Process and Tool
- Publication number 20150249062
- Publication date Sep 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ai-Tee Ang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20150123270
- Publication date May 7, 2015
- Kabushiki Kaisha Toshiba
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVIC...
- Publication number 20150079736
- Publication date Mar 19, 2015
- DEXERIALS CORPORATION
- Taichi KOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140361445
- Publication date Dec 11, 2014
- Norihiro NASHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...
- Publication number 20130324641
- Publication date Dec 5, 2013
- SUMITOMO BAKELITE CO., LTD.
- Kenzou MAEJIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVIC...
- Publication number 20130224913
- Publication date Aug 29, 2013
- DEXERIALS CORPORATION
- Taichi KOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF THE SEMICONDUCTOR DE...
- Publication number 20130092948
- Publication date Apr 18, 2013
- ROHM CO., LTD.
- Takukazu OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Metal for Hybridization and Related Methods
- Publication number 20120273951
- Publication date Nov 1, 2012
- Raytheon Company
- Jonathan Getty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...
- Publication number 20120061820
- Publication date Mar 15, 2012
- Kenzou Maejima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Microelectronic element bonding with deformation of leads in rows
- Publication number 20010000032
- Publication date Mar 15, 2001
- John W. Smith
- H01 - BASIC ELECTRIC ELEMENTS

Under pressure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device manufacturing method

Method for producing joined structure

Bonding with pre-deoxide process and apparatus for performing the same

Method of fabricating a semiconductor package

Semiconductor device with flip chip structure and fabrication metho...

Underfill material and method for manufacturing semiconductor devic...

Semiconductor device and method for manufacturing same

Method for manufacturing electronic component, and electronic compo...

Connection components with rows of lead bond sections

Microelectronic element bonding with deformation of leads in rows

Patents Applicationslast 30 patents

CHIP PACKAGING STRUCTURE AND METHOD FOR PREPARING THE SAME, AND MET...

BONDING SYSTEMS FOR BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES...

Semiconductor Assembly Packaging Method, Semiconductor Assembly and...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Bonding with Pre-Deoxide Process and Apparatus for Performing the Same

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE

Reflow Process and Tool

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVIC...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...

UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVIC...

SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF THE SEMICONDUCTOR DE...

Contact Metal for Hybridization and Related Methods

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...

Microelectronic element bonding with deformation of leads in rows