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H01L2224/95091

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/95091Under pressure

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Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor apparatus and bonding method thereof
- Patent number 12,308,337
- Issue date May 20, 2025
- Diodes Incorporated
- Duane Wilcoxen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 12,080,678
- Issue date Sep 3, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,581,257
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Hyuek Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 11,410,962
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 11,410,963
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 10,840,210
- Issue date Nov 17, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 10,840,209
- Issue date Nov 17, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for simultaneously bonding multiple chips of different heigh...
- Patent number 10,147,702
- Issue date Dec 4, 2018
- Palo Alto Research Center Incorporated
- Brent S. Krusor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch process for connecting chips to a carrier
- Patent number 9,673,170
- Issue date Jun 6, 2017
- Infineon Technologies AG
- Rupert Fischer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW TEMPERATURE DIRECT BONDING
- Publication number 20230361074
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20230197669
- Publication date Jun 22, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20210091037
- Publication date Mar 25, 2021
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20210074671
- Publication date Mar 11, 2021
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20200212000
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20200211999
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SIMULTANEOUSLY BONDING MULTIPLE CHIPS OF DIFFERENT HEIGH...
- Publication number 20180114772
- Publication date Apr 26, 2018
- Palo Alto Research Center Incorporated
- Brent S. Krusor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Batch Process for Connecting Chips to a Carrier
- Publication number 20160043054
- Publication date Feb 11, 2016
- INFINEON TECHNOLOGIES AG
- Rupert Fischer
- H01 - BASIC ELECTRIC ELEMENTS

Under pressure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power semiconductor apparatus and bonding method thereof

Methods and systems for manufacturing semiconductor devices

Semiconductor package

Methods and systems for manufacturing semiconductor devices

Methods and systems for manufacturing semiconductor devices

Methods and systems for manufacturing semiconductor devices

Methods and systems for manufacturing semiconductor devices

Method for simultaneously bonding multiple chips of different heigh...

Batch process for connecting chips to a carrier

Patents Applicationslast 30 patents

LOW TEMPERATURE DIRECT BONDING

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES

METHOD FOR SIMULTANEOUSLY BONDING MULTIPLE CHIPS OF DIFFERENT HEIGH...

Batch Process for Connecting Chips to a Carrier