Under pressure

Industry

CPC
H01L2224/83091

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83091Under pressure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Submodule semiconductor package
- Patent number 12,205,918
- Issue date Jan 21, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- JooYang Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module and manufacturing method thereof
- Patent number 11,817,414
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element bonding structure, method for producing semic...
- Patent number 11,810,885
- Issue date Nov 7, 2023
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connecting structure having nano-twins copper
- Patent number 11,715,721
- Issue date Aug 1, 2023
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connecting structure having nano-twins copper and method...
- Patent number 11,145,619
- Issue date Oct 12, 2021
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positioning device
- Patent number 11,075,102
- Issue date Jul 27, 2021
- Suss MicroTec Lithography GmbH
- Sven Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bonding method
- Patent number 10,910,339
- Issue date Feb 2, 2021
- Samsung Electronics Co., Ltd.
- Hwail Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer bonding method and wafer to wafer bonding system
- Patent number 10,811,381
- Issue date Oct 20, 2020
- Samsung Electronics Co., Ltd.
- Joon-Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package having a multi-thickness conductor layer and me...
- Patent number 10,770,444
- Issue date Sep 8, 2020
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a chip assembly with a die attach liquid
- Patent number 9,837,381
- Issue date Dec 5, 2017
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for mounting flip chip for use in a method for producing a...
- Patent number 9,748,195
- Issue date Aug 29, 2017
- Sekisui Chemical Co., Ltd.
- Sayaka Wakioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with flip chip structure and fabrication metho...
- Patent number 9,673,163
- Issue date Jun 6, 2017
- Rohm Co., Ltd.
- Takukazu Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus and chip bonding method
- Patent number 9,570,417
- Issue date Feb 14, 2017
- Samsung Display Co., Ltd.
- Seong Beom Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including bonding layer having Ag3Sn
- Patent number 9,520,377
- Issue date Dec 13, 2016
- Samsung Electronics Co., Ltd.
- Jeong-Won Yoon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Jointed structure and method of manufacturing same
- Patent number 9,349,704
- Issue date May 24, 2016
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Tadashi Oshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a fan-out WLP with package
- Patent number 9,337,165
- Issue date May 10, 2016
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and adhesive for moun...
- Patent number 9,209,155
- Issue date Dec 8, 2015
- Sekisui Chemical Co., Ltd.
- Sayaka Wakioka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip bonding apparatus and method of forming semicond...
- Patent number 9,082,885
- Issue date Jul 14, 2015
- Samsung Electronics Co., Ltd.
- Yoshiaki Yukimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-phase intermetallic interconnection structure and method of fa...
- Patent number 8,742,600
- Issue date Jun 3, 2014
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip mounting method and method for connecting substrates
- Patent number 7,820,021
- Issue date Oct 26, 2010
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting method and method for connecting substrates
- Patent number 7,531,385
- Issue date May 12, 2009
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
System and Method for Bonding Semiconductor Devices
- Publication number 20240395766
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES WITH THERMAL INTERFACE STRUCTURE
- Publication number 20240234243
- Publication date Jul 11, 2024
- Tesla, Inc.
- Aydin Nabovati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS AIR VENT
- Publication number 20240063067
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20240030176
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Ji-Yong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAG...
- Publication number 20230326948
- Publication date Oct 12, 2023
- Samsung Electronics Co., Ltd.
- Wenjun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE TRANSFER FILM AND METHOD FOR MANUFACTURING POWER MODULE SU...
- Publication number 20230178509
- Publication date Jun 8, 2023
- AMOSENSE CO., LTD.
- Younghwan JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING COMPOSITION
- Publication number 20220371089
- Publication date Nov 24, 2022
- Alpha Assembly Solutions Inc.
- Shamik GHOSHAL
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SILVER NANOPARTICLES SYNTHESIS METHOD FOR LOW TEMPERATURE AND PRESS...
- Publication number 20220108975
- Publication date Apr 7, 2022
- STMicroelectronics S.r.l.
- Cristina MANOLA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
DISPLAY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20220013489
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER
- Publication number 20210407960
- Publication date Dec 30, 2021
- National Yang Ming Chiao Tung University
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER AND METHOD...
- Publication number 20210020599
- Publication date Jan 21, 2021
- NATIONAL CHIAO-TUNG UNIVERSITY
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET FOR SINTERING BONDING, SHEET FOR SINTERING BONDING WITH BASE...
- Publication number 20200294952
- Publication date Sep 17, 2020
- Nitto Denko Corporation
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP BONDING METHOD
- Publication number 20200058615
- Publication date Feb 20, 2020
- Samsung Electronics Co., Ltd.
- HWAIL JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TO WAFER BONDING METHOD AND WAFER TO WAFER BONDING SYSTEM
- Publication number 20200043884
- Publication date Feb 6, 2020
- Samsung Electronics Co., Ltd.
- JOON-HO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITIONING DEVICE
- Publication number 20180138070
- Publication date May 17, 2018
- SUSS MICROTEC LITHOGRAPHY GMBH
- Sven Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE
- Publication number 20170033076
- Publication date Feb 2, 2017
- NITTO DENKO CORPORATION
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS AND CHIP BONDING METHOD
- Publication number 20160155719
- Publication date Jun 2, 2016
- SAMSUNG DISPLAY CO., LTD.
- Seong Beom JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINTED STRUCTURE AND METHOD OF MANUFACTURING SAME
- Publication number 20150270238
- Publication date Sep 24, 2015
- KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
- Tadashi OSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20150115452
- Publication date Apr 30, 2015
- Samsung Electronics Co., Ltd.
- Jeong-Won YOON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP-ON-WAFER BONDING METHOD AND BONDING DEVICE, AND STRUCTURE COMP...
- Publication number 20150048523
- Publication date Feb 19, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fan-Out WLP With Package
- Publication number 20150044824
- Publication date Feb 12, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP BONDING APPARATUS AND METHOD OF FORMING SEMICOND...
- Publication number 20150024551
- Publication date Jan 22, 2015
- Samsung Electronics Co., Ltd.
- Yoshiaki YUKIMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sintering Utilizing Non-Mechanical Pressure
- Publication number 20140224409
- Publication date Aug 14, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- B32 - LAYERED PRODUCTS
Information Patent Application
DUAL-PHASE INTERMETALLIC INTERCONNECTION STRUCTURE AND METHOD OF FA...
- Publication number 20140097534
- Publication date Apr 10, 2014
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF THE SEMICONDUCTOR DE...
- Publication number 20130092948
- Publication date Apr 18, 2013
- ROHM CO., LTD.
- Takukazu OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WLP WITH PACKAGE
- Publication number 20120313253
- Publication date Dec 13, 2012
- Tessera, Inc.
- Yoshikuni Nakadaira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATING APPARATUS AND IMPLEMENTED BODY MANUFACTURING METHOD
- Publication number 20120279653
- Publication date Nov 8, 2012
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Takashi Matsumura
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BO...
- Publication number 20120126379
- Publication date May 24, 2012
- Daisuke UENDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Flip chip mounting method and method for connecting substrates
- Publication number 20090126876
- Publication date May 21, 2009
- Matsushita Electric Industrial Co., Ltd.
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Under pressure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Submodule semiconductor package

Display module and manufacturing method thereof

Semiconductor element bonding structure, method for producing semic...

Electrical connecting structure having nano-twins copper

Chip assembly

Electrical connecting structure having nano-twins copper and method...

Positioning device

Flip chip bonding method

Wafer to wafer bonding method and wafer to wafer bonding system

Electronics package having a multi-thickness conductor layer and me...

Chip assembly

Method of forming a chip assembly with a die attach liquid

Adhesive for mounting flip chip for use in a method for producing a...

Semiconductor device with flip chip structure and fabrication metho...

Chip bonding apparatus and chip bonding method

Semiconductor device package including bonding layer having Ag3Sn

Jointed structure and method of manufacturing same

Method for manufacturing a fan-out WLP with package

Method for manufacturing semiconductor device and adhesive for moun...

Chip-on-wafer bonding method and bonding device, and structure comp...

Semiconductor chip bonding apparatus and method of forming semicond...

Dual-phase intermetallic interconnection structure and method of fa...

Flip chip mounting method and method for connecting substrates

Flip chip mounting method and method for connecting substrates

Patents Applicationslast 30 patents

System and Method for Bonding Semiconductor Devices

ELECTRONIC ASSEMBLIES WITH THERMAL INTERFACE STRUCTURE

SEMICONDUCTOR DEVICE WITH A POROUS AIR VENT

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAG...

ADHESIVE TRANSFER FILM AND METHOD FOR MANUFACTURING POWER MODULE SU...

SINTERING COMPOSITION

SILVER NANOPARTICLES SYNTHESIS METHOD FOR LOW TEMPERATURE AND PRESS...

DISPLAY MODULE AND MANUFACTURING METHOD THEREOF

ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER

ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER AND METHOD...

SHEET FOR SINTERING BONDING, SHEET FOR SINTERING BONDING WITH BASE...

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

FLIP CHIP BONDING METHOD

WAFER TO WAFER BONDING METHOD AND WAFER TO WAFER BONDING SYSTEM

POSITIONING DEVICE

PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE

CHIP BONDING APPARATUS AND CHIP BONDING METHOD

JOINTED STRUCTURE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

CHIP-ON-WAFER BONDING METHOD AND BONDING DEVICE, AND STRUCTURE COMP...

Fan-Out WLP With Package

SEMICONDUCTOR CHIP BONDING APPARATUS AND METHOD OF FORMING SEMICOND...

Sintering Utilizing Non-Mechanical Pressure

DUAL-PHASE INTERMETALLIC INTERCONNECTION STRUCTURE AND METHOD OF FA...

SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF THE SEMICONDUCTOR DE...

FAN-OUT WLP WITH PACKAGE

HEATING APPARATUS AND IMPLEMENTED BODY MANUFACTURING METHOD

DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BO...

Flip chip mounting method and method for connecting substrates