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H01L2224/85091
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/85091
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last 30 patents
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Patent Application
PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL
Publication number
20240379613
Publication date
Nov 14, 2024
SHINKAWA LTD.
Hiroshi MUNAKATA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20230317657
Publication date
Oct 5, 2023
Samsung Electronics Co., Ltd.
Wonil SEO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEV...
Publication number
20220208721
Publication date
Jun 30, 2022
SHINKAWA LTD.
Hiroaki YOSHINO
H01 - BASIC ELECTRIC ELEMENTS