Uniform resistance

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H05K2201/0784

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/0784Uniform resistance

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 11,849,618
- Issue date Dec 19, 2023
- Innolux Corporation
- Shu-Hui Yang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Electronic device
- Patent number 11,217,655
- Issue date Jan 4, 2022
- Innolux Corporation
- Shu-Hui Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,901,275
- Issue date Jan 26, 2021
- Samsung Display Co., Ltd.
- Yeon-Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for substrate of flat panel display device
- Patent number 10,206,291
- Issue date Feb 12, 2019
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Li Chai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a signal transition component having a C-sh...
- Patent number 10,193,206
- Issue date Jan 29, 2019
- Telefonaktiebolaget LM Ericsson (publ)
- Per Ligander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trace border routing
- Patent number 9,781,823
- Issue date Oct 3, 2017
- Apple Inc.
- Benjamin B. Lyon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayer ceramic capacitor and board having the same
- Patent number 9,653,213
- Issue date May 16, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Sang Soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trace border routing
- Patent number 9,491,852
- Issue date Nov 8, 2016
- Apple Inc.
- Benjamin B. Lyon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive particles, method for producing conductive particles, co...
- Patent number 9,446,484
- Issue date Sep 20, 2016
- Sekisui Chemical Co., Ltd.
- Ryohei Masui
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Array substrate, manufacturing method thereof, and flat panel displ...
- Patent number 9,210,797
- Issue date Dec 8, 2015
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Li Chai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, and method of supplying power and forming wir...
- Patent number 8,982,576
- Issue date Mar 17, 2015
- NEC Corporation
- Kazuhiro Kashiwakura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection line device, image display apparatus, and method fo...
- Patent number 8,416,223
- Issue date Apr 9, 2013
- NLT Technologies, Ltd.
- Akihiro Yajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protection for an integrated circuit
- Patent number 8,390,971
- Issue date Mar 5, 2013
- NXP B.V.
- Hans-Martin Ritter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element and display device provided with the same
- Patent number 8,299,631
- Issue date Oct 30, 2012
- Sharp Kabushiki Kaisha
- Takeshi Horiguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan-out unit and thin-film transistor array substrate having the same
- Patent number 8,222,644
- Issue date Jul 17, 2012
- Samsung Electronics Co., Ltd.
- Sung-Hoon Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Array substrate for liquid crystal display device
- Patent number 8,174,471
- Issue date May 8, 2012
- LG Display Co. Ltd.
- Hyun-Chul Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flat panel display and chip bonding pad
- Patent number 8,059,249
- Issue date Nov 15, 2011
- Au Optronics Corporation
- Chun-Hsin Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 7,932,470
- Issue date Apr 26, 2011
- Mitsui Mining & Smelting Co., Ltd.
- Hiroaki Kurihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making multi-chip electronic package with reduced line skew
- Patent number 7,622,384
- Issue date Nov 24, 2009
- Endicott Interconnect Technologies, Inc.
- Irving Memis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power plane to reduce voltage difference between connector power pins
- Patent number 7,492,605
- Issue date Feb 17, 2009
- Intel Corporation
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan-out wire structure
- Patent number 7,459,780
- Issue date Dec 2, 2008
- AU OPTRONICS CORPORATION
- Wan-Jung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip electronic package with reduced line skew and circuitize...
- Patent number 7,332,818
- Issue date Feb 19, 2008
- Endicott Interconnect Technologies, Inc.
- Irving Memis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having transmission lines with varying thickn...
- Patent number 5,541,369
- Issue date Jul 30, 1996
- Nitto Denko Corporation
- Hiroshi Tahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for optimizing a conductor-path layout for a print head of a...
- Patent number 5,400,063
- Issue date Mar 21, 1995
- Mannesmann Aktiengesellschaft
- Andreas Kappel
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME
- Publication number 20160111214
- Publication date Apr 21, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Sang Soo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20160057864
- Publication date Feb 25, 2016
- Kabushiki Kaisha Toshiba
- Hiroshi Matsuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PARTICLES, METHOD FOR PRODUCING CONDUCTIVE PARTICLES, CO...
- Publication number 20150008022
- Publication date Jan 8, 2015
- Sekisui Chemical Co., Ltd.
- Ryohei Masui
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARRAY SUBATRATE, MANUFACTURING METHOD THEREOF, AND FLAT PANEL DISPL...
- Publication number 20140374140
- Publication date Dec 25, 2014
- SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Li Chai
- G02 - OPTICS
Information Patent Application
HIGH PERFORMANCE PRINTED CIRCUIT BOARD
- Publication number 20140326495
- Publication date Nov 6, 2014
- Amphenol Corporation
- Jose Ricardo Paniagua
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERPOSER SUBSTRATE, ELECTRONIC DEVICE PACKAGE, AND ELECTRONIC COM...
- Publication number 20140009898
- Publication date Jan 9, 2014
- FUJIKURA LTD.
- Satoshi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED LIGHT BAR WITH BALANCED RESISTANCE FOR LIGHT EMTITTING DIODES T...
- Publication number 20130286644
- Publication date Oct 31, 2013
- HON HAI Precision Industry CO., LTD.
- CHIH-CHEN LAI
- F21 - LIGHTING
Information Patent Application
PRINTED WIRING BOARD, AND METHOD OF SUPPLYING POWER AND FORMING WIR...
- Publication number 20130170155
- Publication date Jul 4, 2013
- NEC Corporation
- Kazuhiro Kashiwakura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20120261175
- Publication date Oct 18, 2012
- HON HAI Precision Industry CO., LTD.
- TSUNG-SHENG HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRACE BORDER ROUTING
- Publication number 20120092273
- Publication date Apr 19, 2012
- Benjamin B. LYON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROTECTION FOR AN INTEGRATED CIRCUIT
- Publication number 20110216459
- Publication date Sep 8, 2011
- NXP B.V.
- Hans-Martin Ritter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR ELEMENT AND DISPLAY DEVICE PROVIDED WITH THE SAME
- Publication number 20110193239
- Publication date Aug 11, 2011
- Sharp Kabushiki Kaisha
- Takeshi Horiguchi
- G02 - OPTICS
Information Patent Application
FAN-OUT UNIT AND THIN-FILM TRANSISTOR ARRAY SUBSTRATE HAVING THE SAME
- Publication number 20100155729
- Publication date Jun 24, 2010
- Sung-Hoon Yang
- G02 - OPTICS
Information Patent Application
INTERCONNECTION LINE DEVICE, IMAGE DISPLAY APPARATUS, AND METHOD FO...
- Publication number 20100066709
- Publication date Mar 18, 2010
- NEC LCD Technologies, Ltd.
- AKIHIRO YAJIMA
- G02 - OPTICS
Information Patent Application
Display Device
- Publication number 20090295700
- Publication date Dec 3, 2009
- Hitachi Displays, Ltd.
- Osamu Nagashima
- G02 - OPTICS
Information Patent Application
FLAT PANEL DISPLAY AND CHIP BONDING PAD
- Publication number 20090284909
- Publication date Nov 19, 2009
- AU OPTRONICS CORPORATION
- Chun-Hsin Liu
- G02 - OPTICS
Information Patent Application
ARRAY SUBSTRATE FOR LIQUID CRYSTAL DISPLAY DEVICE
- Publication number 20090167654
- Publication date Jul 2, 2009
- Hyun-Chul Kim
- G02 - OPTICS
Information Patent Application
FLAT PANEL DISPLAY
- Publication number 20080231165
- Publication date Sep 25, 2008
- Samsung SDI Co., Ltd
- Byong-Gon LEE
- G02 - OPTICS
Information Patent Application
Method of making multi-chip electronic package with reduced line skew
- Publication number 20080102562
- Publication date May 1, 2008
- Endicott Interconnect Tehnologies, Inc.
- Irving Memis
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Printed Wiring Board
- Publication number 20080053691
- Publication date Mar 6, 2008
- Mitsui Mining and Smelting Co., Ltd.
- Hiroaki Kurihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power plane to reduce voltage difference between connector power pins
- Publication number 20070295818
- Publication date Dec 27, 2007
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fan-out wire structure
- Publication number 20070052895
- Publication date Mar 8, 2007
- Wan-Jung Chen
- G02 - OPTICS
Information Patent Application
Multi-chip electronic package with reduced line skew, method of mak...
- Publication number 20060255460
- Publication date Nov 16, 2006
- Endicott Interconnect Technologies, Inc.
- Irving Memis
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Uniform resistance

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device

Electronic device

Display device

Manufacturing method for substrate of flat panel display device

Method of manufacturing a signal transition component having a C-sh...

Trace border routing

Multilayer ceramic capacitor and board having the same

Trace border routing

Conductive particles, method for producing conductive particles, co...

Array substrate, manufacturing method thereof, and flat panel displ...

Printed wiring board, and method of supplying power and forming wir...

Interconnection line device, image display apparatus, and method fo...

Protection for an integrated circuit

Semiconductor element and display device provided with the same

Fan-out unit and thin-film transistor array substrate having the same

Array substrate for liquid crystal display device

Flat panel display and chip bonding pad

Printed wiring board

Method of making multi-chip electronic package with reduced line skew

Power plane to reduce voltage difference between connector power pins

Fan-out wire structure

Multi-chip electronic package with reduced line skew and circuitize...

Printed circuit board having transmission lines with varying thickn...

Method for optimizing a conductor-path layout for a print head of a...

Patents Applicationslast 30 patents

MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME

SEMICONDUCTOR MODULE

CONDUCTIVE PARTICLES, METHOD FOR PRODUCING CONDUCTIVE PARTICLES, CO...

ARRAY SUBATRATE, MANUFACTURING METHOD THEREOF, AND FLAT PANEL DISPL...

HIGH PERFORMANCE PRINTED CIRCUIT BOARD

INTERPOSER SUBSTRATE, ELECTRONIC DEVICE PACKAGE, AND ELECTRONIC COM...

LED LIGHT BAR WITH BALANCED RESISTANCE FOR LIGHT EMTITTING DIODES T...

PRINTED WIRING BOARD, AND METHOD OF SUPPLYING POWER AND FORMING WIR...

PRINTED CIRCUIT BOARD

TRACE BORDER ROUTING

PROTECTION FOR AN INTEGRATED CIRCUIT

SEMICONDUCTOR ELEMENT AND DISPLAY DEVICE PROVIDED WITH THE SAME

FAN-OUT UNIT AND THIN-FILM TRANSISTOR ARRAY SUBSTRATE HAVING THE SAME

INTERCONNECTION LINE DEVICE, IMAGE DISPLAY APPARATUS, AND METHOD FO...

Display Device

FLAT PANEL DISPLAY AND CHIP BONDING PAD

ARRAY SUBSTRATE FOR LIQUID CRYSTAL DISPLAY DEVICE

FLAT PANEL DISPLAY

Method of making multi-chip electronic package with reduced line skew

Printed Wiring Board

Power plane to reduce voltage difference between connector power pins

Fan-out wire structure

Multi-chip electronic package with reduced line skew, method of mak...