TREA

Upper part of the bonding apparatus, i.e. bonding head

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Industry

  • CPC
  • H01L2224/77821
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/77821Upper part of the bonding apparatus, i.e. bonding head
Industries

Patents Grantslast 30 patents