Upper part of the bonding apparatus

Industry

CPC
H01L2224/75821

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75821Upper part of the bonding apparatus

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Apparatus, control method and control device of semiconductor packa...
- Patent number 11,774,935
- Issue date Oct 3, 2023
- CAPCON LIMITED
- Hong Gang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement and method for joining at least two joining partners
- Patent number 11,676,933
- Issue date Jun 13, 2023
- Infineon Technologies AG
- Steffen Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering tool and method for sintering an electronic subassembly
- Patent number 11,400,514
- Issue date Aug 2, 2022
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sintering tool and method for sintering an electronic subassembly
- Patent number 10,814,396
- Issue date Oct 27, 2020
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sintering device
- Patent number 10,483,229
- Issue date Nov 19, 2019
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Die bonding apparatus comprising an inert gas environment
- Patent number 10,475,763
- Issue date Nov 12, 2019
- ASM Technology Singapore Pte. Ltd.
- Siu Wing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer device with three machine bases and transfer method thereof
- Patent number 10,269,596
- Issue date Apr 23, 2019
- BOE Technology Group Co., Ltd.
- Xiaolong He
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Mounting device and mounting method
- Patent number 10,199,349
- Issue date Feb 5, 2019
- Toray Engineering Co., Ltd.
- Katsumi Terada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding system and cleaning method thereof
- Patent number 9,917,069
- Issue date Mar 13, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting method
- Patent number 9,609,760
- Issue date Mar 28, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for mounting semiconductor device
- Patent number 9,130,011
- Issue date Sep 8, 2015
- Samsung Electronics Co., Ltd.
- Taehyun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding tool, electronic component mounting apparatus, and manufact...
- Patent number 8,973,807
- Issue date Mar 10, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Ryo Fujita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for mounting semiconductor light-emitting element
- Patent number 8,893,377
- Issue date Nov 25, 2014
- Panasonic Corporation
- Tomonori Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die including locking bump and method of making same
- Patent number 7,800,225
- Issue date Sep 21, 2010
- Intel Corporation
- Seon-ho Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY
- Publication number 20210016353
- Publication date Jan 21, 2021
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Arrangement and Method for Joining at Least Two Joining Partners
- Publication number 20200294956
- Publication date Sep 17, 2020
- Steffen Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, CONTROL METHOD AND CONTROL DEVICE OF SEMICONDUCTOR PACKA...
- Publication number 20200241498
- Publication date Jul 30, 2020
- CAPCON LIMITED
- Hong Gang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20180019223
- Publication date Jan 18, 2018
- TORAY ENGINEERING CO., LTD.
- Katsumi TERADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY
- Publication number 20170216920
- Publication date Aug 3, 2017
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS COMPRISING AN INERT GAS ENVIRONMENT
- Publication number 20160351527
- Publication date Dec 1, 2016
- ASM Technology Singapore Pte Ltd
- Siu Wing LAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...
- Publication number 20140096379
- Publication date Apr 10, 2014
- PANASONIC CORPORATION
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL, APPARATUS FOR MOUNTING ELECTRONIC COMPONENT, AND METH...
- Publication number 20130026211
- Publication date Jan 31, 2013
- Panasonic Coporation
- Ryo Fujita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR MOUNTING SEMICONDUCTOR LIGHT EMITTING ELEMENT
- Publication number 20120070917
- Publication date Mar 22, 2012
- PANASONIC CORPORATION
- Tomonori Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICE
- Publication number 20110232082
- Publication date Sep 29, 2011
- TAEHYUN KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectronic Die Including Locking Bump and Method of Making Same
- Publication number 20080303143
- Publication date Dec 11, 2008
- Seon-ho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joining method and joining device
- Publication number 20070105459
- Publication date May 10, 2007
- Tsuyoshi Aruga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Upper part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus, control method and control device of semiconductor packa...

Arrangement and method for joining at least two joining partners

Sintering tool and method for sintering an electronic subassembly

Sintering tool and method for sintering an electronic subassembly

Sintering device

Die bonding apparatus comprising an inert gas environment

Transfer device with three machine bases and transfer method thereof

Mounting device and mounting method

Hybrid bonding system and cleaning method thereof

Electronic component mounting method

Apparatus for mounting semiconductor device

Bonding tool, electronic component mounting apparatus, and manufact...

Apparatus and method for mounting semiconductor light-emitting element

Microelectronic die including locking bump and method of making same

Patents Applicationslast 30 patents

SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY

Arrangement and Method for Joining at Least Two Joining Partners

APPARATUS, CONTROL METHOD AND CONTROL DEVICE OF SEMICONDUCTOR PACKA...

MOUNTING DEVICE AND MOUNTING METHOD

SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY

DIE BONDING APPARATUS COMPRISING AN INERT GAS ENVIRONMENT

ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...

BONDING TOOL, APPARATUS FOR MOUNTING ELECTRONIC COMPONENT, AND METH...

APPARATUS AND METHOD FOR MOUNTING SEMICONDUCTOR LIGHT EMITTING ELEMENT

APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICE

Microelectronic Die Including Locking Bump and Method of Making Same

Joining method and joining device