Uranium [U]

Industry

CPC
H01L2924/01092

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01092Uranium [U]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Cu column, Cu core column, solder joint, and through-silicon via
- Patent number 10,811,376
- Issue date Oct 20, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of manufacturing cu core ball
- Patent number 10,370,771
- Issue date Aug 6, 2019
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of refining solder materials
- Patent number 9,666,547
- Issue date May 30, 2017
- Honeywell International Inc.
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Core ball, solder paste, formed-solder, flux-coated core ball and s...
- Patent number 9,278,409
- Issue date Mar 8, 2016
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core bal...
- Patent number 9,266,196
- Issue date Feb 23, 2016
- Senju Metal Industry Co., Ltd.
- Takashi Akagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan-out chip scale package
- Patent number 8,679,963
- Issue date Mar 25, 2014
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out chip scale package
- Patent number 8,482,136
- Issue date Jul 9, 2013
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 8,193,617
- Issue date Jun 5, 2012
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for non-conductively interconnecting integrated circuits
- Patent number 7,869,221
- Issue date Jan 11, 2011
- Oracle America, Inc.
- Thomas F. Knight
- G01 - MEASURING TESTING
Information Patent Grant
Structure for reduction of soft error rates in integrated circuits
- Patent number 7,781,871
- Issue date Aug 24, 2010
- International Business Machines Corporation
- Cyril Cabral, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reduction of soft error rates in integrated circuits
- Patent number 7,601,627
- Issue date Oct 13, 2009
- International Business Machines Corporation
- Cyril Cabral, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicone-based adhesive sheet, method of bonding a semiconductor ch...
- Patent number 7,534,659
- Issue date May 19, 2009
- Dow Corning Toray Silicone Company, Ltd.
- Manabu Sutoh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Methods of refining lead-containing materials
- Patent number 7,521,286
- Issue date Apr 21, 2009
- Honeywell International Inc.
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip module
- Patent number 7,397,140
- Issue date Jul 8, 2008
- Infineon Technologies AG
- Frank Puschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and structure for reduction of soft error rates in integrate...
- Patent number 7,381,635
- Issue date Jun 3, 2008
- International Business Machines Corporation
- Cyril Cabral, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive sheet of cross-linked silicone, method of manufacturing th...
- Patent number 7,198,853
- Issue date Apr 3, 2007
- Dow Corning Toray Silicone, Co., Ltd.
- Yoshito Ushio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having projected electrodes and structure for...
- Patent number 7,084,498
- Issue date Aug 1, 2006
- Renesas Technology Corp.
- Yoshihide Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for accelerated detection of transient particle i...
- Patent number 7,084,660
- Issue date Aug 1, 2006
- International Business Machines Corporation
- Jerry D. Ackaret
- G01 - MEASURING TESTING
Information Patent Grant
Lead free bump and method of forming the same
- Patent number 7,012,333
- Issue date Mar 14, 2006
- Ebara Corporation
- Masashi Shimoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 6,919,622
- Issue date Jul 19, 2005
- Renesas Technology Corp.
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for non-conductively interconnecting integrate...
- Patent number 6,916,719
- Issue date Jul 12, 2005
- Thomas F. Knight
- G01 - MEASURING TESTING
Information Patent Grant
Solder bonding method, and electronic device and process for fabric...
- Patent number 6,740,823
- Issue date May 25, 2004
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for non-conductively interconnecting integrate...
- Patent number 6,728,113
- Issue date Apr 27, 2004
- Polychip, Inc.
- Thomas F. Knight
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device
- Patent number 6,720,208
- Issue date Apr 13, 2004
- Renesas Technology Corporation
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element and fabricating method thereof
- Patent number 6,569,752
- Issue date May 27, 2003
- Kabushiki Kaisha Toshiba
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,531,760
- Issue date Mar 11, 2003
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bonding method, and process of making electronic device
- Patent number 6,457,233
- Issue date Oct 1, 2002
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 6,326,681
- Issue date Dec 4, 2001
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,303,982
- Issue date Oct 16, 2001
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for connecting two electronic components
- Patent number 6,281,445
- Issue date Aug 28, 2001
- NEC Corporation
- Takashi Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING SYSTEMS AND RELATED METHODS
- Publication number 20190013290
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Wentao QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu Column, Cu Core Column, Solder Joint, and Through-Silicon Via
- Publication number 20170287862
- Publication date Oct 5, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- B32 - LAYERED PRODUCTS
Information Patent Application
Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BAL...
- Publication number 20150217409
- Publication date Aug 6, 2015
- Senju Metal lndustry Co., Ltd.
- Takashi AKAGAWA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CORE BALL, SOLDER PASTE, FORMED-SOLDER, FLUX-COATED CORE BALL AND S...
- Publication number 20150217408
- Publication date Aug 6, 2015
- Senju Metal lndustry Co., Ltd.
- Hiroyoshi KAWASAKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT
- Publication number 20150209912
- Publication date Jul 30, 2015
- Senju Metal lndustry Co., Ltd.
- Hiroyoshi KAWASAKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
FAN-OUT CHIP SCALE PACKAGE
- Publication number 20130273731
- Publication date Oct 17, 2013
- Jan GULPEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT CHIP SCALE PACKAGE
- Publication number 20110156237
- Publication date Jun 30, 2011
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REFINING SOLDER MATERIALS
- Publication number 20100206133
- Publication date Aug 19, 2010
- Honeywell International Inc.
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20090302471
- Publication date Dec 10, 2009
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR REDUCTION OF SOFT ERROR RATES IN INTEGRATED CIRCUITS
- Publication number 20090243053
- Publication date Oct 1, 2009
- International Business Machines Corporation
- Cyril Cabral, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR NON-CONDUCTIVELY INTERCONNECTING INTEGRATE...
- Publication number 20080315978
- Publication date Dec 25, 2008
- SUN MICROSYSTEMS, INC.
- Thomas F. Knight
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND STRUCTURE FOR REDUCTION OF SOFT ERROR RATES IN INTEGRATE...
- Publication number 20080164584
- Publication date Jul 10, 2008
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-containing anodes
- Publication number 20070045838
- Publication date Mar 1, 2007
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-containing solder paste
- Publication number 20070045839
- Publication date Mar 1, 2007
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-containing solder bumps
- Publication number 20070045842
- Publication date Mar 1, 2007
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and structure for reduction of soft error rates in integrate...
- Publication number 20070013073
- Publication date Jan 18, 2007
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of refining lead-containing materials
- Publication number 20060201279
- Publication date Sep 14, 2006
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tools and methods for forming conductive bumps on microelectronic e...
- Publication number 20060183270
- Publication date Aug 17, 2006
- Tessera, Inc.
- Giles Humpston
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicone-based adhesive sheet, method of bonding a semiconductor ch...
- Publication number 20060057779
- Publication date Mar 16, 2006
- Manabu Sutoh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Chip module
- Publication number 20060049532
- Publication date Mar 9, 2006
- Infineon Technologies AG
- Frank Puschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method of forming a lead-free bump and a plating apparatus therefor
- Publication number 20050279640
- Publication date Dec 22, 2005
- Masashi Shimoyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for non-conductively interconnecting integrate...
- Publication number 20050002448
- Publication date Jan 6, 2005
- Polychip
- Thomas F. Knight
- G01 - MEASURING TESTING
Information Patent Application
Anodes for electroplating operations, and methods of forming materi...
- Publication number 20050000821
- Publication date Jan 6, 2005
- Tamara L White
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADHESIVE SHEET OF CROSS-LINKED SILICONE, METHOD OF MANUFACTURING TH...
- Publication number 20040265599
- Publication date Dec 30, 2004
- Yoshito Ushio
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Lead free bump and method of forming the same
- Publication number 20040219775
- Publication date Nov 4, 2004
- Masashi Shimoyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor device
- Publication number 20040155323
- Publication date Aug 12, 2004
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor packages; lead-containing solders and anodes; and met...
- Publication number 20040065954
- Publication date Apr 8, 2004
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor element, manufacturing method thereof and BGA-type se...
- Publication number 20030183932
- Publication date Oct 2, 2003
- Rika Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030127712
- Publication date Jul 10, 2003
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and structure for mounting the same
- Publication number 20030071331
- Publication date Apr 17, 2003
- Yoshihide Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS

Uranium [U]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cu column, Cu core column, solder joint, and through-silicon via

Method of manufacturing cu core ball

Method of refining solder materials

Core ball, solder paste, formed-solder, flux-coated core ball and s...

Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core bal...

Fan-out chip scale package

Fan-out chip scale package

Semiconductor device and manufacturing method therefor

Apparatus for non-conductively interconnecting integrated circuits

Structure for reduction of soft error rates in integrated circuits

Method for reduction of soft error rates in integrated circuits

Silicone-based adhesive sheet, method of bonding a semiconductor ch...

Methods of refining lead-containing materials

Chip module

Method and structure for reduction of soft error rates in integrate...

Adhesive sheet of cross-linked silicone, method of manufacturing th...

Semiconductor device having projected electrodes and structure for...

System and method for accelerated detection of transient particle i...

Lead free bump and method of forming the same

Semiconductor device

Method and apparatus for non-conductively interconnecting integrate...

Solder bonding method, and electronic device and process for fabric...

Method and apparatus for non-conductively interconnecting integrate...

Semiconductor device

Semiconductor element and fabricating method thereof

Semiconductor device

Solder bonding method, and process of making electronic device

Semiconductor device

Semiconductor device

Device and method for connecting two electronic components

Patents Applicationslast 30 patents

WIRE BONDING SYSTEMS AND RELATED METHODS

Cu Column, Cu Core Column, Solder Joint, and Through-Silicon Via

Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BAL...

CORE BALL, SOLDER PASTE, FORMED-SOLDER, FLUX-COATED CORE BALL AND S...

Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT

FAN-OUT CHIP SCALE PACKAGE

FAN-OUT CHIP SCALE PACKAGE

METHOD OF REFINING SOLDER MATERIALS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

STRUCTURE FOR REDUCTION OF SOFT ERROR RATES IN INTEGRATED CIRCUITS

METHOD AND APPARATUS FOR NON-CONDUCTIVELY INTERCONNECTING INTEGRATE...

METHOD AND STRUCTURE FOR REDUCTION OF SOFT ERROR RATES IN INTEGRATE...

Lead-containing anodes

Lead-containing solder paste

Lead-containing solder bumps

Method and structure for reduction of soft error rates in integrate...

Methods of refining lead-containing materials

Tools and methods for forming conductive bumps on microelectronic e...

Silicone-based adhesive sheet, method of bonding a semiconductor ch...

Chip module

Method of forming a lead-free bump and a plating apparatus therefor

Method and apparatus for non-conductively interconnecting integrate...

Anodes for electroplating operations, and methods of forming materi...

ADHESIVE SHEET OF CROSS-LINKED SILICONE, METHOD OF MANUFACTURING TH...

Lead free bump and method of forming the same

Semiconductor device

Semiconductor packages; lead-containing solders and anodes; and met...

Semiconductor element, manufacturing method thereof and BGA-type se...

Semiconductor device

Semiconductor device and structure for mounting the same