Use of materials for the metallic pattern or other conductive pattern

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H05K1/09

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/09Use of materials for the metallic pattern or other conductive pattern

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing printed wiring board and printed wiring board
- Patent number 12,317,425
- Issue date May 27, 2025
- Ibiden Co., Ltd.
- Atsushi Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive resin composition
- Patent number 12,305,057
- Issue date May 20, 2025
- SAKATA INX CORPORATION
- Masayuki Sasaki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thin film-based microfluidic electronic device, method of forming t...
- Patent number 12,302,505
- Issue date May 13, 2025
- Singapore University of Technology and Design
- Kento Yamagishi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Conductive structure including copper-phosphorous alloy and a metho...
- Patent number 12,293,966
- Issue date May 6, 2025
- Chun-Ming Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Providing one or more carbon layers to a copper conductive material...
- Patent number 12,289,831
- Issue date Apr 29, 2025
- Cisco Technology, Inc.
- Joel Goergen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive sheet
- Patent number 12,286,573
- Issue date Apr 29, 2025
- MEKTEC CORPORATION
- Masayuki Iwase
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Transparent composite nanowire electrodes
- Patent number 12,284,756
- Issue date Apr 22, 2025
- Massachusetts Institute of Technology
- Jeffrey C. Grossman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of dispensing paste for a printer using a paste dispensing a...
- Patent number 12,275,232
- Issue date Apr 15, 2025
- Applied Materials Italia S.R.L.
- Davide Colla
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Stretchable interconnects for flexible electronic surfaces
- Patent number 12,278,022
- Issue date Apr 15, 2025
- Alpha Assembly Solutions Inc.
- Narahari Pujari
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Component carrier with a magnetic element and a manufacturing method
- Patent number 12,279,372
- Issue date Apr 15, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ivan Salkovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curable composition for inkjet, cured product and flexible printed...
- Patent number 12,264,249
- Issue date Apr 1, 2025
- Microcosm Technology Co., Ltd.
- Bo-Hung Lai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Trim element comprising a functional layer made of carbon material
- Patent number 12,263,795
- Issue date Apr 1, 2025
- Faurecia Interieur Industrie
- Godefroy Beau
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Card-type medium and card-type medium manufacturing method
- Patent number 12,260,278
- Issue date Mar 25, 2025
- TOPPAN INC.
- Eriko Uehara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Copper-clad laminate plate and printed wiring board
- Patent number 12,262,469
- Issue date Mar 25, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Daisuke Nakajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 12,262,481
- Issue date Mar 25, 2025
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct embedding a lithium ion battery on a flexible prin...
- Patent number 12,249,704
- Issue date Mar 11, 2025
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric substrate and method of forming the same
- Patent number 12,250,767
- Issue date Mar 11, 2025
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 12,245,366
- Issue date Mar 4, 2025
- Kyocera Corporation
- Hidetoshi Yugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and electronic device including same
- Patent number 12,245,373
- Issue date Mar 4, 2025
- ASUSTeK COMPUTER Inc.
- Ping-Han Tsou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for fabricating 3D multielectrode arrays with 3...
- Patent number 12,245,369
- Issue date Mar 4, 2025
- University of Oregon
- Timothy Gardner
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Thermally curable ink-jet ink
- Patent number 12,240,986
- Issue date Mar 4, 2025
- Konica Minolta, Inc.
- Ai Katsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board
- Patent number 12,238,859
- Issue date Feb 25, 2025
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-clad laminated plate, resin-clad copper foil, and circuit su...
- Patent number 12,233,621
- Issue date Feb 25, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Kitai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flexible pressure sensors and user interfaces
- Patent number 12,232,548
- Issue date Feb 25, 2025
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- A41 - WEARING APPAREL
Information Patent Grant
Method for processing metal nanowire ink with metal ions
- Patent number 12,227,661
- Issue date Feb 18, 2025
- EKC Technology, Inc.
- Ying-Syi Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 12,232,254
- Issue date Feb 18, 2025
- Unimicron Technology Corporation
- Po-Hsiang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 12,232,273
- Issue date Feb 18, 2025
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Conductive paste and electronic device
- Patent number 12,224,081
- Issue date Feb 11, 2025
- BEIJING DREAM INK TECHNOLOGIES CO., LTD.
- Zhongwei Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring
- Patent number 12,223,147
- Issue date Feb 11, 2025
- Japan Aviation Electronics Industry, Limited
- Akitoshi Sakaue
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive ink interconnected devices
- Patent number 12,213,250
- Issue date Jan 28, 2025
- NCR Voyix Corporation
- John Paul Bacalso Aliganga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED DE-COUPLING PLANE FOR PRINTED CIRCUIT BOARDS
- Publication number 20250168968
- Publication date May 22, 2025
- Microsoft Technology Licensing, LLC
- Chee Kiong FONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...
- Publication number 20250168977
- Publication date May 22, 2025
- The Trustees of the University of Pennsylvania
- Alan T. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING-ATTACHED ADHESIVE SUBSTRATE, STACKED DEVICE, GLASS STACKED B...
- Publication number 20250159795
- Publication date May 15, 2025
- AGC Inc.
- Kenji FUJITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FLEXIBLE AND STRETCHABLE STRUCTURES
- Publication number 20250151201
- Publication date May 8, 2025
- Liquid Wire Inc.
- Mark William Ronay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD FOR CHIP INTEGRATION AND ELECTRONIC DEVICE H...
- Publication number 20250142719
- Publication date May 1, 2025
- Chipbond Technology Corporation
- Chiu-Hong Lai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...
- Publication number 20250142722
- Publication date May 1, 2025
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250126703
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Min Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250126707
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Won Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES
- Publication number 20250105132
- Publication date Mar 27, 2025
- Intel Corporation
- Pratyush MISHRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DISPENSING PASTE FOR A PRINTER USING A PASTE DISPENSING A...
- Publication number 20250100268
- Publication date Mar 27, 2025
- Applied Materials Italia S.R.L.
- Davide COLLA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CIRCUIT BOARD
- Publication number 20250098059
- Publication date Mar 20, 2025
- LG Innotek Co., Ltd.
- Dong Keon LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RECHARGEABLE BATTERY MODULE
- Publication number 20250096430
- Publication date Mar 20, 2025
- Samsung SDI Co., Ltd.
- Young-Hwan KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN LAMINATED GLASS ASSEMBLY WITH ELECTRIC CIRCUITRY
- Publication number 20250089161
- Publication date Mar 13, 2025
- Fuyao Glass America Inc.
- Yue Shao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID PRINTED CIRCUIT BOARD
- Publication number 20250089166
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Keonwoo KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus of Conductive Hybrid Material Layer Stacks wit...
- Publication number 20250081341
- Publication date Mar 6, 2025
- Atlas Magnetics
- John Othniel McDonald
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOF
- Publication number 20250071893
- Publication date Feb 27, 2025
- AMOSENSE CO., LTD.
- Jihyung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD SUBSTRATE, PRINTED WIRING BOARD, AND MULTILAYE...
- Publication number 20250071894
- Publication date Feb 27, 2025
- Sumitomo Electric Industries, Ltd.
- Hiroshi UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLYTIC SOLUTION FOR COPPER FOIL, AND ELECTROLYTIC COPPER FOIL
- Publication number 20250059665
- Publication date Feb 20, 2025
- Shenzhen Institute of Advanced Electronic Materials
- Zhe Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBRANE CIRCUIT BOARD
- Publication number 20250063655
- Publication date Feb 20, 2025
- Primax Electronics Ltd.
- Lei-Lung Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REAL-TIME IN-SITU ADDITIVE CIRCUIT TUNING FOR RF/MICROWAVE ELECTRONICS
- Publication number 20250063672
- Publication date Feb 20, 2025
- Raytheon Company
- Christopher Areias
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMART WEARABLE CLOTHING INCLUDING STRETCHABLE CIRCUIT ELECTRODE AND...
- Publication number 20250063656
- Publication date Feb 20, 2025
- MIDAS H&T INC.
- Se Yun CHANG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
HIGH-INTEGRATION-LEVEL CARRIER PLATE AND MANUFACTURING METHOD
- Publication number 20250056722
- Publication date Feb 13, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Shouyu Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEXTILE CONDUCTIVE BUS AND METHOD OF MAKING THE SAME
- Publication number 20250048550
- Publication date Feb 6, 2025
- The Charles Stark Draper Laboratory, Inc.
- William A. ROY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARCHITECTED LIQUID METAL NETWORKS AND PROCESSES OF MAKING AND USING...
- Publication number 20250040041
- Publication date Jan 30, 2025
- Government of the United States as Represented by the Secretary of the Air Force
- Carl J. Thrasher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT ARTICLE WITH ELECTRICALLY-CONDUCTIVE PATTERN
- Publication number 20250040054
- Publication date Jan 30, 2025
- James S. Honan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN
- Publication number 20250040044
- Publication date Jan 30, 2025
- James S. Honan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuits with Embedded Resistive Thermal Devices
- Publication number 20250036176
- Publication date Jan 30, 2025
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT TH...
- Publication number 20250040036
- Publication date Jan 30, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR PRINTED WIRING BOARD AND PRINTED WIRING BOARD
- Publication number 20250024598
- Publication date Jan 16, 2025
- Sumitomo Electric Industries, Ltd.
- Takuto HIDANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC WIRING MEMBER
- Publication number 20250024592
- Publication date Jan 16, 2025
- NGK Electronics Devices, Inc.
- Hiroshi KOUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Use of materials for the metallic pattern or other conductive pattern

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing printed wiring board and printed wiring board

Conductive resin composition

Thin film-based microfluidic electronic device, method of forming t...

Conductive structure including copper-phosphorous alloy and a metho...

Providing one or more carbon layers to a copper conductive material...

Adhesive sheet

Transparent composite nanowire electrodes

Method of dispensing paste for a printer using a paste dispensing a...

Stretchable interconnects for flexible electronic surfaces

Component carrier with a magnetic element and a manufacturing method

Curable composition for inkjet, cured product and flexible printed...

Trim element comprising a functional layer made of carbon material

Card-type medium and card-type medium manufacturing method

Copper-clad laminate plate and printed wiring board

Electrical devices with electrodes on softening polymers and method...

Method of direct embedding a lithium ion battery on a flexible prin...

Dielectric substrate and method of forming the same

Wiring board

Printed circuit board and electronic device including same

Methods and systems for fabricating 3D multielectrode arrays with 3...

Thermally curable ink-jet ink

Wiring circuit board

Copper-clad laminated plate, resin-clad copper foil, and circuit su...

Flexible pressure sensors and user interfaces

Method for processing metal nanowire ink with metal ions

Printed circuit board and manufacturing method thereof

Printed circuit board and method of fabricating the same

Conductive paste and electronic device

Printed wiring

Conductive ink interconnected devices

Patents Applicationslast 30 patents

PRINTED DE-COUPLING PLANE FOR PRINTED CIRCUIT BOARDS

Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...

WIRING-ATTACHED ADHESIVE SUBSTRATE, STACKED DEVICE, GLASS STACKED B...

FLEXIBLE AND STRETCHABLE STRUCTURES

FLEXIBLE CIRCUIT BOARD FOR CHIP INTEGRATION AND ELECTRONIC DEVICE H...

MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD

POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES

METHOD OF DISPENSING PASTE FOR A PRINTER USING A PASTE DISPENSING A...

CIRCUIT BOARD

RECHARGEABLE BATTERY MODULE

ULTRA-THIN LAMINATED GLASS ASSEMBLY WITH ELECTRIC CIRCUITRY

HYBRID PRINTED CIRCUIT BOARD

Method and Apparatus of Conductive Hybrid Material Layer Stacks wit...

CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOF

PRINTED WIRING BOARD SUBSTRATE, PRINTED WIRING BOARD, AND MULTILAYE...

ELECTROLYTIC SOLUTION FOR COPPER FOIL, AND ELECTROLYTIC COPPER FOIL

MEMBRANE CIRCUIT BOARD

REAL-TIME IN-SITU ADDITIVE CIRCUIT TUNING FOR RF/MICROWAVE ELECTRONICS

SMART WEARABLE CLOTHING INCLUDING STRETCHABLE CIRCUIT ELECTRODE AND...

HIGH-INTEGRATION-LEVEL CARRIER PLATE AND MANUFACTURING METHOD

TEXTILE CONDUCTIVE BUS AND METHOD OF MAKING THE SAME

ARCHITECTED LIQUID METAL NETWORKS AND PROCESSES OF MAKING AND USING...

TRANSPARENT ARTICLE WITH ELECTRICALLY-CONDUCTIVE PATTERN

ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN

Printed Circuits with Embedded Resistive Thermal Devices

CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT TH...

SUBSTRATE FOR PRINTED WIRING BOARD AND PRINTED WIRING BOARD

CERAMIC WIRING MEMBER