Use of materials for the metallic pattern or other conductive pattern

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H05K1/09

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/09Use of materials for the metallic pattern or other conductive pattern

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electrically conductive adhesive, electronic circuit using the same...
- Patent number 12,171,062
- Issue date Dec 17, 2024
- Toyo Aluminum Kabushiki Kaisha
- Toshio Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal foil with carrier and preparation method thereof
- Patent number 12,167,533
- Issue date Dec 10, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD
- Zhi Su
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing a ceramic copper circuit board
- Patent number 12,167,534
- Issue date Dec 10, 2024
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-sintering conductive inks
- Patent number 12,152,156
- Issue date Nov 26, 2024
- Science Applications International Corporation
- John Timler
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Light-transmitting electroconductive film and transparent electroco...
- Patent number 12,156,330
- Issue date Nov 26, 2024
- Nitto Denko Corporation
- Nozomi Fujino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High temperature, conductive thermosetting resin compositions
- Patent number 12,139,568
- Issue date Nov 12, 2024
- TCLAD INC.
- Stanley Shengqian Kong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Printed circuits with embedded resistive thermal devices
- Patent number 12,135,592
- Issue date Nov 5, 2024
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring circuit board
- Patent number 12,137,522
- Issue date Nov 5, 2024
- Nitto Denko Corporation
- Rihito Fukushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, resin sheet, multilayer printed wiring board, an...
- Patent number 12,133,339
- Issue date Oct 29, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yune Kumazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 12,133,330
- Issue date Oct 29, 2024
- Shinko Electric Industries Co., Ltd.
- Akihiro Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Maintaining the shape of a circuit board
- Patent number 12,127,334
- Issue date Oct 22, 2024
- Dis Tech America, LLC
- Heng-Kit Too
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body, ceramic copper circuit substrate, and semiconductor de...
- Patent number 12,115,603
- Issue date Oct 15, 2024
- Kabushiki Kaisha Toshiba
- Maki Yonetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable interconnect structure and method of fabricating the same
- Patent number 12,120,814
- Issue date Oct 15, 2024
- National University of Singapore
- Chee Keong Tee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure, method for manufacturing same, and semiconductor...
- Patent number 12,114,437
- Issue date Oct 8, 2024
- Resonac Corporation
- Masaya Toba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive laminate and manufacturing method of conductive laminate
- Patent number 12,110,408
- Issue date Oct 8, 2024
- FUJIFILM Corporation
- Kotaro Maeda
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of mounting electronic component, substrate and an optical s...
- Patent number 12,114,434
- Issue date Oct 8, 2024
- Canon Kabushiki Kaisha
- Shunsuke Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,114,417
- Issue date Oct 8, 2024
- Sumitomo Bakelite Co., Ltd.
- Nobuo Tagashira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic-copper composite, ceramic circuit board, power module, and...
- Patent number 12,109,640
- Issue date Oct 8, 2024
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Roughened copper foil, copper-clad laminate and printed wiring board
- Patent number 12,104,265
- Issue date Oct 1, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Ayumu Tateoka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate structure and electronic device including the same
- Patent number 12,108,534
- Issue date Oct 1, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Eun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board using thermocouple to dissipate generated heat and me...
- Patent number 12,101,871
- Issue date Sep 24, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Huan-Yu He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,101,880
- Issue date Sep 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hee-Joon Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board
- Patent number 12,101,879
- Issue date Sep 24, 2024
- LG Innotek Co., Ltd
- Jun Young Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ink composition, method for forming a conductive member, and conduc...
- Patent number 12,091,567
- Issue date Sep 17, 2024
- Kuprion Inc.
- Zhenggang Li
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Hybrid nanosilver/liquid metal ink composition and uses thereof
- Patent number 12,096,554
- Issue date Sep 17, 2024
- Xerox Corporation
- Naveen Chopra
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thin electrically conductive film
- Patent number 12,094,623
- Issue date Sep 17, 2024
- Cambrios Film Solutions Corporation
- Jeff Alan Wolk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter thick magnetic PCB with high relative permeability and d...
- Patent number 12,094,630
- Issue date Sep 17, 2024
- Winchester Technologies, LLC
- Nian-Xiang Sun
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition and article made therefrom
- Patent number 12,091,545
- Issue date Sep 17, 2024
- ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.
- Xingxing Yao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Conductive resin composition, circuit board fabricated using conduc...
- Patent number 12,094,622
- Issue date Sep 17, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomohiro Fukao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible and stretchable structures
- Patent number 12,096,563
- Issue date Sep 17, 2024
- Liquid Wire Inc.
- Mark William Ronay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ALUMINUM FLEXIBLE PRINTED CIRCUIT BOARD ASSEMBLY AND PREPARATION ME...
- Publication number 20240422910
- Publication date Dec 19, 2024
- Taicang Manaflex Technology Co., Ltd.
- Robert C. LANE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROCONDUCTIVE COMPOSITION
- Publication number 20240417602
- Publication date Dec 19, 2024
- Toyobo Co., Ltd.
- Naomi TAKIMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20240414842
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Jun Young LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240414850
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-THIN COPPER FOIL WITH CARRIER FOIL FOR ALLOWING EASY MICRO-HO...
- Publication number 20240407091
- Publication date Dec 5, 2024
- Lotte Energy Materials Corporation
- Chang Yol YANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Printed Circuit Board, Manufacturing Method Thereof, and Battery Pa...
- Publication number 20240397616
- Publication date Nov 28, 2024
- LG ENERGY SOLUTION, LTD.
- Jae Young Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...
- Publication number 20240397635
- Publication date Nov 28, 2024
- Resonac Corporation
- Masaya TOBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20240389226
- Publication date Nov 21, 2024
- KYOCERA CORPORATION
- Yuhei MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE AND FLEXIBLE METAL FILM STRUCTURES
- Publication number 20240389225
- Publication date Nov 21, 2024
- Liquid Wire Inc.
- Trevor Antonio Rivera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20240383035
- Publication date Nov 21, 2024
- Resonac Corporation
- Yoshinori EJIRI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
DISPLAY CARD MODULE AND ELECTRONIC DEVICE
- Publication number 20240377866
- Publication date Nov 14, 2024
- ASUS GLOBAL PTE. LTD.
- Jingwen Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONDUCTIVE INK COMPOSITION
- Publication number 20240376331
- Publication date Nov 14, 2024
- Enjet Co., Ltd.
- Do Young BYUN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRICALLY CONDUCTIVE ELASTOMERIC PRINTING INK FOR CONTACTLESS PR...
- Publication number 20240368420
- Publication date Nov 7, 2024
- WACKER CHEMIE AG
- Sabin-Lucian SURARU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...
- Publication number 20240373548
- Publication date Nov 7, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Speed Communication Jack
- Publication number 20240364059
- Publication date Oct 31, 2024
- Sentinel Connector Systems, Inc.
- Brett D. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Embedded Component Connected by Galvanic Con...
- Publication number 20240365472
- Publication date Oct 31, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Wolfgang SCHRITTWIESER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED PRODUCT, PREPARATION METHOD THEREFOR, AND USE THEREOF
- Publication number 20240357742
- Publication date Oct 24, 2024
- Heraeus Electronics GmbH & Co. KG
- Shouming AN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD HAVING OVERCURRENT PROTECTION FUNCTION
- Publication number 20240357735
- Publication date Oct 24, 2024
- LG ENERGY SOLUTION, LTD.
- Young Joong KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Transparent Conductive Film
- Publication number 20240355501
- Publication date Oct 24, 2024
- Chasm Advanced Materials, Inc.
- Robert F. Praino
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR PROVIDING ILLUMINATING OBJECTS WITHIN SUBSTRATE
- Publication number 20240349424
- Publication date Oct 17, 2024
- John Simonetti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY CONDUCTIVE FILM AND METHOD FOR MANUFACTURING SAME, AND...
- Publication number 20240349425
- Publication date Oct 17, 2024
- TDK Corporation
- Yoshihisa TAMAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL FOIL, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20240349423
- Publication date Oct 17, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD.
- Meijuan Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240341034
- Publication date Oct 10, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMULATIONS AND PROCESSES FOR PRODUCING HIGHLY CONDUCTIVE COPPER P...
- Publication number 20240327668
- Publication date Oct 3, 2024
- Copprint Technologies Ltd
- Michael GROUCHKO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240334598
- Publication date Oct 3, 2024
- Shinko Electric Industries Co., Ltd.
- Yuki KOBAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Debossed Contact Printing as a Patterning Method for Paper-Based El...
- Publication number 20240324107
- Publication date Sep 26, 2024
- Universtiy of Windsor
- Tricia Breen Carmichael
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN RULES FOR SENSOR INTEGRATED SUBSTRATES
- Publication number 20240316972
- Publication date Sep 26, 2024
- Smith & Nephew PLC
- Allan Kenneth Frazer Grugeon Hunt
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CIRCUIT BOARD
- Publication number 20240324102
- Publication date Sep 26, 2024
- LG Innotek Co., Ltd.
- Byeong Kyun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT DEVICE
- Publication number 20240306294
- Publication date Sep 12, 2024
- AUO Corporation
- CHUN-YUEH HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240298410
- Publication date Sep 5, 2024
- LG Innotek Co., Ltd.
- Min Young HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Use of materials for the metallic pattern or other conductive pattern

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrically conductive adhesive, electronic circuit using the same...

Metal foil with carrier and preparation method thereof

Method for manufacturing a ceramic copper circuit board

Self-sintering conductive inks

Light-transmitting electroconductive film and transparent electroco...

High temperature, conductive thermosetting resin compositions

Printed circuits with embedded resistive thermal devices

Wiring circuit board

Resin composition, resin sheet, multilayer printed wiring board, an...

Wiring substrate and semiconductor device

Maintaining the shape of a circuit board

Bonded body, ceramic copper circuit substrate, and semiconductor de...

Stretchable interconnect structure and method of fabricating the same

Wiring structure, method for manufacturing same, and semiconductor...

Conductive laminate and manufacturing method of conductive laminate

Method of mounting electronic component, substrate and an optical s...

Circuit board

Ceramic-copper composite, ceramic circuit board, power module, and...

Roughened copper foil, copper-clad laminate and printed wiring board

Substrate structure and electronic device including the same

Circuit board using thermocouple to dissipate generated heat and me...

Printed circuit board

Flexible circuit board

Ink composition, method for forming a conductive member, and conduc...

Hybrid nanosilver/liquid metal ink composition and uses thereof

Thin electrically conductive film

Millimeter thick magnetic PCB with high relative permeability and d...

Resin composition and article made therefrom

Conductive resin composition, circuit board fabricated using conduc...

Flexible and stretchable structures

Patents Applicationslast 30 patents

ALUMINUM FLEXIBLE PRINTED CIRCUIT BOARD ASSEMBLY AND PREPARATION ME...

ELECTROCONDUCTIVE COMPOSITION

FLEXIBLE CIRCUIT BOARD

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

ULTRA-THIN COPPER FOIL WITH CARRIER FOIL FOR ALLOWING EASY MICRO-HO...

Printed Circuit Board, Manufacturing Method Thereof, and Battery Pa...

WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...

WIRING BOARD

STRETCHABLE AND FLEXIBLE METAL FILM STRUCTURES

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

DISPLAY CARD MODULE AND ELECTRONIC DEVICE

CONDUCTIVE INK COMPOSITION

ELECTRICALLY CONDUCTIVE ELASTOMERIC PRINTING INK FOR CONTACTLESS PR...

Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...

High Speed Communication Jack

Component Carrier With Embedded Component Connected by Galvanic Con...

PRINTED PRODUCT, PREPARATION METHOD THEREFOR, AND USE THEREOF

FLEXIBLE PRINTED CIRCUIT BOARD HAVING OVERCURRENT PROTECTION FUNCTION

Transparent Conductive Film

METHOD AND SYSTEM FOR PROVIDING ILLUMINATING OBJECTS WITHIN SUBSTRATE

ELECTRICALLY CONDUCTIVE FILM AND METHOD FOR MANUFACTURING SAME, AND...

METAL FOIL, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD

WIRING SUBSTRATE

FORMULATIONS AND PROCESSES FOR PRODUCING HIGHLY CONDUCTIVE COPPER P...

WIRING SUBSTRATE

Debossed Contact Printing as a Patterning Method for Paper-Based El...

DESIGN RULES FOR SENSOR INTEGRATED SUBSTRATES

CIRCUIT BOARD

CIRCUIT DEVICE

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME