Use of materials for the metallic pattern or other conductive pattern

Industry

CPC
H05K1/09

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/09Use of materials for the metallic pattern or other conductive pattern

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 12,363,827
- Issue date Jul 15, 2025
- Ibiden Co., Ltd.
- Yoshiki Matsui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing bonded body and method for manufacturing i...
- Patent number 12,356,554
- Issue date Jul 8, 2025
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing same
- Patent number 12,356,542
- Issue date Jul 8, 2025
- MATERIAL CONCEPT, INC.
- Junichi Koike
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component embedded substrate
- Patent number 12,349,283
- Issue date Jul 1, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 12,349,269
- Issue date Jul 1, 2025
- Toray Industries, Inc.
- Ryutaro Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric circuit board and power module
- Patent number 12,349,299
- Issue date Jul 1, 2025
- Kyocera Corporation
- Yoshitada Konishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dynamic pattern transfer printing and pattern transfer sheets with...
- Patent number 12,337,608
- Issue date Jun 24, 2025
- Wuhan DR Laser Technology Corp., LTD
- Amir Noy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liquid metal fusion with conductive inks and pastes
- Patent number 12,336,115
- Issue date Jun 17, 2025
- Universidade de Coimbra
- Mahmoud Tavakoli
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Composite copper components
- Patent number 12,336,116
- Issue date Jun 17, 2025
- Namics Corporation
- Naoki Obata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrochemical three-dimensional printing and soldering
- Patent number 12,320,028
- Issue date Jun 3, 2025
- University of South Florida
- Arash Takshi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Copper clad laminate film and electronic device including same
- Patent number 12,324,094
- Issue date Jun 3, 2025
- Toray Advanced Materials Korea Inc.
- Jong Hun Cheon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing printed wiring board and printed wiring board
- Patent number 12,317,425
- Issue date May 27, 2025
- Ibiden Co., Ltd.
- Atsushi Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive resin composition
- Patent number 12,305,057
- Issue date May 20, 2025
- SAKATA INX CORPORATION
- Masayuki Sasaki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thin film-based microfluidic electronic device, method of forming t...
- Patent number 12,302,505
- Issue date May 13, 2025
- Singapore University of Technology and Design
- Kento Yamagishi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Conductive structure including copper-phosphorous alloy and a metho...
- Patent number 12,293,966
- Issue date May 6, 2025
- Chun-Ming Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Providing one or more carbon layers to a copper conductive material...
- Patent number 12,289,831
- Issue date Apr 29, 2025
- Cisco Technology, Inc.
- Joel Goergen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive sheet
- Patent number 12,286,573
- Issue date Apr 29, 2025
- MEKTEC CORPORATION
- Masayuki Iwase
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Transparent composite nanowire electrodes
- Patent number 12,284,756
- Issue date Apr 22, 2025
- Massachusetts Institute of Technology
- Jeffrey C. Grossman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of dispensing paste for a printer using a paste dispensing a...
- Patent number 12,275,232
- Issue date Apr 15, 2025
- Applied Materials Italia S.R.L.
- Davide Colla
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Stretchable interconnects for flexible electronic surfaces
- Patent number 12,278,022
- Issue date Apr 15, 2025
- Alpha Assembly Solutions Inc.
- Narahari Pujari
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Component carrier with a magnetic element and a manufacturing method
- Patent number 12,279,372
- Issue date Apr 15, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ivan Salkovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curable composition for inkjet, cured product and flexible printed...
- Patent number 12,264,249
- Issue date Apr 1, 2025
- Microcosm Technology Co., Ltd.
- Bo-Hung Lai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Trim element comprising a functional layer made of carbon material
- Patent number 12,263,795
- Issue date Apr 1, 2025
- Faurecia Interieur Industrie
- Godefroy Beau
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Card-type medium and card-type medium manufacturing method
- Patent number 12,260,278
- Issue date Mar 25, 2025
- TOPPAN INC.
- Eriko Uehara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Copper-clad laminate plate and printed wiring board
- Patent number 12,262,469
- Issue date Mar 25, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Daisuke Nakajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 12,262,481
- Issue date Mar 25, 2025
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct embedding a lithium ion battery on a flexible prin...
- Patent number 12,249,704
- Issue date Mar 11, 2025
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric substrate and method of forming the same
- Patent number 12,250,767
- Issue date Mar 11, 2025
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 12,245,366
- Issue date Mar 4, 2025
- Kyocera Corporation
- Hidetoshi Yugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and electronic device including same
- Patent number 12,245,373
- Issue date Mar 4, 2025
- ASUSTeK COMPUTER Inc.
- Ping-Han Tsou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RELAY, POWER DISTRIBUTION APPARATUS, AND CHARGING PILE
- Publication number 20250240892
- Publication date Jul 24, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Qiao WANG
- B60 - VEHICLES IN GENERAL
Information Patent Application
TWIN CRYSTAL COPPER MATERIAL AND HYBRID BONDING STRUCTURE
- Publication number 20250236981
- Publication date Jul 24, 2025
- SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY CHINESE ACADEMY OF SCIENCES
- Zhi-Quan LIU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED ELECTRODE ASSEMBLY
- Publication number 20250240896
- Publication date Jul 24, 2025
- Coloplast A/S
- Anders Grove Sund
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPERCONDUCTING WS2-BASED NANOSHEET INK
- Publication number 20250223452
- Publication date Jul 10, 2025
- The Trustees of Princeton University
- Leslie M. SCHOOP
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Printed Circuit Board For Battery Pack Capable Of Measuring Tempera...
- Publication number 20250227847
- Publication date Jul 10, 2025
- LG ENERGY SOLUTION, LTD.
- Sang Ok Seon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20250220813
- Publication date Jul 3, 2025
- KYOCERA CORPORATION
- Hiroaki SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE ELASTIC MATERIAL INCLUDING CONDUCTIVE BALLS...
- Publication number 20250220812
- Publication date Jul 3, 2025
- MIDAS H&T INC.
- Un Yong JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20250220806
- Publication date Jul 3, 2025
- Mitsui Mining and Smelting Co., Ltd.
- Hiroshi ONO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE CONDUCTIVE PASTE, METHOD FOR PRODUCING LAMINATED ELE...
- Publication number 20250210217
- Publication date Jun 26, 2025
- Murata Manufacturing Co., Ltd.
- Kenta KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250212327
- Publication date Jun 26, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Kyeong Yub Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20250203768
- Publication date Jun 19, 2025
- KYOCERA CORPORATION
- Makoto YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Management in Circuit Board Assemblies
- Publication number 20250203753
- Publication date Jun 19, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250203775
- Publication date Jun 19, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Kee YOON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT PACKAGE FOR USE WITH PRINTED CIRCUIT BOARDS
- Publication number 20250203772
- Publication date Jun 19, 2025
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Louis Diamond
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL NANOWIRE INK FOR THE FORMATION OF TRANSPARENT CONDUCTIVE FILM...
- Publication number 20250188302
- Publication date Jun 12, 2025
- EKC Technology, Inc.
- Ying-Syi Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ANISOTROPIC CONDUCTIVE ELASTIC MATERIAL, METHOD FOR PREPARING THE S...
- Publication number 20250194005
- Publication date Jun 12, 2025
- MIDAS H&T INC.
- Un Yong JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRESSURE SENSORS AND USER INTERFACES
- Publication number 20250169555
- Publication date May 29, 2025
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- A41 - WEARING APPAREL
Information Patent Application
PRINTED DE-COUPLING PLANE FOR PRINTED CIRCUIT BOARDS
- Publication number 20250168968
- Publication date May 22, 2025
- Microsoft Technology Licensing, LLC
- Chee Kiong FONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...
- Publication number 20250168977
- Publication date May 22, 2025
- The Trustees of the University of Pennsylvania
- Alan T. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING-ATTACHED ADHESIVE SUBSTRATE, STACKED DEVICE, GLASS STACKED B...
- Publication number 20250159795
- Publication date May 15, 2025
- AGC Inc.
- Kenji FUJITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FLEXIBLE AND STRETCHABLE STRUCTURES
- Publication number 20250151201
- Publication date May 8, 2025
- Liquid Wire Inc.
- Mark William Ronay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD FOR CHIP INTEGRATION AND ELECTRONIC DEVICE H...
- Publication number 20250142719
- Publication date May 1, 2025
- Chipbond Technology Corporation
- Chiu-Hong Lai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...
- Publication number 20250142722
- Publication date May 1, 2025
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250126703
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Min Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250126707
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Won Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES
- Publication number 20250105132
- Publication date Mar 27, 2025
- Intel Corporation
- Pratyush MISHRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DISPENSING PASTE FOR A PRINTER USING A PASTE DISPENSING A...
- Publication number 20250100268
- Publication date Mar 27, 2025
- Applied Materials Italia S.R.L.
- Davide COLLA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CIRCUIT BOARD
- Publication number 20250098059
- Publication date Mar 20, 2025
- LG Innotek Co., Ltd.
- Dong Keon LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RECHARGEABLE BATTERY MODULE
- Publication number 20250096430
- Publication date Mar 20, 2025
- Samsung SDI Co., Ltd.
- Young-Hwan KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN LAMINATED GLASS ASSEMBLY WITH ELECTRIC CIRCUITRY
- Publication number 20250089161
- Publication date Mar 13, 2025
- Fuyao Glass America Inc.
- Yue Shao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Use of materials for the metallic pattern or other conductive pattern

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed wiring board and method for manufacturing printed wiring board

Method for manufacturing bonded body and method for manufacturing i...

Wiring board and method for manufacturing same

Electronic component embedded substrate

Wiring board

Electric circuit board and power module

Dynamic pattern transfer printing and pattern transfer sheets with...

Liquid metal fusion with conductive inks and pastes

Composite copper components

Electrochemical three-dimensional printing and soldering

Copper clad laminate film and electronic device including same

Method for manufacturing printed wiring board and printed wiring board

Conductive resin composition

Thin film-based microfluidic electronic device, method of forming t...

Conductive structure including copper-phosphorous alloy and a metho...

Providing one or more carbon layers to a copper conductive material...

Adhesive sheet

Transparent composite nanowire electrodes

Method of dispensing paste for a printer using a paste dispensing a...

Stretchable interconnects for flexible electronic surfaces

Component carrier with a magnetic element and a manufacturing method

Curable composition for inkjet, cured product and flexible printed...

Trim element comprising a functional layer made of carbon material

Card-type medium and card-type medium manufacturing method

Copper-clad laminate plate and printed wiring board

Electrical devices with electrodes on softening polymers and method...

Method of direct embedding a lithium ion battery on a flexible prin...

Dielectric substrate and method of forming the same

Wiring board

Printed circuit board and electronic device including same

Patents Applicationslast 30 patents

RELAY, POWER DISTRIBUTION APPARATUS, AND CHARGING PILE

TWIN CRYSTAL COPPER MATERIAL AND HYBRID BONDING STRUCTURE

PRINTED ELECTRODE ASSEMBLY

SUPERCONDUCTING WS2-BASED NANOSHEET INK

Printed Circuit Board For Battery Pack Capable Of Measuring Tempera...

WIRING BOARD

ANISOTROPIC CONDUCTIVE ELASTIC MATERIAL INCLUDING CONDUCTIVE BALLS...

METHOD FOR MANUFACTURING CIRCUIT BOARD

PHOTOSENSITIVE CONDUCTIVE PASTE, METHOD FOR PRODUCING LAMINATED ELE...

PRINTED CIRCUIT BOARD

CERAMIC WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

Thermal Management in Circuit Board Assemblies

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

TRANSPARENT PACKAGE FOR USE WITH PRINTED CIRCUIT BOARDS

METAL NANOWIRE INK FOR THE FORMATION OF TRANSPARENT CONDUCTIVE FILM...

ANISOTROPIC CONDUCTIVE ELASTIC MATERIAL, METHOD FOR PREPARING THE S...

FLEXIBLE PRESSURE SENSORS AND USER INTERFACES

PRINTED DE-COUPLING PLANE FOR PRINTED CIRCUIT BOARDS

Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...

WIRING-ATTACHED ADHESIVE SUBSTRATE, STACKED DEVICE, GLASS STACKED B...

FLEXIBLE AND STRETCHABLE STRUCTURES

FLEXIBLE CIRCUIT BOARD FOR CHIP INTEGRATION AND ELECTRONIC DEVICE H...

MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD

POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES

METHOD OF DISPENSING PASTE FOR A PRINTER USING A PASTE DISPENSING A...

CIRCUIT BOARD

RECHARGEABLE BATTERY MODULE

ULTRA-THIN LAMINATED GLASS ASSEMBLY WITH ELECTRIC CIRCUITRY