Use of materials for the metallic pattern or other conductive pattern

Industry

CPC
H05K1/09

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/09Use of materials for the metallic pattern or other conductive pattern

Industries

Patents Grantslast 30 patents

Information Patent Grant
Conductive ink interconnected devices
- Patent number 12,213,250
- Issue date Jan 28, 2025
- NCR Voyix Corporation
- John Paul Bacalso Aliganga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,207,404
- Issue date Jan 21, 2025
- LG Innotek Co., Ltd
- Yong Suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for transmitting electrical energy and for si...
- Patent number 12,207,402
- Issue date Jan 21, 2025
- Airbus Defence and Space GmbH
- Stephan Friedl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device carrier structures including polymer layers as ba...
- Patent number 12,207,398
- Issue date Jan 21, 2025
- Georgia Tech Research Corporation
- Omkar Gupte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board
- Patent number 12,207,410
- Issue date Jan 21, 2025
- Nitto Denko Corporation
- Hayato Takakura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting assembly, camera module, and electronic device
- Patent number 12,206,975
- Issue date Jan 21, 2025
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Fei-Fan Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit board with polymer conductive members
- Patent number 12,200,865
- Issue date Jan 14, 2025
- BizLink International Corp.
- Shi-Jung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ground discontinuities for thermal isolation
- Patent number 12,193,142
- Issue date Jan 7, 2025
- International Business Machines Corporation
- Trevor Timpane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Branched proximal connectors for high density neural interfaces
- Patent number 12,186,570
- Issue date Jan 7, 2025
- VERILY LIFE SCIENCES LLC
- Bo Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board having a sacrificial pad to mitigate galvanic...
- Patent number 12,193,166
- Issue date Jan 7, 2025
- SanDisk Technologies, Inc.
- Songtao Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,193,152
- Issue date Jan 7, 2025
- LG Innotek Co., Ltd
- Dong Keon Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring
- Patent number 12,182,369
- Issue date Dec 31, 2024
- Japan Aviation Electronics Industry, Limited
- Akitoshi Sakaue
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible wiring board
- Patent number 12,185,458
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Ryo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra-thin laminated glass assembly with electric circuitry
- Patent number 12,185,460
- Issue date Dec 31, 2024
- Fuyao Glass America Inc.
- Yue Shao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component embedded substrate
- Patent number 12,185,471
- Issue date Dec 31, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including electrostatic discharge path
- Patent number 12,181,936
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Donghyeon Yeo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
RF absorbing structures
- Patent number 12,185,453
- Issue date Dec 31, 2024
- Pivotal Commware, Inc.
- Jay Howard McCandless
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-clad laminate and method of forming the same
- Patent number 12,173,201
- Issue date Dec 24, 2024
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Printed wiring board
- Patent number 12,177,973
- Issue date Dec 24, 2024
- Sumitomo Electric Industries, Ltd.
- Shoichiro Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive adhesive, electronic circuit using the same...
- Patent number 12,171,062
- Issue date Dec 17, 2024
- Toyo Aluminum Kabushiki Kaisha
- Toshio Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal foil with carrier and preparation method thereof
- Patent number 12,167,533
- Issue date Dec 10, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD
- Zhi Su
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing a ceramic copper circuit board
- Patent number 12,167,534
- Issue date Dec 10, 2024
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-sintering conductive inks
- Patent number 12,152,156
- Issue date Nov 26, 2024
- Science Applications International Corporation
- John Timler
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Light-transmitting electroconductive film and transparent electroco...
- Patent number 12,156,330
- Issue date Nov 26, 2024
- Nitto Denko Corporation
- Nozomi Fujino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High temperature, conductive thermosetting resin compositions
- Patent number 12,139,568
- Issue date Nov 12, 2024
- TCLAD INC.
- Stanley Shengqian Kong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wiring circuit board
- Patent number 12,137,522
- Issue date Nov 5, 2024
- Nitto Denko Corporation
- Rihito Fukushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuits with embedded resistive thermal devices
- Patent number 12,135,592
- Issue date Nov 5, 2024
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Resin composition, resin sheet, multilayer printed wiring board, an...
- Patent number 12,133,339
- Issue date Oct 29, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yune Kumazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 12,133,330
- Issue date Oct 29, 2024
- Shinko Electric Industries Co., Ltd.
- Akihiro Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Maintaining the shape of a circuit board
- Patent number 12,127,334
- Issue date Oct 22, 2024
- Dis Tech America, LLC
- Heng-Kit Too
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ARCHITECTED LIQUID METAL NETWORKS AND PROCESSES OF MAKING AND USING...
- Publication number 20250040041
- Publication date Jan 30, 2025
- Government of the United States as Represented by the Secretary of the Air Force
- Carl J. Thrasher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT ARTICLE WITH ELECTRICALLY-CONDUCTIVE PATTERN
- Publication number 20250040054
- Publication date Jan 30, 2025
- James S. Honan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN
- Publication number 20250040044
- Publication date Jan 30, 2025
- James S. Honan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuits with Embedded Resistive Thermal Devices
- Publication number 20250036176
- Publication date Jan 30, 2025
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT TH...
- Publication number 20250040036
- Publication date Jan 30, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR PRINTED WIRING BOARD AND PRINTED WIRING BOARD
- Publication number 20250024598
- Publication date Jan 16, 2025
- Sumitomo Electric Industries, Ltd.
- Takuto HIDANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC WIRING MEMBER
- Publication number 20250024592
- Publication date Jan 16, 2025
- NGK Electronics Devices, Inc.
- Hiroshi KOUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC WIRING MEMBER
- Publication number 20250024599
- Publication date Jan 16, 2025
- NGK Electronics Devices, Inc.
- Hiroshi KOUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROUGHENING SOLUTION FOR ROLLED COPPER FOIL AND METHOD FOR PRODUCING...
- Publication number 20250011940
- Publication date Jan 9, 2025
- Mitsubishi Gas Chemical Company, Inc.
- Masami SONE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SHIELDABLE CIRCUIT BOARD STRUCTURE
- Publication number 20250016910
- Publication date Jan 9, 2025
- Hsien-Chiang SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE WITH SHIELDING AND HEAT DISSIPATION FUNCTIO...
- Publication number 20250016934
- Publication date Jan 9, 2025
- Hsien-Chiang SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS FOR MANUFACTURING AN ELECTRONIC APPARATUS
- Publication number 20250008654
- Publication date Jan 2, 2025
- Corning Incorporated
- Sean Matthew Garner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORROSION RESISTANT SINGLE DAMASCENE INTERCONNECTS
- Publication number 20240431025
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Takeshi Nogami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED CIRCUIT BOARD FOR COB IC CARD AND METHOD OF TREATING SURFAC...
- Publication number 20240431035
- Publication date Dec 26, 2024
- HAESUNG DS CO., LTD.
- Myeong Jin HAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALUMINUM FLEXIBLE PRINTED CIRCUIT BOARD ASSEMBLY AND PREPARATION ME...
- Publication number 20240422910
- Publication date Dec 19, 2024
- Taicang Manaflex Technology Co., Ltd.
- Robert C. LANE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROCONDUCTIVE COMPOSITION
- Publication number 20240417602
- Publication date Dec 19, 2024
- Toyobo Co., Ltd.
- Naomi TAKIMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20240414842
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Jun Young LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240414850
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-THIN COPPER FOIL WITH CARRIER FOIL FOR ALLOWING EASY MICRO-HO...
- Publication number 20240407091
- Publication date Dec 5, 2024
- Lotte Energy Materials Corporation
- Chang Yol YANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Printed Circuit Board, Manufacturing Method Thereof, and Battery Pa...
- Publication number 20240397616
- Publication date Nov 28, 2024
- LG ENERGY SOLUTION, LTD.
- Jae Young Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...
- Publication number 20240397635
- Publication date Nov 28, 2024
- Resonac Corporation
- Masaya TOBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20240389226
- Publication date Nov 21, 2024
- KYOCERA CORPORATION
- Yuhei MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE AND FLEXIBLE METAL FILM STRUCTURES
- Publication number 20240389225
- Publication date Nov 21, 2024
- Liquid Wire Inc.
- Trevor Antonio Rivera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20240383035
- Publication date Nov 21, 2024
- Resonac Corporation
- Yoshinori EJIRI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
DISPLAY CARD MODULE AND ELECTRONIC DEVICE
- Publication number 20240377866
- Publication date Nov 14, 2024
- ASUS GLOBAL PTE. LTD.
- Jingwen Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONDUCTIVE INK COMPOSITION
- Publication number 20240376331
- Publication date Nov 14, 2024
- Enjet Co., Ltd.
- Do Young BYUN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRICALLY CONDUCTIVE ELASTOMERIC PRINTING INK FOR CONTACTLESS PR...
- Publication number 20240368420
- Publication date Nov 7, 2024
- WACKER CHEMIE AG
- Sabin-Lucian SURARU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...
- Publication number 20240373548
- Publication date Nov 7, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Speed Communication Jack
- Publication number 20240364059
- Publication date Oct 31, 2024
- Sentinel Connector Systems, Inc.
- Brett D. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Embedded Component Connected by Galvanic Con...
- Publication number 20240365472
- Publication date Oct 31, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Wolfgang SCHRITTWIESER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Use of materials for the metallic pattern or other conductive pattern

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conductive ink interconnected devices

Circuit board

Printed circuit board for transmitting electrical energy and for si...

Electronic device carrier structures including polymer layers as ba...

Wiring circuit board

Connecting assembly, camera module, and electronic device

Circuit board with polymer conductive members

Ground discontinuities for thermal isolation

Branched proximal connectors for high density neural interfaces

Printed circuit board having a sacrificial pad to mitigate galvanic...

Circuit board

Printed wiring

Flexible wiring board

Ultra-thin laminated glass assembly with electric circuitry

Electronic component embedded substrate

Electronic device including electrostatic discharge path

RF absorbing structures

Copper-clad laminate and method of forming the same

Printed wiring board

Electrically conductive adhesive, electronic circuit using the same...

Metal foil with carrier and preparation method thereof

Method for manufacturing a ceramic copper circuit board

Self-sintering conductive inks

Light-transmitting electroconductive film and transparent electroco...

High temperature, conductive thermosetting resin compositions

Wiring circuit board

Printed circuits with embedded resistive thermal devices

Resin composition, resin sheet, multilayer printed wiring board, an...

Wiring substrate and semiconductor device

Maintaining the shape of a circuit board

Patents Applicationslast 30 patents

ARCHITECTED LIQUID METAL NETWORKS AND PROCESSES OF MAKING AND USING...

TRANSPARENT ARTICLE WITH ELECTRICALLY-CONDUCTIVE PATTERN

ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN

Printed Circuits with Embedded Resistive Thermal Devices

CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT TH...

SUBSTRATE FOR PRINTED WIRING BOARD AND PRINTED WIRING BOARD

CERAMIC WIRING MEMBER

CERAMIC WIRING MEMBER

ROUGHENING SOLUTION FOR ROLLED COPPER FOIL AND METHOD FOR PRODUCING...

SHIELDABLE CIRCUIT BOARD STRUCTURE

CIRCUIT BOARD STRUCTURE WITH SHIELDING AND HEAT DISSIPATION FUNCTIO...

METHODS AND APPARATUS FOR MANUFACTURING AN ELECTRONIC APPARATUS

CORROSION RESISTANT SINGLE DAMASCENE INTERCONNECTS

PRINTED CIRCUIT BOARD FOR COB IC CARD AND METHOD OF TREATING SURFAC...

ALUMINUM FLEXIBLE PRINTED CIRCUIT BOARD ASSEMBLY AND PREPARATION ME...

ELECTROCONDUCTIVE COMPOSITION

FLEXIBLE CIRCUIT BOARD

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

ULTRA-THIN COPPER FOIL WITH CARRIER FOIL FOR ALLOWING EASY MICRO-HO...

Printed Circuit Board, Manufacturing Method Thereof, and Battery Pa...

WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...

WIRING BOARD

STRETCHABLE AND FLEXIBLE METAL FILM STRUCTURES

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

DISPLAY CARD MODULE AND ELECTRONIC DEVICE

CONDUCTIVE INK COMPOSITION

ELECTRICALLY CONDUCTIVE ELASTOMERIC PRINTING INK FOR CONTACTLESS PR...

Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...

High Speed Communication Jack

Component Carrier With Embedded Component Connected by Galvanic Con...