Use of materials for the metallic pattern or other conductive pattern

Industry

CPC
H05K1/09

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/09Use of materials for the metallic pattern or other conductive pattern

Industries

Patents Grantslast 30 patents

Information Patent Grant
Flexible laminated board and multilayer circuit board
- Patent number 11,985,762
- Issue date May 14, 2024
- UBE EXSYMO CO., LTD.
- Eisuke Tachibana
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Printed film electrostatic concentration for radon detection
- Patent number 11,977,194
- Issue date May 7, 2024
- National Research Council of Canada
- Ryan Hunter Griffin
- G01 - MEASURING TESTING
Information Patent Grant
Printed wiring board and method of manufacturing the same
- Patent number 11,979,983
- Issue date May 7, 2024
- Sumitomo Electric Industries, Ltd.
- Maki Ikebe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Stretchable wiring board and electrical muscle stimulating device
- Patent number 11,975,191
- Issue date May 7, 2024
- Nippon Mektron, Ltd.
- Toshihide Ishiguro
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Flexible electrode circuit capable of being 3D circuit printed stra...
- Patent number 11,974,393
- Issue date Apr 30, 2024
- POSTECH Research and Business Development Foundation
- Unyong Jeong
- G01 - MEASURING TESTING
Information Patent Grant
Ceramic metal circuit board and semiconductor device using the same
- Patent number 11,973,003
- Issue date Apr 30, 2024
- Kabushiki Kaisha Toshiba
- Takayuki Naba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuits with embedded resistive thermal devices
- Patent number 11,971,760
- Issue date Apr 30, 2024
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal nanowire networks and transparent conductive material
- Patent number 11,968,787
- Issue date Apr 23, 2024
- C3 Nano, Inc.
- Ajay Virkar
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,963,298
- Issue date Apr 16, 2024
- Ibiden Co., Ltd.
- Yoshiki Matsui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component
- Patent number 11,963,302
- Issue date Apr 16, 2024
- Murata Manufacturing Co., Ltd.
- Masato Nomiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for high-frequency printed wiring board
- Patent number RE49929
- Issue date Apr 16, 2024
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
Information Patent Grant
Surface-treated copper foil and method for manufacturing same
- Patent number 11,952,675
- Issue date Apr 9, 2024
- NIPPON DENKAI, LTD.
- Toshio Kawasaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper-clad laminate
- Patent number 11,950,376
- Issue date Apr 2, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Toshihiro Hosoi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board for transmitting high-frequency signal and method for...
- Patent number 11,950,357
- Issue date Apr 2, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring member having bending property and electronic device compris...
- Patent number 11,943,888
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of high-resolution graphene-based flexible electronics...
- Patent number 11,938,708
- Issue date Mar 26, 2024
- lowa State University Research Foundation, Inc.
- Metin Uz
- B32 - LAYERED PRODUCTS
Information Patent Grant
Highly electrically conductive silver ink composition and wiring ob...
- Patent number 11,939,482
- Issue date Mar 26, 2024
- DIC Corporation
- Saori Yamaguchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Transparent conductive circuit
- Patent number 11,943,865
- Issue date Mar 26, 2024
- Chasm Advanced Materials, Inc.
- Richard P. Heroux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor and method for operating sensor
- Patent number 11,933,754
- Issue date Mar 19, 2024
- LG Electronics Inc.
- Myungwon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 11,930,589
- Issue date Mar 12, 2024
- Ibiden Co., Ltd.
- Yoshihiko Hayashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic cover
- Patent number 11,920,765
- Issue date Mar 5, 2024
- ABB Schweiz AG
- Fabrice Martins
- F21 - LIGHTING
Information Patent Grant
Butt joint flex circuit board interconnection
- Patent number 11,923,628
- Issue date Mar 5, 2024
- Google LLC
- John Martinis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier-foil-attached ultra-thin copper foil
- Patent number 11,917,755
- Issue date Feb 27, 2024
- Lotte Energy Materials Corporation
- Won Jin Beom
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,917,756
- Issue date Feb 27, 2024
- Ibiden Co., Ltd.
- Yuji Ikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board for use at 5G frequencies
- Patent number 11,917,753
- Issue date Feb 27, 2024
- Ticona LLC
- Xiaowei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 11,916,285
- Issue date Feb 27, 2024
- Dai Nippon Printing Co., Ltd.
- Koichi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern transfer printing systems and methods
- Patent number 11,910,537
- Issue date Feb 20, 2024
- Wuhan DR Laser Technology Corp,. LTD
- Gad Igra
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Electronic device housings with patterned electrolytic plating layers
- Patent number 11,910,538
- Issue date Feb 20, 2024
- Hewlett-Packard Development Company, L.P.
- Yi-Chen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management in circuit board assemblies
- Patent number 11,910,520
- Issue date Feb 20, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for fabricating cross-layer pattern
- Patent number 11,904,525
- Issue date Feb 20, 2024
- Stratasys Ltd.
- Daniel Dikovsky
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
MICRO ASSEMBLED LED DISPLAYS AND LIGHTING ELEMENTS
- Publication number 20240153927
- Publication date May 9, 2024
- X Display Company Technology Limited
- Christopher Bower
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Flexible printed circuit, ink and method for obtaining flexible pri...
- Publication number 20240147618
- Publication date May 2, 2024
- UNIVERSIDADE DE COIMBRA
- Mahmoud TAVAKOLI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINAB...
- Publication number 20240147631
- Publication date May 2, 2024
- Liquid Wire, LLC
- Jorge E. Carbo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE COMPOSITION, CONDUCTIVE PASTE, ELECTRIC CIRCUIT, FLEXIBL...
- Publication number 20240145113
- Publication date May 2, 2024
- NAMICS CORPORATION
- Toshiaki OGIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BODY, MOUNTING SUBSTRATE, WIRING-EQUIPPED WIRING TRANSFER PL...
- Publication number 20240147617
- Publication date May 2, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Takayoshi NIRENGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING CIRCUIT ASSEMBLI...
- Publication number 20240138062
- Publication date Apr 25, 2024
- Liquid Wire, LLC
- Mark S. Kruskopf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Depositing a Bronze Alloy on a Printed Circuit and Print...
- Publication number 20240117518
- Publication date Apr 11, 2024
- LINXENS HOLDING
- Jerome SANSON
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD
- Publication number 20240114615
- Publication date Apr 4, 2024
- Nitto Denko Corporation
- Hayato TAKAKURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT
- Publication number 20240114627
- Publication date Apr 4, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CONFORMAL HIGH TEMPERATURE ELECTRONICS USING COPPER NANOINK
- Publication number 20240101850
- Publication date Mar 28, 2024
- The Research Foundation for The State University of New York
- Shenqiang REN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL SUBSTRATE WITH HIGH-RESISTANCE MAGNIFICATION AND POSITIVE T...
- Publication number 20240101851
- Publication date Mar 28, 2024
- LMS Consulting Group, LLC
- Shuyong Xiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD CONNECTION STRUCTURE AND PREPARATION METHOD THEREFOR
- Publication number 20240098908
- Publication date Mar 21, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID SOFT-RIGID ELECTRICAL INTERCONNECTION SYSTEM
- Publication number 20240091528
- Publication date Mar 21, 2024
- ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)
- Florian FALLEGGER
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE
- Publication number 20240090135
- Publication date Mar 14, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE RESIN COMPOSITION
- Publication number 20240084154
- Publication date Mar 14, 2024
- SAKATA INX CORPORATION
- Masayuki SASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING ASSEMBLY, CAMERA MODULE, AND ELECTRONIC DEVICE
- Publication number 20240089576
- Publication date Mar 14, 2024
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- FEI-FAN YU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240079188
- Publication date Mar 7, 2024
- Murata Manufacturing Co., Ltd.
- Ryuichiro TOMINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE INK INTERCONNECTED DEVICES
- Publication number 20240074045
- Publication date Feb 29, 2024
- NCR Corporation
- John Paul Bacalso Aliganga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME
- Publication number 20240074058
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- JAEKWANG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE STRUCTURE INCLUDING COPPER-PHOSPHOROUS ALLOY AND A METHO...
- Publication number 20240063110
- Publication date Feb 22, 2024
- CHUN-MING LIN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20240055745
- Publication date Feb 15, 2024
- Murata Manufacturing Co., Ltd.
- Nobuo IKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240049398
- Publication date Feb 8, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE AND ELECTRONIC DEVICE
- Publication number 20240049386
- Publication date Feb 8, 2024
- FUJIFILM CORPORATION
- Akio KATAYAMA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
APPARATUS AND METHOD OF PRODUCING A SENSING SUBSTRATE
- Publication number 20240042898
- Publication date Feb 8, 2024
- Joyson Safety Systems Acquisition LLC
- David Wilson
- B60 - VEHICLES IN GENERAL
Information Patent Application
METAL NANOWIRE INK FOR THE FORMATION OF TRANSPARENT CONDUCTIVE FILM...
- Publication number 20240043711
- Publication date Feb 8, 2024
- C3 Nano, Inc.
- Ying-Syi Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INDUCED CIRCUITRY WITHIN A HARD DIAMOND-LIKE AND CARBON-RICH LAYER...
- Publication number 20240049385
- Publication date Feb 8, 2024
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Alireza Zolfaghari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stretchable Interconnects for Flexible Electronic Surfaces
- Publication number 20240029916
- Publication date Jan 25, 2024
- Alpha Assembly Solutions Inc.
- Narahari PUJARI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
A METHOD FOR MAKING A LIGHTING DEVICE
- Publication number 20240032199
- Publication date Jan 25, 2024
- SIGNFY HOLDING B.V.
- Aldegonda Lucia WEIJERS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIELECTRIC SUBSTRATE AND METHOD OF FORMING THE SAME
- Publication number 20240023242
- Publication date Jan 18, 2024
- SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION
- Jennifer ADAMCHUK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL FOIL, METAL FOIL WITH CARRIER COMPRISING SAME, AND PRINTED CI...
- Publication number 20240015885
- Publication date Jan 11, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Use of materials for the metallic pattern or other conductive pattern

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Flexible laminated board and multilayer circuit board

Printed film electrostatic concentration for radon detection

Printed wiring board and method of manufacturing the same

Stretchable wiring board and electrical muscle stimulating device

Flexible electrode circuit capable of being 3D circuit printed stra...

Ceramic metal circuit board and semiconductor device using the same

Printed circuits with embedded resistive thermal devices

Metal nanowire networks and transparent conductive material

Printed wiring board and method for manufacturing printed wiring board

Electronic component

Substrate for high-frequency printed wiring board

Surface-treated copper foil and method for manufacturing same

Copper-clad laminate

Circuit board for transmitting high-frequency signal and method for...

Wiring member having bending property and electronic device compris...

Fabrication of high-resolution graphene-based flexible electronics...

Highly electrically conductive silver ink composition and wiring ob...

Transparent conductive circuit

Sensor and method for operating sensor

Printed wiring board and method for manufacturing the same

Electronic cover

Butt joint flex circuit board interconnection

Carrier-foil-attached ultra-thin copper foil

Printed wiring board and method for manufacturing printed wiring board

Circuit board for use at 5G frequencies

Wiring board and method for manufacturing wiring board

Pattern transfer printing systems and methods

Electronic device housings with patterned electrolytic plating layers

Thermal management in circuit board assemblies

Method and system for fabricating cross-layer pattern

Patents Applicationslast 30 patents

MICRO ASSEMBLED LED DISPLAYS AND LIGHTING ELEMENTS

Flexible printed circuit, ink and method for obtaining flexible pri...

DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINAB...

CONDUCTIVE COMPOSITION, CONDUCTIVE PASTE, ELECTRIC CIRCUIT, FLEXIBL...

WIRING BODY, MOUNTING SUBSTRATE, WIRING-EQUIPPED WIRING TRANSFER PL...

DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING CIRCUIT ASSEMBLI...

Method for Depositing a Bronze Alloy on a Printed Circuit and Print...

METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD

ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT

PRINTED CONFORMAL HIGH TEMPERATURE ELECTRONICS USING COPPER NANOINK

THERMAL SUBSTRATE WITH HIGH-RESISTANCE MAGNIFICATION AND POSITIVE T...

CIRCUIT BOARD CONNECTION STRUCTURE AND PREPARATION METHOD THEREFOR

HYBRID SOFT-RIGID ELECTRICAL INTERCONNECTION SYSTEM

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE

CONDUCTIVE RESIN COMPOSITION

CONNECTING ASSEMBLY, CAMERA MODULE, AND ELECTRONIC DEVICE

ELECTRONIC COMPONENT

CONDUCTIVE INK INTERCONNECTED DEVICES

MODULE BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME

CONDUCTIVE STRUCTURE INCLUDING COPPER-PHOSPHOROUS ALLOY AND A METHO...

MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

LAMINATE AND ELECTRONIC DEVICE

APPARATUS AND METHOD OF PRODUCING A SENSING SUBSTRATE

METAL NANOWIRE INK FOR THE FORMATION OF TRANSPARENT CONDUCTIVE FILM...

INDUCED CIRCUITRY WITHIN A HARD DIAMOND-LIKE AND CARBON-RICH LAYER...

Stretchable Interconnects for Flexible Electronic Surfaces

A METHOD FOR MAKING A LIGHTING DEVICE

DIELECTRIC SUBSTRATE AND METHOD OF FORMING THE SAME

METAL FOIL, METAL FOIL WITH CARRIER COMPRISING SAME, AND PRINTED CI...