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used as a support during manufacture of interconnect decals or build up layers
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H01L2221/68359
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2221/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
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H01L2221/68359
used as a support during manufacture of interconnect decals or build up layers
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor package using a coreless signal distribution structure
Patent number
12,322,731
Issue date
Jun 3, 2025
Amkor Technology Singapore Holding Pte Ltd.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of manufacturing the same
Patent number
12,322,691
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat dissipating features for laser drilling process
Patent number
12,322,716
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Aligning bumps in fan-out packaging process
Patent number
12,300,659
Issue date
May 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ying-Jui Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and method of manufacturing the same
Patent number
12,300,560
Issue date
May 13, 2025
Advanced Semiconductor Engineering, Inc.
Ming-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including heat sink with exposed side from enc...
Patent number
12,300,584
Issue date
May 13, 2025
Amkor Technology Singapore Holding Pte Ltd.
Hyung Jun Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Photonics integrated circuit package
Patent number
12,293,974
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Feng Wei Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density interconnection using fanout interposer chiplet
Patent number
12,283,549
Issue date
Apr 22, 2025
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Stacking structure, package structure and method of fabricating the...
Patent number
12,272,674
Issue date
Apr 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated devices in semiconductor packages and methods of forming...
Patent number
12,266,619
Issue date
Apr 1, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Info structure with copper pillar having reversed profile
Patent number
12,261,074
Issue date
Mar 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsi-Kuei Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor packages and methods of forming the same
Patent number
12,255,184
Issue date
Mar 18, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-level micro-device tethers
Patent number
12,249,532
Issue date
Mar 11, 2025
X Display Company Technology Limited
Christopher Andrew Bower
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and method manufacturing the same
Patent number
12,249,550
Issue date
Mar 11, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Feng-Cheng Hsu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package structure, RDL structure comprising redistribution layer ha...
Patent number
12,249,564
Issue date
Mar 11, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chien-Hsun Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device with electromagnetic interference film and met...
Patent number
12,243,833
Issue date
Mar 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chi-Hsi Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Display with embedded pixel driver chips
Patent number
12,243,863
Issue date
Mar 4, 2025
Hsin-Hua Hu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package structure and method
Patent number
12,237,238
Issue date
Feb 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Dummy structure of stacked and bonded semiconductor device
Patent number
12,237,291
Issue date
Feb 25, 2025
Taiwan Semiconductor Manufacturing Company
Li-Hui Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated circuit structure
Patent number
12,238,865
Issue date
Feb 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package device
Patent number
12,230,558
Issue date
Feb 18, 2025
Innolux Corporation
Hsueh-Hsuan Chou
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package and method of forming same
Patent number
12,222,545
Issue date
Feb 11, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and method of fabricating the same
Patent number
12,218,070
Issue date
Feb 4, 2025
Samsung Electronics Co., Ltd.
Hae-Jung Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure having molding layer
Patent number
12,218,095
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and method of forming the same
Patent number
12,211,801
Issue date
Jan 28, 2025
Parabellum Strategic Opportunities Fund LLC
Yu-Hsiang Hu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Electronic device with top side pin array and manufacturing method...
Patent number
12,205,827
Issue date
Jan 21, 2025
Amkor Technology Singapore Holding Pte Ltd.
Devarajan Balaraman
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method of fabricating the same
Patent number
12,199,060
Issue date
Jan 14, 2025
Samsung Electronics Co., Ltd.
Changbo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous annealing method and device
Patent number
12,199,069
Issue date
Jan 14, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
12,199,024
Issue date
Jan 14, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure
Patent number
12,191,287
Issue date
Jan 7, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...
Publication number
20250167007
Publication date
May 22, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Devarajan Balaraman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER
Publication number
20250167158
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Puu JENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
Publication number
20250167171
Publication date
May 22, 2025
VueReal Inc.
Gholamreza CHAJI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
Publication number
20250167172
Publication date
May 22, 2025
VueReal Inc.
Gholamreza CHAJI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURE
Publication number
20250159812
Publication date
May 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
MANUFACTURING METHOD OF PACKAGE DEVICE
Publication number
20250157904
Publication date
May 15, 2025
InnoLux Corporation
Hsueh-Hsuan Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
Publication number
20250157939
Publication date
May 15, 2025
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
Publication number
20250157985
Publication date
May 15, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURES
Publication number
20250157870
Publication date
May 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HETEROGENEOUS ANNEALING METHOD AND DEVICE
Publication number
20250149510
Publication date
May 8, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package And Method Of Fabricating The Same
Publication number
20250132263
Publication date
Apr 24, 2025
Samsung Electronics Co., Ltd.
Hae-Jung YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Publication number
20250096181
Publication date
Mar 20, 2025
Samsung Electronics Co., Ltd.
Changbo LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE
Publication number
20250087648
Publication date
Mar 13, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Jing-Cheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20250079251
Publication date
Mar 6, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Fung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER
Publication number
20250070032
Publication date
Feb 27, 2025
Samsung Electronics Co., Ltd.
Jong-youn Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods And Systems Of Forming Metal Interconnect Layers Using Engi...
Publication number
20250069900
Publication date
Feb 27, 2025
Rashid Mavliev
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Heterogeneous Fan-Out Structure and Method of Manufacture
Publication number
20250038087
Publication date
Jan 30, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Po-Hao Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING
Publication number
20250029929
Publication date
Jan 23, 2025
Intel Corporation
Sanka GANESAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
Publication number
20240421131
Publication date
Dec 19, 2024
Lodestar Licensing Group LLC
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
Publication number
20240404863
Publication date
Dec 5, 2024
Samsung Electronics Co., Ltd.
Kwang Yong YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTOSENSITIVE COMPOSITION, TRANSFER FILM, CURED FILM, SEMICONDUCTO...
Publication number
20240395551
Publication date
Nov 28, 2024
FUJIFILM CORPORATION
Keigo YAMAGUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING ELECTRONIC APPARATUS
Publication number
20240387367
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tzu-Chun Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...
Publication number
20240387401
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chi-Hsi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Devices and Methods of Manufacturing
Publication number
20240379648
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chang-Yi Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
Publication number
20240379646
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
Publication number
20240379429
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing company Ltd.
JING-CHENG LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20240379577
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Puu JENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
Publication number
20240379535
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chung-Shi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE
Publication number
20240371814
Publication date
Nov 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Chia Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240371840
Publication date
Nov 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS