used as a support during the manufacture of self supporting substrates

Industry

CPC
H01L2221/68345

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68345used as a support during the manufacture of self supporting substrates

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device multilevel package substrate for improved electro...
- Patent number 11,978,699
- Issue date May 7, 2024
- Texas Instruments Incorporated
- Sylvester Ankamah-Kusi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated package including device dies connected via interconne...
- Patent number 11,978,714
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with improved antenna patterns performance
- Patent number 11,973,038
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods for forming the same
- Patent number 11,961,791
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,955,459
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Hang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,948,808
- Issue date Apr 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with through vias
- Patent number 11,948,876
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ling-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,948,890
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,942,408
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,464
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,435
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with transmissive layer and manufacturing meth...
- Patent number 11,942,581
- Issue date Mar 26, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including binding agent adhering an integrated...
- Patent number 11,929,345
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device having chip stacked a...
- Patent number 11,923,287
- Issue date Mar 5, 2024
- Kabushiki Kaisha Toshiba
- Takayuki Tajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LTHC as charging barrier in info package formation
- Patent number 11,923,353
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,908,787
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,901,252
- Issue date Feb 13, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate assembly with encapsulated magnetic feature
- Patent number 11,901,115
- Issue date Feb 13, 2024
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,901,277
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ting Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
InFO-POP structures with TIVs having cavities
- Patent number 11,901,302
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,901,332
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,901,279
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ting Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,894,308
- Issue date Feb 6, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device encapsulated by molding material attached to r...
- Patent number 11,887,952
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,881,471
- Issue date Jan 23, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 11,869,879
- Issue date Jan 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,862,469
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Package structure for heat dissipation
- Patent number 11,854,785
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device having TSV formed through...
- Patent number 11,854,990
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
InFO-POP Structures with TIVs Having Cavities
- Publication number 20240136298
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Dp., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240087903
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDED GLASS CARRIERS FOR MAKING PACKAGE SUBSTRATES
- Publication number 20240079259
- Publication date Mar 7, 2024
- Intel Corporation
- Jacob VEHONSKY
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR PACKAGE CARRIER BOARD STRUCTURE AND MANUFACTURING MET...
- Publication number 20240055274
- Publication date Feb 15, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Pao-Hung CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH EMBEDDED DEVICE, AND MANUFACTURING METHOD TH...
- Publication number 20240047227
- Publication date Feb 8, 2024
- Zhuhai ACCESS Semiconductor Co., LTD.
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240006219
- Publication date Jan 4, 2024
- ENKRIS SEMICONDUCTOR, INC.
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE HAVING EMBEDDED OPTICA...
- Publication number 20230377907
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi WU
- G02 - OPTICS
Information Patent Application
PACKAGE WITH FAN-OUT STRUCTURES
- Publication number 20230378078
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER-ATTACHED STRUCTURE
- Publication number 20230377973
- Publication date Nov 23, 2023
- ROHM CO., LTD.
- Masatoshi AKETA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Antenna Package For Signal Transmission
- Publication number 20230378636
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng-Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230369151
- Publication date Nov 16, 2023
- XINTEC INC.
- Hsiao-Lan YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20230369287
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR DIE TILING
- Publication number 20230343774
- Publication date Oct 26, 2023
- Intel Corporation
- Srinivas PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT
- Publication number 20230335525
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan PEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming the Same
- Publication number 20230335536
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER
- Publication number 20230317623
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Jong-youn Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan-Out Package with 3D Magnetic Core Inductor
- Publication number 20230298993
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20230282560
- Publication date Sep 7, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH REDISTRIBUTION STRUCTURE HAVING MULTIPLE CHIPS
- Publication number 20230260890
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230260944
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- CHIH-TING LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING
- Publication number 20230260914
- Publication date Aug 17, 2023
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDISTRIBUTION LAYER HA...
- Publication number 20230260882
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN
- Publication number 20230253395
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230245975
- Publication date Aug 3, 2023
- Samsung Electronics Co., Ltd.
- Hae-Jung YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER FILM, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING MET...
- Publication number 20230245912
- Publication date Aug 3, 2023
- FUJIFILM CORPORATION
- Satoru YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230223365
- Publication date Jul 13, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CHIP PACKAGE STRUCTURE
- Publication number 20230207477
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING A SELF-SUPPORTING SUBSTRATE
- Publication number 20230175167
- Publication date Jun 8, 2023
- Yiguan information technology (Shanghai) Co., Ltd.
- Tao Jiang
- C30 - CRYSTAL GROWTH
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230145304
- Publication date May 11, 2023
- InnoLux Corporation
- Yi-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coreless Component Carrier With Embedded Components
- Publication number 20230128938
- Publication date Apr 27, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Allen ZHAO
- H01 - BASIC ELECTRIC ELEMENTS

used as a support during the manufacture of self supporting substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device multilevel package substrate for improved electro...

Encapsulated package including device dies connected via interconne...

Package structure with improved antenna patterns performance

Package structures and methods for forming the same

Package structure

Semiconductor device and manufacturing method thereof

Package structure with through vias

Semiconductor package and method

Semiconductor structure and manufacturing method thereof

Semiconductor package and method

Semiconductor package and method

Semiconductor device with transmissive layer and manufacturing meth...

Semiconductor device including binding agent adhering an integrated...

Method for manufacturing semiconductor device having chip stacked a...

LTHC as charging barrier in info package formation

Package structure and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Substrate assembly with encapsulated magnetic feature

Semiconductor package and method of manufacturing the same

InFO-POP structures with TIVs having cavities

Semiconductor device and manufacturing method thereof

Semiconductor package and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Manufacturing method of package structure

Semiconductor device encapsulated by molding material attached to r...

Semiconductor device and manufacturing method thereof

Semiconductor package using a coreless signal distribution structure

Package structure and method of manufacturing the same

Package structure for heat dissipation

Method for forming a semiconductor device having TSV formed through...

Patents Applicationslast 30 patents

InFO-POP Structures with TIVs Having Cavities

PACKAGE STRUCTURE

DUAL SIDED GLASS CARRIERS FOR MAKING PACKAGE SUBSTRATES

SEMICONDUCTOR PACKAGE CARRIER BOARD STRUCTURE AND MANUFACTURING MET...

PACKAGE SUBSTRATE WITH EMBEDDED DEVICE, AND MANUFACTURING METHOD TH...

SEMICONDUCTOR STRUCTURE

PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE HAVING EMBEDDED OPTICA...

PACKAGE WITH FAN-OUT STRUCTURES

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER-ATTACHED STRUCTURE

Antenna Package For Signal Transmission

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FABRICATING THE SAME

MULTI-CHIP PACKAGES AND METHODS OF FORMING THE SAME

TECHNIQUES FOR DIE TILING

PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT

Semiconductor Packages and Methods of Forming the Same

SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER

Integrated Fan-Out Package with 3D Magnetic Core Inductor

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

CHIP PACKAGE WITH REDISTRIBUTION STRUCTURE HAVING MULTIPLE CHIPS

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING

PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDISTRIBUTION LAYER HA...

PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

TRANSFER FILM, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING MET...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR FORMING CHIP PACKAGE STRUCTURE

METHOD FOR PREPARING A SELF-SUPPORTING SUBSTRATE

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Coreless Component Carrier With Embedded Components