used during dicing or grinding

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CPC
H01L2221/68327

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68327used during dicing or grinding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming insulating layers around...
- Patent number 12,322,725
- Issue date Jun 3, 2025
- Semtech Corporation
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive sheet for backgrinding and production method for semicondu...
- Patent number 12,312,512
- Issue date May 27, 2025
- Disco Corporation
- Karl Heinz Priewasser
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer processing method
- Patent number 12,315,716
- Issue date May 27, 2025
- Disco Corporation
- Shunichiro Hirosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DBI to SI bonding for simplified handle wafer
- Patent number 12,300,662
- Issue date May 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for protecting an optoelectronic device against electrostati...
- Patent number 12,300,521
- Issue date May 13, 2025
- Aledia
- Frédéric Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and manufacturing method thereof
- Patent number 12,300,685
- Issue date May 13, 2025
- Seoul Semiconductor Co., Ltd.
- Motonobu Takeya
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,300,563
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Infrared debond damage mitigation by copper fill pattern
- Patent number 12,300,615
- Issue date May 13, 2025
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for processing a microelectronic substrate, and related me...
- Patent number 12,288,575
- Issue date Apr 29, 2025
- Seagate Technology LLC
- Zubair Ahmed Khan
- B24 - GRINDING POLISHING
Information Patent Grant
Adhesive sheet
- Patent number 12,286,569
- Issue date Apr 29, 2025
- Nitto Denko Corporation
- Shusaku Ueno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 12,272,674
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package unit and associated packaging method
- Patent number 12,266,583
- Issue date Apr 1, 2025
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package process and package structure
- Patent number 12,266,632
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method of wafer
- Patent number 12,255,086
- Issue date Mar 18, 2025
- Disco Corporation
- Kohei Tsujimoto
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,249,550
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display with embedded pixel driver chips
- Patent number 12,243,863
- Issue date Mar 4, 2025
- Hsin-Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective component forming apparatus
- Patent number 12,230,520
- Issue date Feb 18, 2025
- Disco Corporation
- Yoshinori Kakinuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a workpiece and system for processing a workpiece
- Patent number 12,224,207
- Issue date Feb 11, 2025
- Disco Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding to alignment marks with dummy alignment marks
- Patent number 12,218,097
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment device and alignment method
- Patent number 12,211,723
- Issue date Jan 28, 2025
- DISCO HI-TEC EUROPE GMBH
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chuck for a laser beam wafer dicing equipment
- Patent number 12,205,842
- Issue date Jan 21, 2025
- Infineon Technologies AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser dicing for singulation
- Patent number 12,198,982
- Issue date Jan 14, 2025
- Texas Instruments Incorporated
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 12,198,990
- Issue date Jan 14, 2025
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,199,024
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide wafer and method for manufacturing the same
- Patent number 12,188,151
- Issue date Jan 7, 2025
- Denso Corporation
- Hiroaki Fujibayashi
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method and system for manufacturing a semiconductor package structure
- Patent number 12,183,712
- Issue date Dec 31, 2024
- Advanced Semiconductor Engineering, Inc.
- Che-Ting Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,176,258
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallel assembly of discrete components onto a substrate
- Patent number 12,176,239
- Issue date Dec 24, 2024
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250183217
- Publication date Jun 5, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKGRIND TAPE ETCHING FOR IMPROVED LASER DICING
- Publication number 20250183090
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jezreel Duane Aquino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PRODUCTION METHOD USING PEEL TAPE AND ADHESIVE MATERIAL, PEEL...
- Publication number 20250167035
- Publication date May 22, 2025
- Mitsui Chemicals ICT Materia, Inc.
- Takashi SUZUKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Wafer Level Integration of Passive Devices
- Publication number 20250167176
- Publication date May 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DICING FOR SINGULATION
- Publication number 20250157858
- Publication date May 15, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TO ALIGNMENT MARKS WITH DUMMY ALIGNMENT MARKS
- Publication number 20250149500
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE DEVICES WITH METALLIZED DIES
- Publication number 20250140620
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Thomas KRONENBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20250125197
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Junyun Kweon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR DIVIDING WAFER
- Publication number 20250118601
- Publication date Apr 10, 2025
- Disco Corporation
- Shinya ARUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR CHIP
- Publication number 20250118565
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Hyunho Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...
- Publication number 20250112188
- Publication date Apr 3, 2025
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES
- Publication number 20250112210
- Publication date Apr 3, 2025
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250112080
- Publication date Apr 3, 2025
- ROHM CO., LTD.
- Takaaki YAMANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF RADIO FREQUENCY AND HIGH-VOLTAGE DEVICES
- Publication number 20250112216
- Publication date Apr 3, 2025
- Intel Corporation
- Qiang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES
- Publication number 20250112196
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LAYER TRANSFER
- Publication number 20250105046
- Publication date Mar 27, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20250095999
- Publication date Mar 20, 2025
- Kabushiki Kaisha Toshiba
- Takeyuki SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ADHESIVE COMPOSITION FOR OPTICAL IRRADIATIO...
- Publication number 20250092293
- Publication date Mar 20, 2025
- NISSAN CHEMICAL CORPORATION
- Hiroshi OGINO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250096107
- Publication date Mar 20, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING PROCESSED...
- Publication number 20250084291
- Publication date Mar 13, 2025
- NISSAN CHEMICAL CORPORATION
- Takahisa OKUNO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BACK GRINDING TAPE HAVING TABS TO ASSIST IN REMOVING THE BACK GRIND...
- Publication number 20250087519
- Publication date Mar 13, 2025
- Western Digital Technologies, Inc.
- Seng Yu Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20250075111
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Hyungjun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR RING FRAME CLEANING AND INSPECTION
- Publication number 20250062153
- Publication date Feb 20, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Chien-Fa LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SELECTIVE RELEASE OF COMPONENTS USING THERMAL RELEASE LAYER
- Publication number 20250054785
- Publication date Feb 13, 2025
- Deca Technologies USA, Inc.
- Benedict SAN JOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHED TRENCHES IN BOND MATERIALS FOR DIE SINGULATION, AND ASSOCIAT...
- Publication number 20250056937
- Publication date Feb 13, 2025
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LAMINATION SYSTEMS AND METHODS THEREOF FOR SEMICONDUCTOR WAFERS
- Publication number 20250038037
- Publication date Jan 30, 2025
- UTAC Headquarters Pte. Ltd.
- IL KWON SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250038052
- Publication date Jan 30, 2025
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING DEVICE, WAFER MOUNTING DEVICE, DICING D...
- Publication number 20250038038
- Publication date Jan 30, 2025
- Mitsubishi Electric Corporation
- Osamu ZAIMA
- H01 - BASIC ELECTRIC ELEMENTS

used during dicing or grinding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of forming insulating layers around...

Adhesive sheet for backgrinding and production method for semicondu...

Wafer processing method

DBI to SI bonding for simplified handle wafer

Method for protecting an optoelectronic device against electrostati...

Display apparatus and manufacturing method thereof

Semiconductor package and method of fabricating the same

Infrared debond damage mitigation by copper fill pattern

Adhesive for processing a microelectronic substrate, and related me...

Adhesive sheet

Stacking structure, package structure and method of fabricating the...

Flip chip package unit and associated packaging method

Package process and package structure

Semiconductor packages with an intermetallic layer

Processing method of wafer

Semiconductor package and method manufacturing the same

Display with embedded pixel driver chips

Semiconductor device and method of forming micro interconnect struc...

Protective component forming apparatus

Method of processing a workpiece and system for processing a workpiece

Bonding to alignment marks with dummy alignment marks

Alignment device and alignment method

Wafer chuck for a laser beam wafer dicing equipment

Laser dicing for singulation

Wafer manufacturing method and laminated device chip manufacturing...

Semiconductor device and method of manufacture

Silicon carbide wafer and method for manufacturing the same

Method and system for manufacturing a semiconductor package structure

Semiconductor package and method manufacturing the same

Parallel assembly of discrete components onto a substrate

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

BACKGRIND TAPE ETCHING FOR IMPROVED LASER DICING

WAFER PRODUCTION METHOD USING PEEL TAPE AND ADHESIVE MATERIAL, PEEL...

Wafer Level Integration of Passive Devices

LASER DICING FOR SINGULATION

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

BONDING TO ALIGNMENT MARKS WITH DUMMY ALIGNMENT MARKS

ELECTROSTATIC DISCHARGE DEVICES WITH METALLIZED DIES

SEMICONDUCTOR CHIP

METHOD AND APPARATUS FOR DIVIDING WAFER

METHOD OF MANUFACTURING SEMICONDUCTOR CHIP

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...

FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES

WAFER STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY AND HIGH-VOLTAGE DEVICES

SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES

SELECTIVE LAYER TRANSFER

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING AN ADHESIVE COMPOSITION FOR OPTICAL IRRADIATIO...

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

ADHESIVE COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING PROCESSED...

BACK GRINDING TAPE HAVING TABS TO ASSIST IN REMOVING THE BACK GRIND...

ADHESIVE COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

SYSTEM AND METHOD FOR RING FRAME CLEANING AND INSPECTION

METHOD OF SELECTIVE RELEASE OF COMPONENTS USING THERMAL RELEASE LAYER

ETCHED TRENCHES IN BOND MATERIALS FOR DIE SINGULATION, AND ASSOCIAT...

WAFER LAMINATION SYSTEMS AND METHODS THEREOF FOR SEMICONDUCTOR WAFERS

CHIP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR MANUFACTURING DEVICE, WAFER MOUNTING DEVICE, DICING D...