used during dicing or grinding

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CPC
H01L2221/68327

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68327used during dicing or grinding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display apparatus and manufacturing method thereof
- Patent number 12,368,145
- Issue date Jul 22, 2025
- Seoul Semiconductor Co., Ltd.
- Motonobu Takeya
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 12,362,260
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 12,362,221
- Issue date Jul 15, 2025
- MITSUI CHEMICALS ICT MATERIA, INC.
- Toru Miura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Singulation systems and related methods
- Patent number 12,354,917
- Issue date Jul 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for splitting semiconductor wafers
- Patent number 12,356,700
- Issue date Jul 8, 2025
- Infineon Technologies AG
- Christian Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Debonding structures for wafer bonding
- Patent number 12,347,717
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ting Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chips
- Patent number 12,341,068
- Issue date Jun 24, 2025
- Disco Corporation
- Hideyuki Sandoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer cleaning apparatus
- Patent number 12,341,052
- Issue date Jun 24, 2025
- ZEUS CO., LTD.
- Seung Dae Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 12,341,051
- Issue date Jun 24, 2025
- Fuji Electric Co., Ltd.
- Kazuhiro Kitahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 12,334,476
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,327,812
- Issue date Jun 10, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layers around...
- Patent number 12,322,725
- Issue date Jun 3, 2025
- Semtech Corporation
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive sheet for backgrinding and production method for semicondu...
- Patent number 12,312,512
- Issue date May 27, 2025
- Disco Corporation
- Karl Heinz Priewasser
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer processing method
- Patent number 12,315,716
- Issue date May 27, 2025
- Disco Corporation
- Shunichiro Hirosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DBI to SI bonding for simplified handle wafer
- Patent number 12,300,662
- Issue date May 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for protecting an optoelectronic device against electrostati...
- Patent number 12,300,521
- Issue date May 13, 2025
- Aledia
- Frédéric Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and manufacturing method thereof
- Patent number 12,300,685
- Issue date May 13, 2025
- Seoul Semiconductor Co., Ltd.
- Motonobu Takeya
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,300,563
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Infrared debond damage mitigation by copper fill pattern
- Patent number 12,300,615
- Issue date May 13, 2025
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for processing a microelectronic substrate, and related me...
- Patent number 12,288,575
- Issue date Apr 29, 2025
- Seagate Technology LLC
- Zubair Ahmed Khan
- B24 - GRINDING POLISHING
Information Patent Grant
Adhesive sheet
- Patent number 12,286,569
- Issue date Apr 29, 2025
- Nitto Denko Corporation
- Shusaku Ueno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 12,272,674
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package unit and associated packaging method
- Patent number 12,266,583
- Issue date Apr 1, 2025
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package process and package structure
- Patent number 12,266,632
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method of wafer
- Patent number 12,255,086
- Issue date Mar 18, 2025
- Disco Corporation
- Kohei Tsujimoto
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,249,550
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display with embedded pixel driver chips
- Patent number 12,243,863
- Issue date Mar 4, 2025
- Hsin-Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective component forming apparatus
- Patent number 12,230,520
- Issue date Feb 18, 2025
- Disco Corporation
- Yoshinori Kakinuma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239501
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Workpiece Processing Method
- Publication number 20250226229
- Publication date Jul 10, 2025
- LINTEC CORPORATION
- Hayato Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR TEMPORARY FIXATION
- Publication number 20250215289
- Publication date Jul 3, 2025
- DENKA COMPANY LIMITED
- Takako HOSHINO TANIGAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE
- Publication number 20250218851
- Publication date Jul 3, 2025
- INNOX ADVANCED MATERIALS CO., LTD.
- Keun-Young Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Publication number 20250201762
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Sungmin MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING/DIE-BONDING FILM AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20250201618
- Publication date Jun 19, 2025
- Resonac Corporation
- Tsuyoshi TAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET FOR WORKPIECE PROCESSING AND MANUFACTURING METHOD OF PROCESSE...
- Publication number 20250201619
- Publication date Jun 19, 2025
- LINTEC CORPORATION
- Akio FUKUMOTO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PARALLEL ASSEMBLY OF DISCRETE COMPONENTS ONTO A SUBSTRATE
- Publication number 20250201620
- Publication date Jun 19, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATING DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR CHIP USIN...
- Publication number 20250201597
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- YEONG JUN JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250201632
- Publication date Jun 19, 2025
- DENSO CORPORATION
- Yuji NAGUMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250201753
- Publication date Jun 19, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION METHOD OF WAFER
- Publication number 20250191925
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- Kai ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250183217
- Publication date Jun 5, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKGRIND TAPE ETCHING FOR IMPROVED LASER DICING
- Publication number 20250183090
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jezreel Duane Aquino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PRODUCTION METHOD USING PEEL TAPE AND ADHESIVE MATERIAL, PEEL...
- Publication number 20250167035
- Publication date May 22, 2025
- Mitsui Chemicals ICT Materia, Inc.
- Takashi SUZUKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Wafer Level Integration of Passive Devices
- Publication number 20250167176
- Publication date May 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DICING FOR SINGULATION
- Publication number 20250157858
- Publication date May 15, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TO ALIGNMENT MARKS WITH DUMMY ALIGNMENT MARKS
- Publication number 20250149500
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE DEVICES WITH METALLIZED DIES
- Publication number 20250140620
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Thomas KRONENBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20250125197
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Junyun Kweon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR DIVIDING WAFER
- Publication number 20250118601
- Publication date Apr 10, 2025
- Disco Corporation
- Shinya ARUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR CHIP
- Publication number 20250118565
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Hyunho Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...
- Publication number 20250112188
- Publication date Apr 3, 2025
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES
- Publication number 20250112210
- Publication date Apr 3, 2025
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250112080
- Publication date Apr 3, 2025
- ROHM CO., LTD.
- Takaaki YAMANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF RADIO FREQUENCY AND HIGH-VOLTAGE DEVICES
- Publication number 20250112216
- Publication date Apr 3, 2025
- Intel Corporation
- Qiang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES
- Publication number 20250112196
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LAYER TRANSFER
- Publication number 20250105046
- Publication date Mar 27, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS

used during dicing or grinding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display apparatus and manufacturing method thereof

Methods of packaging semiconductor devices and packaged semiconduct...

Method for manufacturing electronic device

Singulation systems and related methods

Method for splitting semiconductor wafers

Debonding structures for wafer bonding

Method of manufacturing chips

Wafer cleaning apparatus

Manufacturing method of semiconductor device

Semiconductor device with discrete blocks

Semiconductor device and manufacturing method thereof

Semiconductor device and method of forming insulating layers around...

Adhesive sheet for backgrinding and production method for semicondu...

Wafer processing method

DBI to SI bonding for simplified handle wafer

Method for protecting an optoelectronic device against electrostati...

Display apparatus and manufacturing method thereof

Semiconductor package and method of fabricating the same

Infrared debond damage mitigation by copper fill pattern

Adhesive for processing a microelectronic substrate, and related me...

Adhesive sheet

Stacking structure, package structure and method of fabricating the...

Flip chip package unit and associated packaging method

Package process and package structure

Semiconductor packages with an intermetallic layer

Processing method of wafer

Semiconductor package and method manufacturing the same

Display with embedded pixel driver chips

Semiconductor device and method of forming micro interconnect struc...

Protective component forming apparatus

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

Workpiece Processing Method

COMPOSITION FOR TEMPORARY FIXATION

ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES

DICING/DIE-BONDING FILM AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SHEET FOR WORKPIECE PROCESSING AND MANUFACTURING METHOD OF PROCESSE...

PARALLEL ASSEMBLY OF DISCRETE COMPONENTS ONTO A SUBSTRATE

LAMINATING DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR CHIP USIN...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

PLANARIZATION METHOD OF WAFER

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

BACKGRIND TAPE ETCHING FOR IMPROVED LASER DICING

WAFER PRODUCTION METHOD USING PEEL TAPE AND ADHESIVE MATERIAL, PEEL...

Wafer Level Integration of Passive Devices

LASER DICING FOR SINGULATION

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

BONDING TO ALIGNMENT MARKS WITH DUMMY ALIGNMENT MARKS

ELECTROSTATIC DISCHARGE DEVICES WITH METALLIZED DIES

SEMICONDUCTOR CHIP

METHOD AND APPARATUS FOR DIVIDING WAFER

METHOD OF MANUFACTURING SEMICONDUCTOR CHIP

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...

FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES

WAFER STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY AND HIGH-VOLTAGE DEVICES

SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES

SELECTIVE LAYER TRANSFER