Uses of liquids

Industry

CPC
H05K2203/0756

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0756Uses of liquids

Industries

Patents Grantslast 30 patents

Information Patent Grant
Circuit forming method
- Patent number 11,570,900
- Issue date Jan 31, 2023
- FUJI CORPORATION
- Kenji Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polishing composition and polishing method
- Patent number 11,492,512
- Issue date Nov 8, 2022
- FUJIMI INCORPORATED
- Yukinobu Yoshizaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a circuit board with a substrate made of silicon
- Patent number 10,278,283
- Issue date Apr 30, 2019
- Wen Yao Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for protecting an electronic circuit carrier against environ...
- Patent number 10,064,279
- Issue date Aug 28, 2018
- ZF Friedrichshafen AG
- Hermann Josef Robin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication methods for bio-compatible devices using an etch stop a...
- Patent number 10,057,983
- Issue date Aug 21, 2018
- VERILY LIFE SCIENCES LLC
- James Etzkorn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Suspension board and load beam combination including a positioning...
- Patent number 10,028,370
- Issue date Jul 17, 2018
- Nitto Denko Corporation
- Yasunari Ooyabu
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of removing soluble material layer by dissolving, method of...
- Patent number 9,686,868
- Issue date Jun 20, 2017
- Alps Electric Co., Ltd.
- Hiroyuki Kanno
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
COMPONENT MOUNT BOARD
- Publication number 20240172366
- Publication date May 23, 2024
- NIPPON MEKTRON, LTD.
- Azumi TOMINAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE TREATMENT DEVICE
- Publication number 20210402424
- Publication date Dec 30, 2021
- UNIVERSAL CIRCUIT BOARD EQUIPMENT CO., LTD.
- Takwo CHAN
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
CIRCUIT FORMING METHOD
- Publication number 20210298180
- Publication date Sep 23, 2021
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLISHING COMPOSITION AND POLISHING METHOD
- Publication number 20210095161
- Publication date Apr 1, 2021
- FUJIMI INCORPORATED
- Yukinobu YOSHIZAKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CIRCUIT BOARD WITH A SUBSTRATE MADE OF SILICON
- Publication number 20190191556
- Publication date Jun 20, 2019
- WEN YAO CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PROTECTING AN ELECTRONIC CIRCUIT CARRIER AGAINST ENVIRON...
- Publication number 20170042031
- Publication date Feb 9, 2017
- ZF Friedrichshafen AG
- Hermann Josef Robin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF REMOVING SOLUBLE MATERIAL LAYER BY DISSOLVING, METHOD OF...
- Publication number 20160338208
- Publication date Nov 17, 2016
- Alps Electric Co., Ltd.
- Hiroyuki Kanno
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUSPENSION BOARD WITH CIRCUIT, PRODUCING METHOD THEREOF, AND POSITI...
- Publication number 20150264795
- Publication date Sep 17, 2015
- Nitto Denko Corporation
- Yasunari OOYABU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Suspension board with circuit, producing method thereof, and positi...
- Publication number 20100032201
- Publication date Feb 11, 2010
- Nitto Denko Corporation
- Yasunari Ooyabu
- G11 - INFORMATION STORAGE

Uses of liquids

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit forming method

Polishing composition and polishing method

Method for forming a circuit board with a substrate made of silicon

Method for protecting an electronic circuit carrier against environ...

Fabrication methods for bio-compatible devices using an etch stop a...

Suspension board and load beam combination including a positioning...

Method of removing soluble material layer by dissolving, method of...

Patents Applicationslast 30 patents

COMPONENT MOUNT BOARD

SURFACE TREATMENT DEVICE

CIRCUIT FORMING METHOD

POLISHING COMPOSITION AND POLISHING METHOD

CIRCUIT BOARD WITH A SUBSTRATE MADE OF SILICON

METHOD FOR PROTECTING AN ELECTRONIC CIRCUIT CARRIER AGAINST ENVIRON...

METHOD OF REMOVING SOLUBLE MATERIAL LAYER BY DISSOLVING, METHOD OF...

SUSPENSION BOARD WITH CIRCUIT, PRODUCING METHOD THEREOF, AND POSITI...

Suspension board with circuit, producing method thereof, and positi...