using a bump connector

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81using a bump connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bump to package substrate solder joint
- Patent number 12,341,126
- Issue date Jun 24, 2025
- Texas Instruments Incorporated
- Dolores Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,341,106
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin shaping device
- Patent number 12,341,036
- Issue date Jun 24, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die RF circuits and package method thereof
- Patent number 12,341,133
- Issue date Jun 24, 2025
- Chengdu Sicore Semiconductor Corp. Ltd.
- Cemin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure, preparation method, and electronic device
- Patent number 12,341,116
- Issue date Jun 24, 2025
- Huawei Technologies Co., Ltd.
- Chaojun Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having copper pillar within solder bump and...
- Patent number 12,334,463
- Issue date Jun 17, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging structure and related inner lead bonding method
- Patent number 12,334,470
- Issue date Jun 17, 2025
- Sitronix Technology Corp.
- Ying-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture for computing system package
- Patent number 12,327,796
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with underfill containment barrier
- Patent number 12,327,773
- Issue date Jun 10, 2025
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 12,327,807
- Issue date Jun 10, 2025
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,327,812
- Issue date Jun 10, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,327,784
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Sangcheon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 12,319,564
- Issue date Jun 3, 2025
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 12,322,722
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit packages and fabrication methods using bond-on-pad (BoP) su...
- Patent number 12,322,690
- Issue date Jun 3, 2025
- Avago Technologies International Sales Pte. Limited
- Wen-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,315,785
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,315,831
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for superconducting multi-chip module
- Patent number 12,317,757
- Issue date May 27, 2025
- SeeQC, Inc.
- Daniel Yohannes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 12,317,416
- Issue date May 27, 2025
- Kioxia Corporation
- Tomonori Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing the same
- Patent number 12,315,855
- Issue date May 27, 2025
- Japan Display Inc.
- Kenichi Takemasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic device with reduced substrate wa...
- Patent number 12,315,741
- Issue date May 27, 2025
- Innolux Corporation
- Chuan-Ming Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with conductive or magnetic nanowires for localized heating...
- Patent number 12,300,591
- Issue date May 13, 2025
- Regents of The University of Minnesota
- Bethanie J Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, package structure and electronic manufacturing m...
- Patent number 12,300,651
- Issue date May 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Pei-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,300,667
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- YeongBeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive adhesive composition, and method for producing connectio...
- Patent number 12,297,377
- Issue date May 13, 2025
- Shinichirou Sukata
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Leadless semiconductor package with internal gull wing lead structures
- Patent number 12,300,586
- Issue date May 13, 2025
- NXP USA, INC.
- Pat Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming thereof
- Patent number 12,300,656
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pillar, method for manufacturing the same, and method fo...
- Patent number 12,293,983
- Issue date May 6, 2025
- DIC Corporation
- Ryota Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,294,002
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip packages and a chip package
- Patent number 12,293,986
- Issue date May 6, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20250210401
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF PRODUCING SEMICONDUCTOR MODULE
- Publication number 20250210435
- Publication date Jun 26, 2025
- Murata Manufacturing Co., Ltd.
- Akira FUJIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION
- Publication number 20250210562
- Publication date Jun 26, 2025
- Google LLC
- Erik Anthony Lucero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SOLDERING ELECTRONIC DEVICES AND METHOD OF MANUFACTURING...
- Publication number 20250205797
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- KYUNGDEUK MIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250210560
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Ji-Han KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210576
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING LIGHT EMITTING ELEMENT AND METHOD OF MANUFACTURIN...
- Publication number 20250210584
- Publication date Jun 26, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jae Gwang UM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS...
- Publication number 20250210608
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lipu Kris Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Publication number 20250201762
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Sungmin MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250201686
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reflowable Vapor Chamber Lid
- Publication number 20250201663
- Publication date Jun 19, 2025
- Marvell Asia Pte Ltd.
- Alaba Bamido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNING SEMICONDUCTOR CONSTRUCTION
- Publication number 20250201761
- Publication date Jun 19, 2025
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250201753
- Publication date Jun 19, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO REDUCE...
- Publication number 20250201720
- Publication date Jun 19, 2025
- Intel Corporation
- Minglu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250201747
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Shiun Sheu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION
- Publication number 20250203773
- Publication date Jun 19, 2025
- Micron Technology, Inc.
- Kelvin Aik Boo TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192071
- Publication date Jun 12, 2025
- Samsung Electronics Co.,Ltd.
- Chengjing ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH MIM CAPACITOR AND FABRICATING METHOD OF THE SAME
- Publication number 20250194118
- Publication date Jun 12, 2025
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20250192095
- Publication date Jun 12, 2025
- TRON FUTURE TECH INC.
- KUAN-NENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STAGE INSPECTION METHOD AND SEMICONDUCTOR DEVICE MANUFACT...
- Publication number 20250191980
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Kwangkeun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE DIE IN SUBSTRATE CORE LAYER
- Publication number 20250183178
- Publication date Jun 5, 2025
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250183217
- Publication date Jun 5, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDIS...
- Publication number 20250183143
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKGRIND TAPE ETCHING FOR IMPROVED LASER DICING
- Publication number 20250183090
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jezreel Duane Aquino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER-ELECTRONICS PACKAGING, INTERFACE AND CONFIGURATION
- Publication number 20250183111
- Publication date Jun 5, 2025
- Joby Aero, Inc.
- Robert Ramm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250183212
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- CHEOL KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250183224
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- JIN-WOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250183239
- Publication date Jun 5, 2025
- Siliconware Precision Industries Co., Ltd.
- Yi-Min Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER MODULE FOR IMPLEMENTING DENSELY PITCHED INTEGRATED CIRCU...
- Publication number 20250183571
- Publication date Jun 5, 2025
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Andrew M. Kraemer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ENHANCED ELECTRONIC DEVICE PACKAGE
- Publication number 20250183129
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Ashok Prabhu
- H01 - BASIC ELECTRIC ELEMENTS

using a bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bump to package substrate solder joint

Package structure

Resin shaping device

Stacked die RF circuits and package method thereof

Chip package structure, preparation method, and electronic device

Semiconductor structure having copper pillar within solder bump and...

Chip packaging structure and related inner lead bonding method

Architecture for computing system package

Package with underfill containment barrier

High density substrate routing in package

Semiconductor device and manufacturing method thereof

Semiconductor package

Semiconductor device and method of forming microelectromechanical s...

Die attached leveling control by metal stopper bumps

Circuit packages and fabrication methods using bond-on-pad (BoP) su...

Semiconductor device package

Package structure and manufacturing method thereof

System and method for superconducting multi-chip module

Wiring board, semiconductor device, and method of manufacturing wir...

Display device and method for manufacturing the same

Method of manufacturing electronic device with reduced substrate wa...

Devices with conductive or magnetic nanowires for localized heating...

Electronic device, package structure and electronic manufacturing m...

Semiconductor package and method of fabricating the same

Conductive adhesive composition, and method for producing connectio...

Leadless semiconductor package with internal gull wing lead structures

Semiconductor package and method of forming thereof

Conductive pillar, method for manufacturing the same, and method fo...

Integrated circuit package and method of forming same

Method for forming chip packages and a chip package

Patents Applicationslast 30 patents

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR MODULE AND METHOD OF PRODUCING SEMICONDUCTOR MODULE

PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION

METHOD OF SOLDERING ELECTRONIC DEVICES AND METHOD OF MANUFACTURING...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

METHOD OF BONDING LIGHT EMITTING ELEMENT AND METHOD OF MANUFACTURIN...

INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Reflowable Vapor Chamber Lid

SELF-ALIGNING SEMICONDUCTOR CONSTRUCTION

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO REDUCE...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION

SEMICONDUCTOR PACKAGE

INTERPOSER WITH MIM CAPACITOR AND FABRICATING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE

SUBSTRATE STAGE INSPECTION METHOD AND SEMICONDUCTOR DEVICE MANUFACT...

BRIDGE DIE IN SUBSTRATE CORE LAYER

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

METHOD OF FORMING PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDIS...

BACKGRIND TAPE ETCHING FOR IMPROVED LASER DICING

POWER-ELECTRONICS PACKAGING, INTERFACE AND CONFIGURATION

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

INTERPOSER MODULE FOR IMPLEMENTING DENSELY PITCHED INTEGRATED CIRCU...

THERMAL ENHANCED ELECTRONIC DEVICE PACKAGE