using a laser or a focused ion beam [FIB]

Industry

CPC
H01L2224/2763

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/2763using a laser or a focused ion beam [FIB]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 12,014,999
- Issue date Jun 18, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Creating 3D features through selective laser annealing and/or laser...
- Patent number 11,430,758
- Issue date Aug 30, 2022
- Texas Instruments Incorporated
- Simon Joshua Jacobs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 10,818,622
- Issue date Oct 27, 2020
- VueReal Inc.
- Gholamreza Chaji
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Bonding method for connecting two wafers
- Patent number 10,134,707
- Issue date Nov 20, 2018
- Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung E.V.
- Kai Zoschke
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device mounting method
- Patent number 9,793,221
- Issue date Oct 17, 2017
- Fujitsu Limited
- Hidehiko Kira
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20240297133
- Publication date Sep 5, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...
- Publication number 20240105670
- Publication date Mar 28, 2024
- CYNTEC CO., LTD.
- Chi-Hung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20230253350
- Publication date Aug 10, 2023
- VueReal Inc.
- GHOLAMREZA CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDUCED STRESS DIE PICK AND PLACE
- Publication number 20220181208
- Publication date Jun 9, 2022
- Western Digital Technologies, Inc.
- Xin Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20210020593
- Publication date Jan 21, 2021
- VueReal Inc.
- GHOLAMREZA CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CREATING 3D FEATURES THROUGH SELECTIVE LASER ANNEALING AND/OR LASER...
- Publication number 20200211995
- Publication date Jul 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Simon Joshua JACOBS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING METHOD FOR CONNECTING TWO WAFERS
- Publication number 20170236799
- Publication date Aug 17, 2017
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Kai Zoschke
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER LEVEL PACKAGING USING A CATALYTIC ADHESIVE
- Publication number 20160148893
- Publication date May 26, 2016
- SIERRA CIRCUITS, INC.
- Kenneth S. Bahl
- H01 - BASIC ELECTRIC ELEMENTS

using a laser or a focused ion beam [FIB]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integration and bonding of micro-devices into system substrate

Creating 3D features through selective laser annealing and/or laser...

Integration and bonding of micro-devices into system substrate

Bonding method for connecting two wafers

Semiconductor device mounting method

Patents Applicationslast 30 patents

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

SEMICONDUCTOR DEVICE WITH REDUCED STRESS DIE PICK AND PLACE

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

CREATING 3D FEATURES THROUGH SELECTIVE LASER ANNEALING AND/OR LASER...

BONDING METHOD FOR CONNECTING TWO WAFERS

WAFER LEVEL PACKAGING USING A CATALYTIC ADHESIVE