using a laser or a focussed ion beam [FIB]

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H01L2224/11552

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11552using a laser or a focussed ion beam [FIB]

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Patents Grantslast 30 patents

Information Patent Grant
Conductive member cavities
- Patent number 11,699,639
- Issue date Jul 11, 2023
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 11,551,973
- Issue date Jan 10, 2023
- Kioxia Corporation
- Takanobu Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chip-on-chip structure comprising sinterted...
- Patent number 10,734,346
- Issue date Aug 4, 2020
- ELPIS TECHNOLOGIES INC.
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip hybridization of microelectronic components by local heat...
- Patent number 9,111,924
- Issue date Aug 18, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Abdelkader Aliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro bump and method for forming the same
- Patent number 8,802,557
- Issue date Aug 12, 2014
- Industrial Technology Research Institute
- Ruoh-Huey Uang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Conductive bump, method for producing the same, and electronic comp...
- Patent number 8,575,751
- Issue date Nov 5, 2013
- Panasonic Corporation
- Daisuke Sakurai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Micro bump and method for forming the same
- Patent number 8,426,964
- Issue date Apr 23, 2013
- Industrial Technology Research Institute
- Ruoh-Huey Uang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Conductive bump, method for manufacturing the conductive bump, semi...
- Patent number 7,928,566
- Issue date Apr 19, 2011
- Panasonic Corporation
- Yoshihiko Yagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming multi-layer bumps on a substrate
- Patent number 7,422,973
- Issue date Sep 9, 2008
- Freescale Semiconductor, Inc.
- Hei Ming Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of providing solder bumps on a substrate using localized hea...
- Patent number 7,407,878
- Issue date Aug 5, 2008
- Intel Corporation
- Yonggang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming multi-layer bumps on a substrate
- Patent number 7,279,409
- Issue date Oct 9, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Hei Ming Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting method of semiconductor device
- Patent number 6,074,894
- Issue date Jun 13, 2000
- Matsushita Electric Industrial Co., Ltd.
- Kenichiro Suetsugu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tab tape and semiconductor chip mounted on tab tape
- Patent number 5,767,569
- Issue date Jun 16, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Yukio Ohta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE MEMBER CAVITIES
- Publication number 20230307327
- Publication date Sep 28, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MEMBER CAVITIES
- Publication number 20220319961
- Publication date Oct 6, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20220059407
- Publication date Feb 24, 2022
- KIOXIA Corporation
- Takanobu ONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS BY LOCAL HEAT...
- Publication number 20140210076
- Publication date Jul 31, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Abdelkader ALIANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro Bump And Method For Forming The Same
- Publication number 20130217224
- Publication date Aug 22, 2013
- Industrial Technology Research Institute
- Ruoh-Huey Uang
- B82 - NANO-TECHNOLOGY
Information Patent Application
Micro Bump And Method For Forming The Same
- Publication number 20120273936
- Publication date Nov 1, 2012
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Ruoh-Huey Uang
- B82 - NANO-TECHNOLOGY
Information Patent Application
CONDUCTIVE BUMP, METHOD FOR MANUFACTURING THE CONDUCTIVE BUMP, SEMI...
- Publication number 20100029044
- Publication date Feb 4, 2010
- Yoshihiko Yagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BUMP, METHOD FOR PRODUCING THE SAME, AND ELECTRONIC COMP...
- Publication number 20090315178
- Publication date Dec 24, 2009
- Daisuke Sakurai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CONDUCTIVE BUMP, METHOD FOR FORMING THE SAME, AND ELECTRONIC COMPON...
- Publication number 20090301771
- Publication date Dec 10, 2009
- Shozo Ochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of providing solder bumps on a substrate using localized hea...
- Publication number 20080085595
- Publication date Apr 10, 2008
- Yonggang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming multi-layer bumps on a substrate
- Publication number 20070178688
- Publication date Aug 2, 2007
- Hei Ming Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming multi-layer bumps on a substrate
- Publication number 20070099413
- Publication date May 3, 2007
- Hei Ming Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming solder contacts on mounted substrates
- Publication number 20070090156
- Publication date Apr 26, 2007
- Lakshmi N. Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a solder bump, and process for fabricating a sem...
- Publication number 20020064930
- Publication date May 30, 2002
- Natsuya Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS

using a laser or a focussed ion beam [FIB]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conductive member cavities

Semiconductor device manufacturing method and semiconductor device

Method of manufacturing chip-on-chip structure comprising sinterted...

Flip-chip hybridization of microelectronic components by local heat...

Micro bump and method for forming the same

Conductive bump, method for producing the same, and electronic comp...

Micro bump and method for forming the same

Conductive bump, method for manufacturing the conductive bump, semi...

Method for forming multi-layer bumps on a substrate

Method of providing solder bumps on a substrate using localized hea...

Method for forming multi-layer bumps on a substrate

Mounting method of semiconductor device

Tab tape and semiconductor chip mounted on tab tape

Patents Applicationslast 30 patents

CONDUCTIVE MEMBER CAVITIES

CONDUCTIVE MEMBER CAVITIES

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS BY LOCAL HEAT...

Micro Bump And Method For Forming The Same

Micro Bump And Method For Forming The Same

CONDUCTIVE BUMP, METHOD FOR MANUFACTURING THE CONDUCTIVE BUMP, SEMI...

CONDUCTIVE BUMP, METHOD FOR PRODUCING THE SAME, AND ELECTRONIC COMP...

CONDUCTIVE BUMP, METHOD FOR FORMING THE SAME, AND ELECTRONIC COMPON...

Method of providing solder bumps on a substrate using localized hea...

Method for forming multi-layer bumps on a substrate

Method for forming multi-layer bumps on a substrate

Method for forming solder contacts on mounted substrates

Method for forming a solder bump, and process for fabricating a sem...