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using a laser

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  • CPC
  • H01L2224/81939
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81939using a laser
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor structure and method
    • Patent number 11,646,293
    • Issue date May 9, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Chia-Shen Cheng
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Semiconductor Structure and Method
    • Publication number 20220028823
    • Publication date Jan 27, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chia-Shen Cheng
    • H01 - BASIC ELECTRIC ELEMENTS