using a laser

Industry

CPC
H01L2224/85939

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85939using a laser

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module and method for manufacturing the same
- Patent number 10,643,969
- Issue date May 5, 2020
- Mitsubishi Electric Corporation
- Yusaku Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heavy-wire bond arrangement and method for producing same
- Patent number 9,992,861
- Issue date Jun 5, 2018
- Technische Universitat Berlin
- Andreas Middendorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat isolation structures for high bandwidth interconnects
- Patent number 9,859,188
- Issue date Jan 2, 2018
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package with low electromagnetic interference interconnection
- Patent number 9,824,997
- Issue date Nov 21, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die packaging with fully or partially fused dielectric leads
- Patent number 9,812,420
- Issue date Nov 7, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for determining a bonding connection in a component arrangem...
- Patent number 9,793,179
- Issue date Oct 17, 2017
- Technische Universitat Berlin
- Andreas Middendorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate less die package having wires with dielectric and metal c...
- Patent number 9,711,479
- Issue date Jul 18, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a lead with selectively modified electrica...
- Patent number 9,673,137
- Issue date Jun 6, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 8,945,990
- Issue date Feb 3, 2015
- Infineon Technologies AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes and structures for IC fabrication
- Patent number 8,153,517
- Issue date Apr 10, 2012
- TEREPAC Corporation
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes and structures for IC fabrication
- Patent number 8,124,452
- Issue date Feb 28, 2012
- TEREPAC Corporation
- Jayna Sheats
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190043827
- Publication date Feb 7, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Yusaku ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20130277813
- Publication date Oct 24, 2013
- INFINEON TECHNOLOGIES AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAVY-WIRE BOND ARRANGEMENT AND METHOD FOR PRODUCING SAME
- Publication number 20130220673
- Publication date Aug 29, 2013
- Technische Universitaet Berlin
- Andreas Middendorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20100313413
- Publication date Dec 16, 2010
- TEREPAC
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20100314735
- Publication date Dec 16, 2010
- TEREPAC
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS

using a laser

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor module and method for manufacturing the same

Heavy-wire bond arrangement and method for producing same

Heat isolation structures for high bandwidth interconnects

Die package with low electromagnetic interference interconnection

Die packaging with fully or partially fused dielectric leads

Method for determining a bonding connection in a component arrangem...

Substrate less die package having wires with dielectric and metal c...

Electronic device having a lead with selectively modified electrica...

Chip package and method of forming the same

Processes and structures for IC fabrication

Processes and structures for IC fabrication

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME

CHIP PACKAGE AND METHOD OF FORMING THE SAME

HEAVY-WIRE BOND ARRANGEMENT AND METHOD FOR PRODUCING SAME

Processes and structures for IC fabrication

Processes and structures for IC fabrication