using a laser

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H01L2224/80224

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80224using a laser

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for transferring electronic device
- Patent number 11,973,054
- Issue date Apr 30, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and method for manufacturing the same
- Patent number 11,894,335
- Issue date Feb 6, 2024
- Japan Display Inc.
- Kazuyuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid interconnect for laser bonding using nanoporous metal tips
- Patent number 11,424,214
- Issue date Aug 23, 2022
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring a plurality of micro light emitting diodes t...
- Patent number 11,387,212
- Issue date Jul 12, 2022
- BOE Technology Group Co., Ltd.
- Guan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-induced selective heating for microLED placement and bonding
- Patent number 10,998,286
- Issue date May 4, 2021
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser assisted transfer welding process
- Patent number 10,181,483
- Issue date Jan 15, 2019
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of sealing and contacting substrates using laser light and e...
- Patent number 9,171,822
- Issue date Oct 27, 2015
- Corelase Oy
- Jarno Kangastupa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser assisted transfer welding process
- Patent number 9,161,448
- Issue date Oct 13, 2015
- Semprius, Inc.
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically bonded arrays of transfer printed active components
- Patent number 9,049,797
- Issue date Jun 2, 2015
- Semprius, Inc.
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for joining a silicon plate to a second plate
- Patent number 6,955,975
- Issue date Oct 18, 2005
- Robert Bosch GmbH
- Frank Reichenbach
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240298444
- Publication date Sep 5, 2024
- KIOXIA Corporation
- Mitsuhiko NODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240234354
- Publication date Jul 11, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC DEVICE
- Publication number 20240213209
- Publication date Jun 27, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR BONDING ELECTRONIC COMPONENT, METHOD FOR BONDING ELEC...
- Publication number 20240203934
- Publication date Jun 20, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Chingju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240170445
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Juno Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING DISPLAY PANEL
- Publication number 20240072027
- Publication date Feb 29, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jeong Won HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTERCONNECT FOR LASER BONDING USING NANOPOROUS METAL TIPS
- Publication number 20230352437
- Publication date Nov 2, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20230178511
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Young Chul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC DEVICE
- Publication number 20220359455
- Publication date Nov 10, 2022
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210398939
- Publication date Dec 23, 2021
- Japan Display Inc.
- Kazuyuki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSFERRING A PLURALITY OF MICRO LIGHT EMITTING DIODES T...
- Publication number 20210335752
- Publication date Oct 28, 2021
- BOE TECHNOLOGY GROUP CO., LTD.
- Guan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS
- Publication number 20130153277
- Publication date Jun 20, 2013
- Etienne Menard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEALING AND CONTACTING SUBSTRATES USING LASER LIGHT AND E...
- Publication number 20130070428
- Publication date Mar 21, 2013
- CORELASE OY
- Jarno Kangastupa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER ASSISTED TRANSFER WELDING PROCESS
- Publication number 20120115262
- Publication date May 10, 2012
- Semprius, Inc.
- Etienne Menard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for joining a silicon plate to a second plate
- Publication number 20040082145
- Publication date Apr 29, 2004
- Frank Reichenbach
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

using a laser

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for transferring electronic device

Display device and method for manufacturing the same

Hybrid interconnect for laser bonding using nanoporous metal tips

Method of transferring a plurality of micro light emitting diodes t...

Laser-induced selective heating for microLED placement and bonding

Laser assisted transfer welding process

Method of sealing and contacting substrates using laser light and e...

Laser assisted transfer welding process

Electrically bonded arrays of transfer printed active components

Method for joining a silicon plate to a second plate

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR TRANSFERRING ELECTRONIC DEVICE

APPARATUS FOR BONDING ELECTRONIC COMPONENT, METHOD FOR BONDING ELEC...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

METHOD OF FABRICATING DISPLAY PANEL

HYBRID INTERCONNECT FOR LASER BONDING USING NANOPOROUS METAL TIPS

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

METHOD FOR TRANSFERRING ELECTRONIC DEVICE

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF TRANSFERRING A PLURALITY OF MICRO LIGHT EMITTING DIODES T...

ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS

METHOD OF SEALING AND CONTACTING SUBSTRATES USING LASER LIGHT AND E...

LASER ASSISTED TRANSFER WELDING PROCESS

Method for joining a silicon plate to a second plate