Membership
Tour
Register
Log in
using a laser
Follow
Industry
CPC
H01L2224/86939
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/86939
using a laser
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Method of bonding wires to passivated chip microcircuit conductors
Patent number
4,341,942
Issue date
Jul 27, 1982
International Business Machines Corporation
Praveen Chaudhari
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR