using a laser

Industry

CPC
H01L2224/85039

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85039using a laser

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for processing an ultra-high density space interconnect lead...
- Patent number 11,211,357
- Issue date Dec 28, 2021
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yun Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module and method for manufacturing the same
- Patent number 10,643,969
- Issue date May 5, 2020
- Mitsubishi Electric Corporation
- Yusaku Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device by laser-induced forming and transfer of shaped m...
- Patent number 10,297,565
- Issue date May 21, 2019
- The United States of America, as represented by the Secretary of the Navy
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for IC fabrication
- Patent number 8,020,290
- Issue date Sep 20, 2011
- Jayna Sheats
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for laser assisted wirebonding
- Patent number 7,476,597
- Issue date Jan 13, 2009
- Texas Instruments Incorporated
- Willmar E. Subido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PROCESSING AN ULTRA-HIGH DENSITY SPACE INTERCONNECT LEAD...
- Publication number 20210210461
- Publication date Jul 8, 2021
- Guangdong University of Technology
- Yun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190043827
- Publication date Feb 7, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Yusaku ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices and Methods for Providing an Electrical Connection
- Publication number 20140151905
- Publication date Jun 5, 2014
- INFINEON TECHNOLOGIES AG
- Michael Sternad
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURES AND METHODS FOR COPPER BOND PADS
- Publication number 20140061910
- Publication date Mar 6, 2014
- CHU-CHUNG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20100313414
- Publication date Dec 16, 2010
- TEREPAC
- Jayna Sheats
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS FOR LASER ASSISTED WIREBONDING
- Publication number 20090029542
- Publication date Jan 29, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Willmar E. SUBIDO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods and Systems for Laser Assisted Wirebonding
- Publication number 20080009129
- Publication date Jan 10, 2008
- Willmar E. Subido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

using a laser

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for processing an ultra-high density space interconnect lead...

Semiconductor module and method for manufacturing the same

Electronic device by laser-induced forming and transfer of shaped m...

Processes for IC fabrication

Methods and systems for laser assisted wirebonding

Patents Applicationslast 30 patents

METHOD FOR PROCESSING AN ULTRA-HIGH DENSITY SPACE INTERCONNECT LEAD...

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME

Devices and Methods for Providing an Electrical Connection

SEMICONDUCTOR DEVICE STRUCTURES AND METHODS FOR COPPER BOND PADS

Processes and structures for IC fabrication

METHODS AND SYSTEMS FOR LASER ASSISTED WIREBONDING

Methods and Systems for Laser Assisted Wirebonding