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H01L2224/80039
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80039
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Patents Grants
last 30 patents
Information
Patent Grant
Manufacturing method of semiconductor device
Patent number
11,600,598
Issue date
Mar 7, 2023
SK hynix Inc.
Jin Ha Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semiconductor device
Patent number
10,978,428
Issue date
Apr 13, 2021
SK hynix Inc.
Jin Ha Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packages with solder ball revealed through layer
Patent number
10,134,699
Issue date
Nov 20, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Hsiang Hu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES
Publication number
20240178180
Publication date
May 30, 2024
TOKYO ELECTRON LIMITED
Sitaram ARKALGUD
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20230207529
Publication date
Jun 29, 2023
SK HYNIX INC.
Jin Ha KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20210193627
Publication date
Jun 24, 2021
SK HYNIX INC.
Jin Ha KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20200357771
Publication date
Nov 12, 2020
SK HYNIX INC.
Jin Ha KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packages with Solder Ball Revealed Through Layer
Publication number
20170125367
Publication date
May 4, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Hsiang Hu
H01 - BASIC ELECTRIC ELEMENTS