TREA

using a laser

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Industry

  • CPC
  • H01L2224/85016
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85016using a laser
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor device
    • Patent number 10,727,146
    • Issue date Jul 28, 2020
    • Toyota Jidosha Kabushiki Kaisha
    • Naoya Take
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Methods and systems for laser assisted wirebonding
    • Patent number 7,476,597
    • Issue date Jan 13, 2009
    • Texas Instruments Incorporated
    • Willmar E. Subido
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents