using a laser

Industry

CPC
H01L2224/85214

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85214using a laser

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,027,490
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,908,830
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding corners of light emitting diode chip to substrate using laser
- Patent number 11,255,529
- Issue date Feb 22, 2022
- Facebook Technologies, LLC
- Jeb Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curved pillar interconnects
- Patent number 11,239,400
- Issue date Feb 1, 2022
- Facebook Technologies, LLC
- Zheng Sung Chio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for establishing a wire connection as well as a c...
- Patent number 11,217,558
- Issue date Jan 4, 2022
- PAC Tech-Packaging Technologies GmbH
- Andrej Kolbasow
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser ablation for wire bonding on organic solderability preservati...
- Patent number 10,833,043
- Issue date Nov 10, 2020
- Vitesco Technologies USA, LLC.
- Jared Yagoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for connecting inter-layer conductors and components in 3D...
- Patent number 10,660,214
- Issue date May 19, 2020
- Board of Regents, The University of Texas System
- Ryan B. Wicker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode terminal, semiconductor device for electrical power, and...
- Patent number 9,899,345
- Issue date Feb 20, 2018
- MITSUBISHI ELECTRIC COOPERATION
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of manufacturing the same
- Patent number 9,698,086
- Issue date Jul 4, 2017
- Infineon Technologies AG
- Tyrone Jon Donato Soller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for connecting inter-layer conductors and components in 3D s...
- Patent number 9,414,501
- Issue date Aug 9, 2016
- Board of Regents, The University of Texas System
- Ryan B. Wicker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processes and structures for IC fabrication
- Patent number 9,224,641
- Issue date Dec 29, 2015
- Jayna Sheats
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device for preventing a progression of a crack in a s...
- Patent number 9,153,519
- Issue date Oct 6, 2015
- Fuji Electric Co., Ltd.
- Fumio Nagaune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 8,945,990
- Issue date Feb 3, 2015
- Infineon Technologies AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes and structures for IC fabrication
- Patent number 8,928,118
- Issue date Jan 6, 2015
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to fabricate integrated circuits by assembling components
- Patent number 8,889,482
- Issue date Nov 18, 2014
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for interconnecting bonding pads between components
- Patent number 8,759,713
- Issue date Jun 24, 2014
- Terepac Corporation
- Jayna Sheats
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Chip package and method of manufacturing the same
- Patent number 8,759,956
- Issue date Jun 24, 2014
- Infineon Technologies AG
- Tyrone Jon Donato Soller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes and structures for beveled slope integrated circuits for...
- Patent number 8,513,110
- Issue date Aug 20, 2013
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon connecting electrical components
- Patent number 8,436,251
- Issue date May 7, 2013
- Medtronic, Inc.
- Steven Boyd
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the miniaturizable contacting of insulated wires
- Patent number 8,418,911
- Issue date Apr 16, 2013
- Thorsten Meiss
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processes and structures for IC fabrication
- Patent number 8,387,238
- Issue date Mar 5, 2013
- Jayna Sheats
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and structure for top metal formation of liquid crystal on s...
- Patent number 8,339,553
- Issue date Dec 25, 2012
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb Huang
- G02 - OPTICS
Information Patent Grant
Semiconductor device with welded leads and method of manufacturing...
- Patent number 8,299,620
- Issue date Oct 30, 2012
- Renesas Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes and structures for IC fabrication
- Patent number 8,153,517
- Issue date Apr 10, 2012
- TEREPAC Corporation
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for IC fabrication
- Patent number 8,020,290
- Issue date Sep 20, 2011
- Jayna Sheats
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser bonding tool with improved bonding accuracy
- Patent number 7,872,208
- Issue date Jan 18, 2011
- Medtronic, Inc.
- David A. Ruben
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 7,667,307
- Issue date Feb 23, 2010
- Renesas Technology Corp.
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density integrated circuit apparatus, test probe and methods o...
- Patent number 7,538,565
- Issue date May 26, 2009
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Methods and systems for laser assisted wirebonding
- Patent number 7,476,597
- Issue date Jan 13, 2009
- Texas Instruments Incorporated
- Willmar E. Subido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 7,416,970
- Issue date Aug 26, 2008
- Renesas Technology Corp.
- Tomishi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION
- Publication number 20230369284
- Publication date Nov 16, 2023
- Pac Tech - Packaging Technologies GmbH
- RICARDO GEELHAAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT ASSEMBLY FOR AN ELECTRONIC COMPONENT, AND METHOD FOR PRODUC...
- Publication number 20220367329
- Publication date Nov 17, 2022
- Vitesco Technologies GMBH
- Detlev Bagung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220045031
- Publication date Feb 10, 2022
- INFINEON TECHNOLOGIES AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR ESTABLISHING A WIRE CONNECTION AS WELL AS A C...
- Publication number 20200161273
- Publication date May 21, 2020
- PAC TECH - PACKAGING TECHNOLOGIES GMBH
- ANDREJ KOLBASOW
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER ABLATION FOR WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATI...
- Publication number 20190198475
- Publication date Jun 27, 2019
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Jared Yagoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A CONTACT CONNECTION
- Publication number 20180047697
- Publication date Feb 15, 2018
- Pac Tech - Packaging Technologies GmbH
- Heinrich Lüdeke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CONNECTING INTER-LAYER CONDUCTORS AND COMPONENTS IN 3D...
- Publication number 20160324009
- Publication date Nov 3, 2016
- Board of Regents, The University of Texas System
- Ryan B. Wicker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE TERMINAL, SEMICONDUCTOR DEVICE FOR ELECTRICAL POWER, AND...
- Publication number 20160293563
- Publication date Oct 6, 2016
- MITSUBISHI ELECTRIC CORPORATION
- Junji FUJINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140291823
- Publication date Oct 2, 2014
- Tyrone Jon Donato Soller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Systems For Connecting Inter-Layer Conductors and Compo...
- Publication number 20140268607
- Publication date Sep 18, 2014
- Board of Regents, The University of Texas System
- Ryan B. Wicker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140042609
- Publication date Feb 13, 2014
- FUJI ELECTRIC CO., LTD.
- Fumio Nagaune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140008776
- Publication date Jan 9, 2014
- INFINEON TECHNOLOGIES AG
- Tyrone Jon Donato Soller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20130277813
- Publication date Oct 24, 2013
- INFINEON TECHNOLOGIES AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20130207252
- Publication date Aug 15, 2013
- RENESAS ELECTRONICS CORPORATION
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20130193561
- Publication date Aug 1, 2013
- TEREPAC CORPORATION
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR TOP METAL FORMATION OF LIQUID CRYSTAL ON S...
- Publication number 20120092604
- Publication date Apr 19, 2012
- Semiconductor Manufacturing International (Shanghai) Corporation
- HERB HUANG
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120034742
- Publication date Feb 9, 2012
- Renesas Electronics Corporation
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THE MINIATURIZABLE CONTACTING OF INSULATED WIRES
- Publication number 20110303341
- Publication date Dec 15, 2011
- Thorsten Meiss
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIBBON CONNECTING ELECTRICAL COMPONENTS
- Publication number 20110005813
- Publication date Jan 13, 2011
- Steven Boyd
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20100314734
- Publication date Dec 16, 2010
- TEREPAC
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20100314718
- Publication date Dec 16, 2010
- TEREPAC
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20100314719
- Publication date Dec 16, 2010
- TEREPAC
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20100314735
- Publication date Dec 16, 2010
- TEREPAC
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20100314751
- Publication date Dec 16, 2010
- TEREPAC
- Jayna Sheats
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20100313414
- Publication date Dec 16, 2010
- TEREPAC
- Jayna Sheats
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Joint Structure Between a Wound Coil and An IC-Chip for a Noncontac...
- Publication number 20100230161
- Publication date Sep 16, 2010
- Katsuji Hoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100105174
- Publication date Apr 29, 2010
- RENESAS TECHNOLOGY CORP.
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT AND METHOD FOR MANUFACTURING SAME
- Publication number 20090294158
- Publication date Dec 3, 2009
- Naoki Matsushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20090128176
- Publication date May 21, 2009
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND SYSTEMS FOR LASER ASSISTED WIREBONDING
- Publication number 20090029542
- Publication date Jan 29, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Willmar E. SUBIDO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

using a laser

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Bonding corners of light emitting diode chip to substrate using laser

Curved pillar interconnects

Method and device for establishing a wire connection as well as a c...

Laser ablation for wire bonding on organic solderability preservati...

Methods for connecting inter-layer conductors and components in 3D...

Electrode terminal, semiconductor device for electrical power, and...

Chip package and method of manufacturing the same

Method for connecting inter-layer conductors and components in 3D s...

Processes and structures for IC fabrication

Semiconductor device for preventing a progression of a crack in a s...

Chip package and method of forming the same

Processes and structures for IC fabrication

Methods to fabricate integrated circuits by assembling components

Methods for interconnecting bonding pads between components

Chip package and method of manufacturing the same

Processes and structures for beveled slope integrated circuits for...

Ribbon connecting electrical components

Method for the miniaturizable contacting of insulated wires

Processes and structures for IC fabrication

Method and structure for top metal formation of liquid crystal on s...

Semiconductor device with welded leads and method of manufacturing...

Processes and structures for IC fabrication

Processes for IC fabrication

Laser bonding tool with improved bonding accuracy

Semiconductor device

High density integrated circuit apparatus, test probe and methods o...

Methods and systems for laser assisted wirebonding

Method for manufacturing semiconductor device

Patents Applicationslast 30 patents

CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION

CONTACT ASSEMBLY FOR AN ELECTRONIC COMPONENT, AND METHOD FOR PRODUC...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD AND DEVICE FOR ESTABLISHING A WIRE CONNECTION AS WELL AS A C...

LASER ABLATION FOR WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATI...

CHIP ARRANGEMENT AND METHOD FOR FORMING A CONTACT CONNECTION

METHODS FOR CONNECTING INTER-LAYER CONDUCTORS AND COMPONENTS IN 3D...

ELECTRODE TERMINAL, SEMICONDUCTOR DEVICE FOR ELECTRICAL POWER, AND...

CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

Methods and Systems For Connecting Inter-Layer Conductors and Compo...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

CHIP PACKAGE AND METHOD OF FORMING THE SAME

Semiconductor Device

Processes and structures for IC fabrication

METHOD AND STRUCTURE FOR TOP METAL FORMATION OF LIQUID CRYSTAL ON S...

SEMICONDUCTOR DEVICE

METHOD FOR THE MINIATURIZABLE CONTACTING OF INSULATED WIRES

RIBBON CONNECTING ELECTRICAL COMPONENTS

Processes and structures for IC fabrication

Processes and structures for IC fabrication

Processes and structures for IC fabrication

Processes and structures for IC fabrication

Processes and structures for IC fabrication

Processes and structures for IC fabrication

Joint Structure Between a Wound Coil and An IC-Chip for a Noncontac...

SEMICONDUCTOR DEVICE

ELECTRONIC CIRCUIT AND METHOD FOR MANUFACTURING SAME

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

METHODS AND SYSTEMS FOR LASER ASSISTED WIREBONDING