using a pattern electroplated or electroformed on a metallic carrier

Industry

CPC
H05K3/205

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/205using a pattern electroplated or electroformed on a metallic carrier

Industries

Patents Grantslast 30 patents

Information Patent Grant
Ceramic substrate manufacturing method
- Patent number 12,108,540
- Issue date Oct 1, 2024
- AMOSENSE CO., LTD.
- Kyung Whan Woo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board, and wiring board
- Patent number 12,028,989
- Issue date Jul 2, 2024
- Toyota Jidosha Kabushiki Kaisha
- Kazuaki Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low cost panel AESA with thermal management
- Patent number 11,917,746
- Issue date Feb 27, 2024
- Raytheon Company
- Miroslav Micovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 11,582,872
- Issue date Feb 14, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Ke-Jian Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,558,959
- Issue date Jan 17, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jin Uk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module installation on printed circuit boards with embedded trace t...
- Patent number 11,502,010
- Issue date Nov 15, 2022
- Intel Corporation
- Quan Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wiring board, and wiring board
- Patent number 11,490,528
- Issue date Nov 1, 2022
- Toyota Jidosha Kabushiki Kaisha
- Kazuaki Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pattern plate for plating and method for manufacturing wiring board
- Patent number 11,479,860
- Issue date Oct 25, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takayoshi Nirengi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface-treated copper foil, copper foil having carrier, laminated...
- Patent number 11,401,612
- Issue date Aug 2, 2022
- JX Nippon Mining & Metals Corporation
- Terumasa Moriyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,134,572
- Issue date Sep 28, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treated copper foil, surface treated copper foil with resin...
- Patent number 10,925,171
- Issue date Feb 16, 2021
- JX Nippon Mining & Metals Corporation
- Yuki Ori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface treated copper foil, surface treated copper foil with resin...
- Patent number 10,925,170
- Issue date Feb 16, 2021
- JX Nippon Mining & Metals Corporation
- Yuki Ori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil with carrier, coreless support with wiring layer, and m...
- Patent number 10,888,003
- Issue date Jan 5, 2021
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed wiring board having embedded pads and method for manufactur...
- Patent number 10,874,018
- Issue date Dec 22, 2020
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board package and display device including the same
- Patent number 10,705,393
- Issue date Jul 7, 2020
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 10,674,604
- Issue date Jun 2, 2020
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board package and display device including the same
- Patent number 10,539,842
- Issue date Jan 21, 2020
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of electroplating photoresist defined features from copper e...
- Patent number 10,508,349
- Issue date Dec 17, 2019
- Rohm and Haas Electronic Materials LLC
- Ravi Pokhrel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper foil with carrier, coreless support with wiring layer, and m...
- Patent number 10,492,308
- Issue date Nov 26, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic component and a method for manufacturing an electronic c...
- Patent number 10,470,310
- Issue date Nov 5, 2019
- Rohm Co., Ltd.
- Isamu Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating integrated circuit packaging with etched base
- Patent number 10,424,492
- Issue date Sep 24, 2019
- TWISDEN LTD.
- Loke Chew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier-attached copper foil, laminate, method for producing printe...
- Patent number 10,356,898
- Issue date Jul 16, 2019
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Carrier-attached copper foil, laminate, laminate producing method,...
- Patent number 10,349,531
- Issue date Jul 9, 2019
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier-attached copper foil, laminate, method for manufacturing pr...
- Patent number 10,332,756
- Issue date Jun 25, 2019
- JX Nippon Mining & Metals Corporation
- Terumasa Moriyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Stretchable electronic assembly
- Patent number 10,327,330
- Issue date Jun 18, 2019
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier-attached copper foil, laminate, method for producing printe...
- Patent number 10,299,385
- Issue date May 21, 2019
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface-treated copper foil, copper foil with carrier, substrate, r...
- Patent number 10,257,938
- Issue date Apr 9, 2019
- JX Nippon Mining & Metals Corporation
- Michiya Kohiki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chip package and package substrate
- Patent number 10,236,242
- Issue date Mar 19, 2019
- Mediatek Inc.
- Wen-Sung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier-attached copper foil, laminate, printed-wiring board and me...
- Patent number 10,201,092
- Issue date Feb 5, 2019
- JX Nippon Mining & Metals Corporation
- Tomota Nagaura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING...
- Publication number 20230397342
- Publication date Dec 7, 2023
- Shinko Electric Industries Co., Ltd.
- Masayuki Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PANEL AESA WITH THERMAL MANAGEMENT
- Publication number 20230345616
- Publication date Oct 26, 2023
- Raytheon Company
- Miroslav Micovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20220304162
- Publication date Sep 22, 2022
- Toyota Jidosha Kabushiki Kaisha
- Kazuaki OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE MANUFACTURING METHOD
- Publication number 20220240389
- Publication date Jul 28, 2022
- AMOSENSE CO.,LTD
- Kyung Whan WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220217843
- Publication date Jul 7, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERN PLATE FOR PLATING AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20220056586
- Publication date Feb 24, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- TAKAYOSHI NIRENGI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCUIT PATTERN CONTINUOUS MANUFACTURING DEVICE
- Publication number 20220010445
- Publication date Jan 13, 2022
- Samwon Act Co., Ltd
- Kyung Yul LEE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING CIRCUIT BOARD AND PRODUCING METHOD THEREOF
- Publication number 20220007507
- Publication date Jan 6, 2022
- Nitto Denko Corporation
- Rihito FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board structure and method for manufacturing a circuit boar...
- Publication number 20210392752
- Publication date Dec 16, 2021
- ImberaTek LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20210084774
- Publication date Mar 18, 2021
- Toyota Jidosha Kabushiki Kaisha
- Kazuaki OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20200110300
- Publication date Apr 9, 2020
- SAMSUNG DISPLAY CO., LTD.
- Byoung Yong Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND M...
- Publication number 20200053885
- Publication date Feb 13, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190327830
- Publication date Oct 24, 2019
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20190289723
- Publication date Sep 19, 2019
- Avary Holding (Shenzhen) Co., Limited.
- KE-JIAN WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND M...
- Publication number 20190261518
- Publication date Aug 22, 2019
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
- Publication number 20190172782
- Publication date Jun 6, 2019
- STMicroelectronics S.r.l
- Federico Giovanni Ziglioli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METALIZATION OF FLEXIBLE POLYMER SHEETS
- Publication number 20180355495
- Publication date Dec 13, 2018
- Global Solar Energy, Inc.
- Scott WIEDEMAN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180317325
- Publication date Nov 1, 2018
- Avary Holding (Shenzhen) Co., Limited.
- KE-JIAN WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...
- Publication number 20180279482
- Publication date Sep 27, 2018
- JX NIPPON MINING & METALS CORPORATION
- Masafumi ISHII
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD OF WIRING BOARD
- Publication number 20180235089
- Publication date Aug 16, 2018
- OLYMPUS CORPORATION
- Kazuaki KOJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20180197754
- Publication date Jul 12, 2018
- Twisden Ltd.
- Loke Chew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180047662
- Publication date Feb 15, 2018
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20180004031
- Publication date Jan 4, 2018
- SAMSUNG DISPLAY CO., LTD.
- Byoung Yong KIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...
- Publication number 20170370014
- Publication date Dec 28, 2017
- Rohm and Haas Electronic Materials L.L.C.
- Ravi Pokhrel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170245365
- Publication date Aug 24, 2017
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...
- Publication number 20170037528
- Publication date Feb 9, 2017
- Rohm and Haas Electronic Materials L.L.C.
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Carrier-Attached Copper Foil, Laminate, Printed-Wiring Board And Me...
- Publication number 20160353581
- Publication date Dec 1, 2016
- JX NIPPON MINING & METALS CORPORATION
- Tomota Nagaura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...
- Publication number 20160183380
- Publication date Jun 23, 2016
- MASAFUMI ISHII
- B32 - LAYERED PRODUCTS
Information Patent Application
SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...
- Publication number 20160157356
- Publication date Jun 2, 2016
- JX NIPPON MINING & METALS CORPORATION
- MICHIYA KOHIKI
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE
- Publication number 20140240934
- Publication date Aug 28, 2014
- Invensas Corporation
- Tomoo Iijima
- H01 - BASIC ELECTRIC ELEMENTS

using a pattern electroplated or electroformed on a metallic carrier

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ceramic substrate manufacturing method

Method for manufacturing wiring board, and wiring board

Low cost panel AESA with thermal management

Circuit board structure and method for manufacturing a circuit boar...

Circuit board

Printed circuit board

Module installation on printed circuit boards with embedded trace t...

Method for manufacturing wiring board, and wiring board

Pattern plate for plating and method for manufacturing wiring board

Surface-treated copper foil, copper foil having carrier, laminated...

Circuit board structure and method for manufacturing a circuit boar...

Surface treated copper foil, surface treated copper foil with resin...

Surface treated copper foil, surface treated copper foil with resin...

Copper foil with carrier, coreless support with wiring layer, and m...

Printed wiring board having embedded pads and method for manufactur...

Printed circuit board package and display device including the same

Printed wiring board and method for manufacturing the same

Printed circuit board package and display device including the same

Method of electroplating photoresist defined features from copper e...

Copper foil with carrier, coreless support with wiring layer, and m...

Electronic component and a method for manufacturing an electronic c...

Method of fabricating integrated circuit packaging with etched base

Carrier-attached copper foil, laminate, method for producing printe...

Carrier-attached copper foil, laminate, laminate producing method,...

Carrier-attached copper foil, laminate, method for manufacturing pr...

Stretchable electronic assembly

Carrier-attached copper foil, laminate, method for producing printe...

Surface-treated copper foil, copper foil with carrier, substrate, r...

Chip package and package substrate

Carrier-attached copper foil, laminate, printed-wiring board and me...

Patents Applicationslast 30 patents

WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING...

LOW COST PANEL AESA WITH THERMAL MANAGEMENT

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

CERAMIC SUBSTRATE MANUFACTURING METHOD

PRINTED CIRCUIT BOARD

PATTERN PLATE FOR PLATING AND METHOD FOR MANUFACTURING WIRING BOARD

CIRCUIT PATTERN CONTINUOUS MANUFACTURING DEVICE

WIRING CIRCUIT BOARD AND PRODUCING METHOD THEREOF

Circuit board structure and method for manufacturing a circuit boar...

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

PRINTED CIRCUIT BOARD PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND M...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD

COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND M...

PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...

METALIZATION OF FLEXIBLE POLYMER SHEETS

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...

WIRING BOARD AND MANUFACTURING METHOD OF WIRING BOARD

INTEGRATED CIRCUIT PACKAGE

INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...

Carrier-Attached Copper Foil, Laminate, Printed-Wiring Board And Me...

SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...

SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...

MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE