using a polychromatic heating lamp

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H01L2224/83037

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83037using a polychromatic heating lamp

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Patents Grantslast 30 patents

Information Patent Grant
Methods for improved die bonding
- Patent number 10,756,048
- Issue date Aug 25, 2020
- Skyworks Solutions, Inc.
- José Manuel Flores
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for improved die bonding
- Patent number 10,199,351
- Issue date Feb 5, 2019
- Skyworks Solutions, Inc.
- José Manuel Flores
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR IMPROVED DIE BONDING
- Publication number 20200006283
- Publication date Jan 2, 2020
- SKYWORKS SOLUTIONS, INC.
- José Manuel FLORES
- H01 - BASIC ELECTRIC ELEMENTS