using a polymer adhesive

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H01L2224/8385

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8385using a polymer adhesive

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 12,136,565
- Issue date Nov 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biometric sensor module for a smart card and method for manufacturi...
- Patent number 12,131,987
- Issue date Oct 29, 2024
- Linxens Holding
- Christophe Mathieu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Energy augmentation structures, energy emitters or energy collector...
- Patent number 12,121,746
- Issue date Oct 22, 2024
- Immunolight, LLC
- Frederic A Bourke
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 12,119,238
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 12,119,321
- Issue date Oct 15, 2024
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Applying stress compensation for aligning a companion chip with a h...
- Patent number 12,111,497
- Issue date Oct 8, 2024
- Ciena Corporation
- Raphael Beaupré-Laflamme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dual sides of metal routing
- Patent number 12,113,025
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a structure
- Patent number 12,107,069
- Issue date Oct 1, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Nohora-Lizeth Caicedo Panqueva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device, manufacturing method thereof and display mod...
- Patent number 12,107,080
- Issue date Oct 1, 2024
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 12,094,725
- Issue date Sep 17, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting electronic components to substrates
- Patent number 12,094,811
- Issue date Sep 17, 2024
- Kulicke and Soffa Industries, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an antenna arranged over an active main...
- Patent number 12,094,842
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick-silver layer interface
- Patent number 12,094,801
- Issue date Sep 17, 2024
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling of height of high-density interconnection structure on...
- Patent number 12,087,596
- Issue date Sep 10, 2024
- International Business Machines Corporation
- Keishi Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic electrically conductive film
- Patent number 12,087,722
- Issue date Sep 10, 2024
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy augmentation structures in adhesive bonding compositions
- Patent number 12,076,579
- Issue date Sep 3, 2024
- Immunolight, LLC
- Frederic A Bourke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,082,350
- Issue date Sep 3, 2024
- Sumitomo Electric Device Innovations, Inc.
- Shingo Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,074,152
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Dae Hyuk Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 12,062,588
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method of the same
- Patent number 12,062,742
- Issue date Aug 13, 2024
- Unimicron Technology Corp.
- Hao-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,062,637
- Issue date Aug 13, 2024
- Innolux Corporation
- Pai-Chiao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip packaged semiconductor device
- Patent number 12,057,377
- Issue date Aug 6, 2024
- MagnaChip Semiconductor, Ltd.
- Hyun Dong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using hybrid-type adhesive
- Patent number 12,040,300
- Issue date Jul 16, 2024
- Airoha Technology Corp.
- Ying-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a through intervia through the molding...
- Patent number 12,033,976
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection body, method for manufacturing connection body, and conn...
- Patent number 12,034,260
- Issue date Jul 9, 2024
- Dexerials Corporation
- Ryota Aizaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and display device using the same
- Patent number 12,021,056
- Issue date Jun 25, 2024
- LG Display Co., Ltd.
- Chang Hyun Song
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THICK-SILVER LAYER INTERFACE
- Publication number 20240404914
- Publication date Dec 5, 2024
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20240404934
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
- Publication number 20240404902
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE UNDERFILLING USING PRE-APPLIED THERMOSET ADHESIVE
- Publication number 20240395567
- Publication date Nov 28, 2024
- Intel Corporation
- Jonas G. Croissant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240379429
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PLACED ON CORE OF SUBSTRATE
- Publication number 20240371775
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240363576
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-YU CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240363582
- Publication date Oct 31, 2024
- InnoLux Corporation
- Pai-Chiao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer and (micro) transfer printing process
- Publication number 20240355775
- Publication date Oct 24, 2024
- X-FAB SEMICONDUCTOR FOUNDRIES GmbH
- Ralf LERNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE
- Publication number 20240321904
- Publication date Sep 26, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jihyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240312976
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die and Method for Attaching a Semiconductor Die to a...
- Publication number 20240312944
- Publication date Sep 19, 2024
- TE Connectivity Solutions GMBH
- Kaspar Jenni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20240312945
- Publication date Sep 19, 2024
- LG Display Co., Ltd.
- Chang Hyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE ADHESIVE FILM AND FABRICATION METHOD THEREFOR, ELECTRONI...
- Publication number 20240304586
- Publication date Sep 12, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shaopeng LI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
OPTICAL SENSOR PACKAGE
- Publication number 20240304639
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...
- Publication number 20240274583
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATION APPARATUS AND METHOD
- Publication number 20240262096
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Ting Chiu
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE STRADDLING TOP...
- Publication number 20240258210
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Bob Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY AUGMENTATION STRUCTURES FOR USE WITH ENERGY EMITTERS AND COL...
- Publication number 20240216713
- Publication date Jul 4, 2024
- Immunolight, LLC
- Frederic A. BOURKE
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
ELIMINATING SUBSTRATE METAL CRACKS IN A BALL GRID ARRAY PACKAGE
- Publication number 20240203905
- Publication date Jun 20, 2024
- NXP USA, Inc.
- Swee Yean Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM WITH CARBON-BASED CONDUCTIVE REGIONS AN...
- Publication number 20240170435
- Publication date May 23, 2024
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240162184
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOT VIA DIE ATTACH JETTING
- Publication number 20240153909
- Publication date May 9, 2024
- MACOM Technology Solutions Holdings, Inc.
- Novak Farrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
- Publication number 20240128224
- Publication date Apr 18, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jung Hoon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
- Publication number 20240128254
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY AUGMENTATION STRUCTURES, ENERGY EMITTERS OR ENERGY COLLECTOR...
- Publication number 20240115878
- Publication date Apr 11, 2024
- Immunolight, LLC
- Frederic A. BOURKE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240113089
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR METHOD AND APPARATUS
- Publication number 20240096745
- Publication date Mar 21, 2024
- Mayank Mayukh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240087954
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EDGE FILLET AND 3D-PRINTED CNT AS BENDING STRESS BUFFER
- Publication number 20240071977
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Chen Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS

using a polymer adhesive

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package and manufacturing method thereof

Biometric sensor module for a smart card and method for manufacturi...

Energy augmentation structures, energy emitters or energy collector...

Semiconductor bonding structures and methods

Semiconductor device and a method of manufacturing thereof

Applying stress compensation for aligning a companion chip with a h...

Semiconductor package with dual sides of metal routing

Method for manufacturing a structure

Light-emitting device, manufacturing method thereof and display mod...

Connection structure and manufacturing method therefor

Leadframe package with pre-applied filler material

Connecting electronic components to substrates

Semiconductor device having an antenna arranged over an active main...

Thick-silver layer interface

Controlling of height of high-density interconnection structure on...

Anisotropic electrically conductive film

Package with different types of semiconductor dies attached to a fl...

Through-hole electrode substrate

Energy augmentation structures in adhesive bonding compositions

Semiconductor device

Display device

Methods and devices for fabricating and assembling printable semico...

Semiconductor package having routable encapsulated conductive subst...

Package structure and manufacturing method of the same

Electronic device

Multichip packaged semiconductor device

Semiconductor package using hybrid-type adhesive

Semiconductor package having a through intervia through the molding...

Connection body, method for manufacturing connection body, and conn...

Electronic device and display device using the same

Patents Applicationslast 30 patents

THICK-SILVER LAYER INTERFACE

THROUGH-HOLE ELECTRODE SUBSTRATE

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

SELECTIVE UNDERFILLING USING PRE-APPLIED THERMOSET ADHESIVE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

ELECTRONIC COMPONENT PLACED ON CORE OF SUBSTRATE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

ELECTRONIC DEVICE

Semiconductor wafer and (micro) transfer printing process

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Semiconductor Die and Method for Attaching a Semiconductor Die to a...

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

CONDUCTIVE ADHESIVE FILM AND FABRICATION METHOD THEREFOR, ELECTRONI...

OPTICAL SENSOR PACKAGE

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...

LAMINATION APPARATUS AND METHOD

SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE STRADDLING TOP...

ENERGY AUGMENTATION STRUCTURES FOR USE WITH ENERGY EMITTERS AND COL...

ELIMINATING SUBSTRATE METAL CRACKS IN A BALL GRID ARRAY PACKAGE

ANISOTROPIC CONDUCTIVE FILM WITH CARBON-BASED CONDUCTIVE REGIONS AN...

SEMICONDUCTOR PACKAGE

HOT VIA DIE ATTACH JETTING

ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...

ENERGY AUGMENTATION STRUCTURES, ENERGY EMITTERS OR ENERGY COLLECTOR...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

STACKED SEMICONDUCTOR METHOD AND APPARATUS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

DIE EDGE FILLET AND 3D-PRINTED CNT AS BENDING STRESS BUFFER