using a polymer adhesive

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CPC
H01L2224/8285

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8285using a polymer adhesive

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 11,309,277
- Issue date Apr 19, 2022
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 11,122,683
- Issue date Sep 14, 2021
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 10,734,351
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,511,080
- Issue date Dec 17, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Won Wook So
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 10,165,677
- Issue date Dec 25, 2018
- Palo Alto Research Center Incorporated
- Ping Mei
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 10,056,348
- Issue date Aug 21, 2018
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package including wire bond and electrically con...
- Patent number 8,907,482
- Issue date Dec 9, 2014
- Honeywell International Inc.
- David Scheid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Making electronic storage system having code circuit
- Patent number 8,739,399
- Issue date Jun 3, 2014
- Eastman Kodak Company
- Ronald Steven Cok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...
- Publication number 20190124757
- Publication date Apr 25, 2019
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190058241
- Publication date Feb 21, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Won Wook SO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLING ON ADHESION LAYER OR DIELECTRIC LAYER, EXTENDING BE...
- Publication number 20180358326
- Publication date Dec 13, 2018
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip assembling on adhesion layer or dielectric layer, extending be...
- Publication number 20170294403
- Publication date Oct 12, 2017
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE INCLUDING WIRE BOND AND ELECTRICALLY CON...
- Publication number 20140124962
- Publication date May 8, 2014
- Honeywell International Inc.
- David Scheid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAKING ELECTRONIC STORAGE SYSTEM HAVING CODE CIRCUIT
- Publication number 20130283599
- Publication date Oct 31, 2013
- Ronald Steven Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130111744
- Publication date May 9, 2013
- Michael A. Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130112989
- Publication date May 9, 2013
- COOLEDGE LIGHTING, INC.
- Michael Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130056749
- Publication date Mar 7, 2013
- Michael Tischler
- H01 - BASIC ELECTRIC ELEMENTS

using a polymer adhesive

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip assembling on adhesion layer or dielectric layer, extending be...

Bare die integration with printed components on flexible substrate...

Chip assembling on adhesion layer or dielectric layer, extending be...

Fan-out semiconductor package

Bare die integration with printed components on flexible substrate...

Chip assembling on adhesion layer or dielectric layer, extending be...

Integrated circuit package including wire bond and electrically con...

Making electronic storage system having code circuit

Patents Applicationslast 30 patents

BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...

FAN-OUT SEMICONDUCTOR PACKAGE

CHIP ASSEMBLING ON ADHESION LAYER OR DIELECTRIC LAYER, EXTENDING BE...

Chip assembling on adhesion layer or dielectric layer, extending be...

INTEGRATED CIRCUIT PACKAGE INCLUDING WIRE BOND AND ELECTRICALLY CON...

MAKING ELECTRONIC STORAGE SYSTEM HAVING CODE CIRCUIT

BROAD-AREA LIGHTING SYSTEMS

BROAD-AREA LIGHTING SYSTEMS

BROAD-AREA LIGHTING SYSTEMS