using a polymer adhesive

Industry

CPC
H01L2224/8185

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8185using a polymer adhesive

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of manufacture
- Patent number 12,002,726
- Issue date Jun 4, 2024
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die with metal pillars
- Patent number 11,824,028
- Issue date Nov 21, 2023
- STMicroelectronics (Tours) SAS
- Olivier Ory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
- Patent number 11,810,882
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 11,658,154
- Issue date May 23, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding interposer and integrated circuit chip, and ultrasound prob...
- Patent number 11,631,798
- Issue date Apr 18, 2023
- Samsung Electronics Co., Ltd.
- Kyung-moo Choi
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Semiconductor package and method of manufacture
- Patent number 11,610,828
- Issue date Mar 21, 2023
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,469,165
- Issue date Oct 11, 2022
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with stud bumps
- Patent number 11,444,015
- Issue date Sep 13, 2022
- TDK Corporation
- Wolfgang Pahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,393,734
- Issue date Jul 19, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic module with sealing resin
- Patent number 11,387,400
- Issue date Jul 12, 2022
- Murata Manufacturing Co., Ltd.
- Junpei Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 11,239,191
- Issue date Feb 1, 2022
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,205,602
- Issue date Dec 21, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Khim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method of manufacturing the same
- Patent number 11,177,249
- Issue date Nov 16, 2021
- SK hynix Inc.
- Kun Young Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package with stacked semiconduc...
- Patent number 11,101,235
- Issue date Aug 24, 2021
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module
- Patent number 11,049,821
- Issue date Jun 29, 2021
- Murata Manufacturing Co., Ltd.
- Takayoshi Obata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device with stud bumps
- Patent number 10,903,156
- Issue date Jan 26, 2021
- TDK Corporation
- Wolfgang Pahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a flip chip semiconductor package and a c...
- Patent number 10,872,845
- Issue date Dec 22, 2020
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,854,576
- Issue date Dec 1, 2020
- TOSHIBA MEMORY CORPORATION
- Yuji Karakane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element and electronic device comprising the same
- Patent number 10,825,787
- Issue date Nov 3, 2020
- Innolux Corporation
- Wei-Cheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,741,517
- Issue date Aug 11, 2020
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin substrate, component-mounting resin substrate, and method of...
- Patent number 10,741,462
- Issue date Aug 11, 2020
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 10,741,482
- Issue date Aug 11, 2020
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 10,727,206
- Issue date Jul 28, 2020
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,707,111
- Issue date Jul 7, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit module and manufacturing method thereof
- Patent number 10,679,916
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,634,941
- Issue date Apr 28, 2020
- Japan Display Inc.
- Yosuke Hyodo
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20240321666
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20240071973
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE WITH METAL PILLARS
- Publication number 20240063162
- Publication date Feb 22, 2024
- STMicroelectronics (Tours) SAS
- Olivier ORY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20230282605
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20230197549
- Publication date Jun 22, 2023
- Samsung Electronics Co., Ltd.
- JINWOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20220093481
- Publication date Mar 24, 2022
- Samsung Electronics Co., Ltd.
- JINWOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE WITH METAL PILLARS
- Publication number 20220068866
- Publication date Mar 3, 2022
- STMicroelectronics (Tours) SAS
- Olivier ORY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Stud Bumps
- Publication number 20210104456
- Publication date Apr 8, 2021
- TDK Corporation
- Wolfgang Pahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200243499
- Publication date Jul 30, 2020
- SK HYNIX INC.
- Kun Young LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVING MECHANICAL AND THERMAL RELIABILITY IN VARYING FORM FACTORS
- Publication number 20190312001
- Publication date Oct 10, 2019
- Intel Corporation
- Veronica A. Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device
- Publication number 20190267318
- Publication date Aug 29, 2019
- TDK Electronics AG
- Wolfgang Pahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20190027676
- Publication date Jan 24, 2019
- Murata Manufacturing Co., Ltd.
- Junpei YASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20180366388
- Publication date Dec 20, 2018
- International Business Machines Corporation
- Akihiro HORIBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSING UNIT
- Publication number 20180336393
- Publication date Nov 22, 2018
- J-METRICS TECHNOLOGY Co., Ltd.
- Wei-Ting Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITH STACKED SEMICONDUC...
- Publication number 20180261563
- Publication date Sep 13, 2018
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE
- Publication number 20180108606
- Publication date Apr 19, 2018
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20180025991
- Publication date Jan 25, 2018
- Renesas Electronics Corporation
- Masami KOKETSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE CONTAINING CURED PRODUCT...
- Publication number 20170362472
- Publication date Dec 21, 2017
- TORAY INDUSTRIES, INC.
- Kazuyuki Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR CHIPS HAVING THROUGH SILICON VIAS AND RELATED FABRICA...
- Publication number 20170345713
- Publication date Nov 30, 2017
- Samsung Electronics Co., Ltd.
- Jin-ho Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20170338197
- Publication date Nov 23, 2017
- RENESAS ELECTRONICS CORPORATION
- Shinya SUZUKI
- G02 - OPTICS
Information Patent Application
METHOD OF BONDING A FIRST SUBSTRATE AND A SECOND SUBSTRATE
- Publication number 20170309584
- Publication date Oct 26, 2017
- Agency for Science, Technology and Research
- Ling Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip assembly and method for making same
- Publication number 20170309593
- Publication date Oct 26, 2017
- Tessera, Inc.
- Teck-Gyu KANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fan-Out Wafer-Level Packaging Using Metal Foil Lamination
- Publication number 20170170031
- Publication date Jun 15, 2017
- Invensas Corporation
- Xuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER-LEVEL PACKAGING USING METAL FOIL LAMINATION
- Publication number 20170103957
- Publication date Apr 13, 2017
- Invensas Corporation
- Xuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection Structure, LED Module and Method
- Publication number 20170092631
- Publication date Mar 30, 2017
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20160086911
- Publication date Mar 24, 2016
- RENESAS ELECTRONICS CORPORATION
- Shinya SUZUKI
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20160079202
- Publication date Mar 17, 2016
- RENESAS ELECTRONICS CORPORATION
- Shinya SUZUKI
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH ORGANIC INTERPOSER
- Publication number 20160064356
- Publication date Mar 3, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING SHEET, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SUBST...
- Publication number 20160056123
- Publication date Feb 25, 2016
- Nitto Denko Corporation
- Kosuke Morita
- B32 - LAYERED PRODUCTS

using a polymer adhesive

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method of manufacture

Fingerprint sensor and manufacturing method thereof

Die with metal pillars

Solder based hybrid bonding for fine pitch and thin BLT interconnec...

Memory devices with controllers under memory packages and associate...

Bonding interposer and integrated circuit chip, and ultrasound prob...

Semiconductor package and method of manufacture

Semiconductor device package

Electronic device with stud bumps

Fingerprint sensor and manufacturing method thereof

Electronic module with sealing resin

Semiconductor device and a method of manufacturing the same

Semiconductor device and manufacturing method thereof

Semiconductor memory device and method of manufacturing the same

Fabrication method of semiconductor package with stacked semiconduc...

Circuit module

Electronic device with stud bumps

Process for manufacturing a flip chip semiconductor package and a c...

Semiconductor device and manufacturing method thereof

Electronic element and electronic device comprising the same

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Semiconductor device and a method of manufacturing the same

Resin substrate, component-mounting resin substrate, and method of...

Semiconductor device package

Memory devices with controllers under memory packages and associate...

Wafer level flat no-lead semiconductor packages and methods of manu...

Engineered polymer-based electronic materials

Circuit module and manufacturing method thereof

Display device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

DIE WITH METAL PILLARS

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE

DIE WITH METAL PILLARS

Electronic Device with Stud Bumps

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

IMPROVING MECHANICAL AND THERMAL RELIABILITY IN VARYING FORM FACTORS

Electronic Device

ELECTRONIC MODULE

CIRCUIT MODULE AND MANUFACTURING METHOD THEREOF

FINGERPRINT SENSING UNIT

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITH STACKED SEMICONDUC...

FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE CONTAINING CURED PRODUCT...

SEMICONDUCTOR CHIPS HAVING THROUGH SILICON VIAS AND RELATED FABRICA...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

METHOD OF BONDING A FIRST SUBSTRATE AND A SECOND SUBSTRATE

Semiconductor chip assembly and method for making same

Fan-Out Wafer-Level Packaging Using Metal Foil Lamination

FAN-OUT WAFER-LEVEL PACKAGING USING METAL FOIL LAMINATION

Interconnection Structure, LED Module and Method

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE WITH ORGANIC INTERPOSER

SEALING SHEET, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SUBST...