using a powder

Industry

CPC
H01L2224/03442

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/03442using a powder

Industries

Patents Grantslast 30 patents

Information Patent Grant
Additive manufacturing of a frontside or backside interconnect of a...
- Patent number 11,688,713
- Issue date Jun 27, 2023
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic interference shield created on package using high t...
- Patent number 11,380,624
- Issue date Jul 5, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 11,152,318
- Issue date Oct 19, 2021
- Mitsubishi Electric Corporation
- Tatsunori Yanagimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive compositions and methods of using them
- Patent number 10,059,827
- Issue date Aug 28, 2018
- Rajan Hariharan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of manufacturing a semiconductor component
- Patent number 8,802,564
- Issue date Aug 12, 2014
- Danfoss Silicon Power GmbH
- Mathias Kock
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Mono-acid hybrid conductive composition and method
- Patent number 8,564,140
- Issue date Oct 22, 2013
- Alpha Metals, Inc.
- Rajan Hariharan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and multichip arrangement having a polymer la...
- Patent number 8,258,633
- Issue date Sep 4, 2012
- Infineon Technologies AG
- Recai Sezi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONICS UNIT AND METHOD FOR THE PRODUCTION THEREOF
- Publication number 20230377880
- Publication date Nov 23, 2023
- SPHERA TECHNOLOGY GMBH
- Janine-Melanie POTRECK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELD CREATED ON PACKAGE USING HIGH T...
- Publication number 20200312782
- Publication date Oct 1, 2020
- Intel Corporation
- Feras EID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20200258854
- Publication date Aug 13, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Tatsunori YANAGIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Compositions and Methods of Using Them
- Publication number 20160251495
- Publication date Sep 1, 2016
- ALPHA METALS, INC.
- Rajan Hariharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150048510
- Publication date Feb 19, 2015
- Denso Corporation
- Manabu Tomisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM
- Publication number 20140153167
- Publication date Jun 5, 2014
- ALPHA METALS, INC.
- Rajan Hariharan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGING CONNECTOR AND METHODS FOR ITS PRODUCTION
- Publication number 20130087371
- Publication date Apr 11, 2013
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Metal Layer on a Substrate and Device
- Publication number 20120292773
- Publication date Nov 22, 2012
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT
- Publication number 20120282772
- Publication date Nov 8, 2012
- Danfoss Silicon Power GmbH
- Mathias Kock
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING AN OVER PAD METALIZATION (OPM) ON A BOND PAD
- Publication number 20120178189
- Publication date Jul 12, 2012
- Douglas M. Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Manufacturing Method
- Publication number 20110241222
- Publication date Oct 6, 2011
- Recai Sezi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM
- Publication number 20100084757
- Publication date Apr 8, 2010
- Rajan Hariharan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

using a powder

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Additive manufacturing of a frontside or backside interconnect of a...

Electromagnetic interference shield created on package using high t...

Semiconductor device and manufacturing method of semiconductor device

Conductive compositions and methods of using them

Method of manufacturing a semiconductor component

Mono-acid hybrid conductive composition and method

Semiconductor package and multichip arrangement having a polymer la...

Patents Applicationslast 30 patents

ELECTRONICS UNIT AND METHOD FOR THE PRODUCTION THEREOF

ELECTROMAGNETIC INTERFERENCE SHIELD CREATED ON PACKAGE USING HIGH T...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Conductive Compositions and Methods of Using Them

SEMICONDUCTOR DEVICE

CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM

ELECTRONIC PACKAGING CONNECTOR AND METHODS FOR ITS PRODUCTION

Method for Producing a Metal Layer on a Substrate and Device

METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT

METHOD FOR FORMING AN OVER PAD METALIZATION (OPM) ON A BOND PAD

Semiconductor Package and Manufacturing Method

CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM