using a powder

Industry

CPC
H01L2224/11442

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11442using a powder

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing chip-on-chip structure comprising sinterted...
- Patent number 10,734,346
- Issue date Aug 4, 2020
- ELPIS TECHNOLOGIES INC.
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder in cavity interconnection technology
- Patent number 9,848,490
- Issue date Dec 19, 2017
- Intel Corporation
- Chuan Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump, method for forming the bump, and method for mounting substrat...
- Patent number 8,962,471
- Issue date Feb 24, 2015
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-component mounted body, electronic component, and circui...
- Patent number 8,921,708
- Issue date Dec 30, 2014
- Panasonic Corporation
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro bump and method for forming the same
- Patent number 8,802,557
- Issue date Aug 12, 2014
- Industrial Technology Research Institute
- Ruoh-Huey Uang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of forming solder on pad on fine pitch PCB and method of fli...
- Patent number 8,794,502
- Issue date Aug 5, 2014
- Electronics and Telecommunications Research Institute
- Yong Sung Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump, method for forming the bump, and method for mounting substrat...
- Patent number 8,492,894
- Issue date Jul 23, 2013
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder in cavity interconnection technology
- Patent number 8,424,748
- Issue date Apr 23, 2013
- Intel Corporation
- Chuan Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro bump and method for forming the same
- Patent number 8,426,964
- Issue date Apr 23, 2013
- Industrial Technology Research Institute
- Ruoh-Huey Uang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Electrically conductive structure on a semiconductor substrate form...
- Patent number 8,067,305
- Issue date Nov 29, 2011
- Ultratech, Inc.
- Arthur W. Zafiropoulo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembled interconnection particles
- Patent number 7,662,708
- Issue date Feb 16, 2010
- Palo Alto Research Center Incorporated
- David K. Fork
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of applying a pattern of particles to a substrate
- Patent number 7,585,549
- Issue date Sep 8, 2009
- Fry's Metals, Inc.
- Brian G. Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE
- Publication number 20190244926
- Publication date Aug 8, 2019
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION TAPE FOR SOLDER INTERCONNECT FORMATION
- Publication number 20140335686
- Publication date Nov 13, 2014
- Xavier F. Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...
- Publication number 20140295619
- Publication date Oct 2, 2014
- Tanaka Kikinzoku Kogyo K.K.
- TOSHINORI OGASHIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER IN CAVITY INTERCONNECTION TECHNOLOGY
- Publication number 20140240943
- Publication date Aug 28, 2014
- Chuan Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING SOLDER ON PAD ON FINE PITCH PCB AND METHOD OF FLI...
- Publication number 20130334291
- Publication date Dec 19, 2013
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro Bump And Method For Forming The Same
- Publication number 20130217224
- Publication date Aug 22, 2013
- Industrial Technology Research Institute
- Ruoh-Huey Uang
- B82 - NANO-TECHNOLOGY
Information Patent Application
SOLDER IN CAVITY INTERCONNECTION TECHNOLOGY
- Publication number 20130206820
- Publication date Aug 15, 2013
- Chuan Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC-COMPONENT MOUNTED BODY, ELECTRONIC COMPONENT, AND CIRCUI...
- Publication number 20130170165
- Publication date Jul 4, 2013
- PANASONIC CORPORATION
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro Bump And Method For Forming The Same
- Publication number 20120273936
- Publication date Nov 1, 2012
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Ruoh-Huey Uang
- B82 - NANO-TECHNOLOGY
Information Patent Application
BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...
- Publication number 20110272802
- Publication date Nov 10, 2011
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder in Cavity Interconnection Technology
- Publication number 20110147440
- Publication date Jun 23, 2011
- Chuan Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrically conductive structure on a semiconductor substrate form...
- Publication number 20100055895
- Publication date Mar 4, 2010
- Arthur W. Zafiropoulo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of providing solder bumps of mixed sizes on a substrate usin...
- Publication number 20080003804
- Publication date Jan 3, 2008
- Ravi Nalla
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Self-assembled interconnection particles
- Publication number 20070023907
- Publication date Feb 1, 2007
- Palo Alto Research Center Incorporated
- David K. Fork
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Deposition and patterning process
- Publication number 20050106329
- Publication date May 19, 2005
- Fry's Metals, Inc.
- Brian G. Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

using a powder

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing chip-on-chip structure comprising sinterted...

Solder in cavity interconnection technology

Bump, method for forming the bump, and method for mounting substrat...

Electronic-component mounted body, electronic component, and circui...

Micro bump and method for forming the same

Method of forming solder on pad on fine pitch PCB and method of fli...

Bump, method for forming the bump, and method for mounting substrat...

Solder in cavity interconnection technology

Micro bump and method for forming the same

Electrically conductive structure on a semiconductor substrate form...

Self-assembled interconnection particles

Method of applying a pattern of particles to a substrate

Patents Applicationslast 30 patents

CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE

LASER ABLATION TAPE FOR SOLDER INTERCONNECT FORMATION

BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...

SOLDER IN CAVITY INTERCONNECTION TECHNOLOGY

METHOD OF FORMING SOLDER ON PAD ON FINE PITCH PCB AND METHOD OF FLI...

Micro Bump And Method For Forming The Same

SOLDER IN CAVITY INTERCONNECTION TECHNOLOGY

ELECTRONIC-COMPONENT MOUNTED BODY, ELECTRONIC COMPONENT, AND CIRCUI...

Micro Bump And Method For Forming The Same

BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...

Solder in Cavity Interconnection Technology

Electrically conductive structure on a semiconductor substrate form...

Method of providing solder bumps of mixed sizes on a substrate usin...

Self-assembled interconnection particles

Deposition and patterning process