Using a reactive gas

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CPC
H05K2203/087

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/087Using a reactive gas

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 11,991,836
- Issue date May 21, 2024
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and method for producing holes in an interposer
- Patent number 11,744,015
- Issue date Aug 29, 2023
- Schott AG
- Oliver Jackl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 11,596,072
- Issue date Feb 28, 2023
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer coatings and methods for depositing polymer coatings
- Patent number 11,419,220
- Issue date Aug 16, 2022
- Europlasma NV
- Samir Loulidi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Desmearing method and desmearing device
- Patent number 11,102,889
- Issue date Aug 24, 2021
- Ushio Denki Kabushiki Kaisha
- Kenichi Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tool and method of reflow
- Patent number 11,000,923
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Yen Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulation of downhole microelectronics and method the same
- Patent number 10,897,824
- Issue date Jan 19, 2021
- Baker Hughes, a GE company, LLC
- Aleksey Reiderman
- E21 - EARTH DRILLING MINING
Information Patent Grant
Laminate film and electrode substrate film, and method of manufactu...
- Patent number 10,752,985
- Issue date Aug 25, 2020
- Sumitomo Metal Mining Co., Ltd.
- Hideharu Okami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 10,485,109
- Issue date Nov 19, 2019
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photocurable composition and method of manufacturing film using the...
- Patent number 9,982,102
- Issue date May 29, 2018
- Canon Kabushiki Kaisha
- Toshiki Ito
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 9,974,191
- Issue date May 15, 2018
- Hitachi Kokusai Electric Inc.
- Yasutoshi Tsubota
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Oxidation of copper in a copper etching solution by the use of oxyg...
- Patent number 9,920,434
- Issue date Mar 20, 2018
- Sigma Engineering AB
- Mats Andersson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tool and method of reflow
- Patent number 9,808,891
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Yen Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 9,769,933
- Issue date Sep 19, 2017
- Hitachi Metals, Ltd.
- Hideyuki Sagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Origami enabled manufacturing systems and methods
- Patent number 9,706,646
- Issue date Jul 11, 2017
- Arizona Board of Regenst acting for and on behalf of Arizona State University
- Hanqing Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metastable gas heating
- Patent number 9,681,557
- Issue date Jun 13, 2017
- Elwha LLC
- Tom Driscoll
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface treatment of hydrophobic ferroelectric polymers for printing
- Patent number 9,666,815
- Issue date May 30, 2017
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic adsorptive belt and method of manufacturing thereof,...
- Patent number 9,487,365
- Issue date Nov 8, 2016
- Canon Components, Inc.
- Osamu Kanome
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Electronic component assembly
- Patent number 9,426,899
- Issue date Aug 23, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Line width protector printed circuit board and method of manufactur...
- Patent number 9,386,706
- Issue date Jul 5, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sung Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrostatic adsorptive belt and method of manufacturing thereof,...
- Patent number 9,233,558
- Issue date Jan 12, 2016
- Canon Components, Inc.
- Osamu Kanome
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of etching metal layer
- Patent number 9,150,969
- Issue date Oct 6, 2015
- Tokyo Electron Limited
- Eiichi Nishimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring board and light emitting device
- Patent number 9,137,890
- Issue date Sep 15, 2015
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for removing seed layer in manufacturing printed circuit boa...
- Patent number 8,957,319
- Issue date Feb 17, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Sung Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode structure and method for forming bump
- Patent number 8,887,383
- Issue date Nov 18, 2014
- Panasonic Corporation
- Yasushi Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for functional printing system
- Patent number 8,795,788
- Issue date Aug 5, 2014
- Eastman Kodak Company
- Israel Schuster
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Resin board to be subjected to ozone treatment, wiring board, and m...
- Patent number 8,784,638
- Issue date Jul 22, 2014
- Toyota Jidosha Kabushiki Kaisha
- Takeshi Bessho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bonding structure manufacturing method, heating and melting treatme...
- Patent number 8,757,474
- Issue date Jun 24, 2014
- Ayumi Industry Co., Ltd.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip mounting resin composition and bump forming resin composi...
- Patent number 8,709,293
- Issue date Apr 29, 2014
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure of connecting printed wiring boards, method of connecting...
- Patent number 8,507,803
- Issue date Aug 13, 2013
- Sumitomo Electric Industries, Ltd.
- Masamichi Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...
- Publication number 20240188224
- Publication date Jun 6, 2024
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRAMICRO CIRCUIT BOARD BASED ON ULTRATHIN ADHESIVELESS FLEXIBLE C...
- Publication number 20210136922
- Publication date May 6, 2021
- SHENZHEN DANBOND TECHNOLOGY CO., LTD
- Ping LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REPAIRING COATED PRINTED CIRCUIT BOARDS
- Publication number 20200260592
- Publication date Aug 13, 2020
- HAMILTON SUNDSTRAND CORPORATION
- Paul Sheedy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCUIT SUBSTRATE, COMPONENT-MOUNTED SUBSTRATE, AND METHODS OF MANU...
- Publication number 20200100360
- Publication date Mar 26, 2020
- Nichia Corporation.
- Masaaki KATSUMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...
- Publication number 20200093007
- Publication date Mar 19, 2020
- Board of Regents, The University of Texas System
- Romil Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER AND METHOD FOR PRODUCING HOLES IN AN INTERPOSER
- Publication number 20200045817
- Publication date Feb 6, 2020
- SCHOTT AG
- Oliver Jackl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATING BY ALD FOR SUPPRESSING METALLIC WHISKERS
- Publication number 20190127853
- Publication date May 2, 2019
- Marko PUDAS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ENCAPSULATION OF DOWNHOLE MICROELECTRONICS
- Publication number 20190132959
- Publication date May 2, 2019
- BAKER HUGHES, A GE COMPANY, LLC
- Aleksey Reiderman
- E21 - EARTH DRILLING MINING
Information Patent Application
COATED ELECTRICAL ASSEMBLY
- Publication number 20190037705
- Publication date Jan 31, 2019
- Semblant Limited
- Shailendra Vikram SINGH
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
POLYMER COATINGS AND METHODS FOR DEPOSITING POLYMER COATINGS
- Publication number 20180279483
- Publication date Sep 27, 2018
- EUROPLASMA NV
- Samir Loulidi
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...
- Publication number 20180124926
- Publication date May 3, 2018
- Board of Regents, The University of Texas System
- Romil Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOOL AND METHOD OF REFLOW
- Publication number 20180050425
- Publication date Feb 22, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Yen Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE FILM AND ELECTRODE SUBSTRATE FILM, AND METHOD OF MANUFACTU...
- Publication number 20170226624
- Publication date Aug 10, 2017
- Sumitomo Metal Mining Co., Ltd.
- Hideharu OKAMI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DESMEAR TREATMENT DEVICE AND DESMEAR TREATMENT METHOD
- Publication number 20170156217
- Publication date Jun 1, 2017
- Ushio Denki Kabushiki Kaisha
- Hiroki HORIBE
- B08 - CLEANING
Information Patent Application
OXIDATION OF COPPER IN A COPPER ETCHING SOLUTION BY THE USE OF OXYG...
- Publication number 20170022616
- Publication date Jan 26, 2017
- SIGMA ENGINEERING AB
- Mats ANDERSSON
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DESMEAR TREATMENT DEVICE
- Publication number 20160330846
- Publication date Nov 10, 2016
- Ushio Denki Kabushiki Kaisha
- Noritaka TAKEZOE
- B08 - CLEANING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20150334849
- Publication date Nov 19, 2015
- Hitachi Kokusai Electric Inc.
- Yasutoshi TSUBOTA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR FORMING PATTERNED COPPER LINES THROUGH ELECTR...
- Publication number 20150034589
- Publication date Feb 5, 2015
- LAM RESEARCH CORPORATION
- Alan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF ETCHING METAL LAYER
- Publication number 20140251945
- Publication date Sep 11, 2014
- TOKYO ELECTRON LIMITED
- Eiichi NISHIMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATME...
- Publication number 20140246481
- Publication date Sep 4, 2014
- Hideyuki ABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND LIGHT EMITTING DEVICE
- Publication number 20140226346
- Publication date Aug 14, 2014
- Shinko Electric Industries Co., Ltd.
- Kazutaka KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERN FORMING APPARATUS AND METHOD, AND METHOD OF MANUFACTURING S...
- Publication number 20140178566
- Publication date Jun 26, 2014
- FUJIFILM CORPORATION
- Jun KODAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FUNCTIONAL PRINTING SYSTEM
- Publication number 20140134326
- Publication date May 15, 2014
- Israel Schuster
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR REMOVING SEED LAYER IN MANUFACTURING PRINTED CIRCUIT BOA...
- Publication number 20140076619
- Publication date Mar 20, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Sung Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER AND METHOD FOR PRODUCING HOLES IN AN INTERPOSER
- Publication number 20130210245
- Publication date Aug 15, 2013
- SCHOTT AG
- Oliver Jackl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding Structure Manufacturing Method, Heating And Melting Treatme...
- Publication number 20130105558
- Publication date May 2, 2013
- AYUMI INDUSTRY CO., LTD.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN BOARD TO BE SUBJECTED TO OZONE TREATMENT, WIRING BOARD, AND M...
- Publication number 20130037513
- Publication date Feb 14, 2013
- Kabushiki Kaisha Toyota Jidoshokki
- Takeshi BESSHO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FLEXIBLE LAMINATE BOARD, PROCESS FOR MANUFACTURE OF THE BOARD, AND...
- Publication number 20120244275
- Publication date Sep 27, 2012
- Masahiko SUZUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING WIRING AND ELECTRODE USING METAL NANO PASTE
- Publication number 20120171366
- Publication date Jul 5, 2012
- Samsung Electro-Mechanics CO., LTD.
- Seon Hee Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Reducing Thin Films on Low Temperature Substrates
- Publication number 20110262657
- Publication date Oct 27, 2011
- Dave S. Pope
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Using a reactive gas

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrical devices with electrodes on softening polymers and method...

Interposer and method for producing holes in an interposer

Electrical devices with electrodes on softening polymers and method...

Polymer coatings and methods for depositing polymer coatings

Desmearing method and desmearing device

Tool and method of reflow

Encapsulation of downhole microelectronics and method the same

Laminate film and electrode substrate film, and method of manufactu...

Electrical devices with electrodes on softening polymers and method...

Photocurable composition and method of manufacturing film using the...

Method of manufacturing semiconductor device, substrate processing...

Oxidation of copper in a copper etching solution by the use of oxyg...

Tool and method of reflow

Printed circuit board and method of manufacturing the same

Origami enabled manufacturing systems and methods

Metastable gas heating

Surface treatment of hydrophobic ferroelectric polymers for printing

Electrostatic adsorptive belt and method of manufacturing thereof,...

Electronic component assembly

Line width protector printed circuit board and method of manufactur...

Electrostatic adsorptive belt and method of manufacturing thereof,...

Method of etching metal layer

Wiring board and light emitting device

Method for removing seed layer in manufacturing printed circuit boa...

Electrode structure and method for forming bump

Method for functional printing system

Resin board to be subjected to ozone treatment, wiring board, and m...

Bonding structure manufacturing method, heating and melting treatme...

Flip-chip mounting resin composition and bump forming resin composi...

Structure of connecting printed wiring boards, method of connecting...

Patents Applicationslast 30 patents

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...

ULTRAMICRO CIRCUIT BOARD BASED ON ULTRATHIN ADHESIVELESS FLEXIBLE C...

METHOD FOR REPAIRING COATED PRINTED CIRCUIT BOARDS

CIRCUIT SUBSTRATE, COMPONENT-MOUNTED SUBSTRATE, AND METHODS OF MANU...

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...

INTERPOSER AND METHOD FOR PRODUCING HOLES IN AN INTERPOSER

COATING BY ALD FOR SUPPRESSING METALLIC WHISKERS

ENCAPSULATION OF DOWNHOLE MICROELECTRONICS

COATED ELECTRICAL ASSEMBLY

POLYMER COATINGS AND METHODS FOR DEPOSITING POLYMER COATINGS

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...

TOOL AND METHOD OF REFLOW

LAMINATE FILM AND ELECTRODE SUBSTRATE FILM, AND METHOD OF MANUFACTU...

DESMEAR TREATMENT DEVICE AND DESMEAR TREATMENT METHOD

OXIDATION OF COPPER IN A COPPER ETCHING SOLUTION BY THE USE OF OXYG...

DESMEAR TREATMENT DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

SYSTEM AND METHOD FOR FORMING PATTERNED COPPER LINES THROUGH ELECTR...

METHOD OF ETCHING METAL LAYER

BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATME...

WIRING BOARD AND LIGHT EMITTING DEVICE

PATTERN FORMING APPARATUS AND METHOD, AND METHOD OF MANUFACTURING S...

METHOD FOR FUNCTIONAL PRINTING SYSTEM

METHOD FOR REMOVING SEED LAYER IN MANUFACTURING PRINTED CIRCUIT BOA...

INTERPOSER AND METHOD FOR PRODUCING HOLES IN AN INTERPOSER

Bonding Structure Manufacturing Method, Heating And Melting Treatme...

RESIN BOARD TO BE SUBJECTED TO OZONE TREATMENT, WIRING BOARD, AND M...

FLEXIBLE LAMINATE BOARD, PROCESS FOR MANUFACTURE OF THE BOARD, AND...

METHOD FOR FORMING WIRING AND ELECTRODE USING METAL NANO PASTE

Method for Reducing Thin Films on Low Temperature Substrates