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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L24/00
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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last 30 patents
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Patent Grant
Semiconductor packages using package in package systems and related...
Patent number
11,984,424
Issue date
May 14, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Inpil Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip stack module and method of fabricating the same
Patent number
11,984,432
Issue date
May 14, 2024
Unity Power Technology Limited
Kuk Fong Yip
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with low parasitic connection to passive device
Patent number
11,973,063
Issue date
Apr 30, 2024
Infineon Technologies AG
Urban Medic
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packaging method and semiconductor package device
Patent number
11,948,911
Issue date
Apr 2, 2024
TONGFU MICROELECTRONICS CO., LTD.
Guoqing Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor device with dual heat dissipation structures
Patent number
11,908,771
Issue date
Feb 20, 2024
Infineon Technologies AG
Jayaganasan Narayanasamy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with solder standoff
Patent number
11,908,780
Issue date
Feb 20, 2024
Texas Instruments Incorporated
Jonathan Almeria Noquil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a contact clip with a contact region ha...
Patent number
11,869,865
Issue date
Jan 9, 2024
Infineon Technologies AG
Thomas Bemmerl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor apparatus and fabrication method for the same
Patent number
11,848,295
Issue date
Dec 19, 2023
Rohm Co., Ltd.
Takukazu Otsuka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and related methods
Patent number
11,830,856
Issue date
Nov 28, 2023
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Chee Hiong Chew
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and processes for increasing semiconductor device reliability
Patent number
11,784,155
Issue date
Oct 10, 2023
Wolfspeed, Inc.
Sung Chul Joo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a metal clip with a solder volume balan...
Patent number
11,769,748
Issue date
Sep 26, 2023
Infineon Technologies AG
Thomas Stoek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip packaging device, chip packaging method, and package chip
Patent number
11,764,184
Issue date
Sep 19, 2023
HOSIN GLOBAL ELECTRONICS CO., LTD
Chen-Nan Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for processing a semiconductor wafer, semiconductor wafer, c...
Patent number
11,756,917
Issue date
Sep 12, 2023
Infineon Technologies Austria AG
Carsten von Koblinski
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density and durable semiconductor device interconnect
Patent number
11,756,923
Issue date
Sep 12, 2023
Infineon Technologies AG
Marian Sebastian Broll
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor module with laser-welded leadframe
Patent number
11,749,633
Issue date
Sep 5, 2023
Hitachi Energy Switzerland AG
Niko Pavlicek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,735,505
Issue date
Aug 22, 2023
Kabushiki Kaisha Toshiba
Hidetoshi Kuraya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,715,676
Issue date
Aug 1, 2023
Amkor Technology Singapore Holding Pte Ltd.
Kenji Nishikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
Patent number
11,710,681
Issue date
Jul 25, 2023
UTAC HEADQUARTERS PTE. LTD.
Tanawan Chaowasakoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ribbon bond solution for reducing thermal stress on an intermittent...
Patent number
11,706,852
Issue date
Jul 18, 2023
Illinois Tool Works Inc.
Marco Carcano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Clip bond semiconductor packages and assembly tools
Patent number
11,676,934
Issue date
Jun 13, 2023
UTAC HEADQUARTERS PTE. LTD.
Albert Louis Bove
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
11,664,288
Issue date
May 30, 2023
Mitsubishi Electric Corporation
Kenta Nakahara
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Semiconductor device with a laser-connected terminal
Patent number
11,664,342
Issue date
May 30, 2023
Fuji Electric Co., Ltd.
Shinji Tada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having wettable lead flank and method of maki...
Patent number
11,581,195
Issue date
Feb 14, 2023
ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
Yan Xun Xue
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and methods of making the same
Patent number
11,557,530
Issue date
Jan 17, 2023
Semiconductor Components Industries, LLC
Swee Har Khor
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal clip with solder volume balancing reservoir
Patent number
11,545,459
Issue date
Jan 3, 2023
Infineon Technologies AG
Thomas Stoek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for fabricating circuit components in matrix batches
Patent number
11,521,862
Issue date
Dec 6, 2022
Chih-liang Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cascode power electronic device packaging method and packaging stru...
Patent number
11,476,242
Issue date
Oct 18, 2022
ULTRABAND TECHNOLOGIES INC.
Tai-Hui Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Space efficient and low parasitic half bridge
Patent number
11,469,164
Issue date
Oct 11, 2022
Infineon Technologies AG
Robert Fehler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Universal surface-mount semiconductor package
Patent number
11,469,205
Issue date
Oct 11, 2022
Adventive International Ltd.
Richard K. Williams
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Soldering a conductor to an aluminum metallization
Patent number
11,450,642
Issue date
Sep 20, 2022
Infineon Technologies AG
Edmund Riedl
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING
Publication number
20240145340
Publication date
May 2, 2024
INFINEON TECHNOLOGIES AG
Jayaganasan Narayanasamy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE...
Publication number
20240145353
Publication date
May 2, 2024
Fuji Electric Co., Ltd.
Tsubasa NAKAMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MONOLITHIC MULTIPLE-CHANNEL PROTECTION DEVICE
Publication number
20240128167
Publication date
Apr 18, 2024
Littelfuse Semiconductor (Wuxi) Co., Ltd
Glenda Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM
Publication number
20240120308
Publication date
Apr 11, 2024
TEXAS INSTRUMENTS INCORPORATED
Kwang-Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME
Publication number
20240105703
Publication date
Mar 28, 2024
Samsung Electronics Co., Ltd.
Jaehyun Lim
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20240105560
Publication date
Mar 28, 2024
ROHM CO., LTD.
Yasuhiro TAHARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240079368
Publication date
Mar 7, 2024
Kabushiki Kaisha Toshiba
Satoshi HATTORI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
Publication number
20240072009
Publication date
Feb 29, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Chee Hiong CHEW
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR APPARATUS AND FABRICATION METHOD FOR THE SAME
Publication number
20240063164
Publication date
Feb 22, 2024
Rohm Co., Ltd.
Takukazu OTSUKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING A METAL CLIP AND RELATED METHODS OF MA...
Publication number
20240055387
Publication date
Feb 15, 2024
INFINEON TECHNOLOGIES AG
Engku Izyan Munirah E Afandi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
Publication number
20240006275
Publication date
Jan 4, 2024
RENESAS ELECTRONICS CORPORATION
Noriko NUMATA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20230411337
Publication date
Dec 21, 2023
Kabushiki Kaisha Toshiba
Kyo TANABIKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR WAFER, CLIP AND SEMICONDUCTOR DEVICE
Publication number
20230411336
Publication date
Dec 21, 2023
Infineon Technologies Austria AG
Carsten von Koblinski
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE
Publication number
20230395555
Publication date
Dec 7, 2023
HYUNDAI MOBIS CO., LTD.
Se Min PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
Publication number
20230369279
Publication date
Nov 16, 2023
STMicroelectronics S.r.l
Thomas GOTTARDI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SILVER SINTERED MOLYBDENUM (SSM) PACKAGING FOR POWER SEMICONDUCTOR...
Publication number
20230352372
Publication date
Nov 2, 2023
McMaster University
Yuhang Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CLIP DESIGN AND METHOD OF CONTROLLING CLIP POSITION
Publication number
20230326901
Publication date
Oct 12, 2023
Semiconductor Components Industries, LLC
Atapol Prajuckamol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20230317672
Publication date
Oct 5, 2023
Kabushiki Kaisha Toshiba
Takeyuki SUZUKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLEX BONDED INTEGRATED CIRCUITS
Publication number
20230299035
Publication date
Sep 21, 2023
META PLATFORMS, INC.
Sandeep Rekhi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POW...
Publication number
20230290765
Publication date
Sep 14, 2023
MICROCHIP TECHNOLOGY INCORPORATED
Justin Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
Publication number
20230268311
Publication date
Aug 24, 2023
Rohm Co., Ltd.
Koshun SAITO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
Publication number
20230245954
Publication date
Aug 3, 2023
Rohm Co., Ltd.
Koshun SAITO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
Publication number
20230245994
Publication date
Aug 3, 2023
STMicroelectronics S.r.l
Mauro MAZZOLA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERTER, MOVING VEHICLE, AND SEMICOND...
Publication number
20230170323
Publication date
Jun 1, 2023
Mitsubishi Electric Corporation
Ryutaro DATE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP STACK MODULE AND METHOD OF FABRICATING THE SAME
Publication number
20230163105
Publication date
May 25, 2023
Unity Power Technology Limited
Kuk Fong YIP
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED CONNECTION OF THE PINS TO THE B...
Publication number
20230154883
Publication date
May 18, 2023
NEXPERIA B.V.
Ricardo Yandoc
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND JIG SET
Publication number
20230154889
Publication date
May 18, 2023
Fuji Electric Co., Ltd.
Manabu ISHIKAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING THE SAME
Publication number
20230134075
Publication date
May 4, 2023
NEXPERIA B.V.
Chi Ho Leung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
Publication number
20230114535
Publication date
Apr 13, 2023
STMicroelectronics S.r.l
Matteo DE SANTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING A METAL CLIP WITH A SOLDER VOLUME BALAN...
Publication number
20230094794
Publication date
Mar 30, 2023
Thomas Stoek
H01 - BASIC ELECTRIC ELEMENTS